Magnetic mesa structures fabricated by reactive ion etching with CO/NH 3 /Xe plasma chemistry for an all-silicon quantum computer

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INSTITUTE OF PHYSICS PUBLISHING Nanotechnology 16 (2005) 990 994 NANOTECHNOLOGY doi:10.1088/0957-4484/16/6/062 Magnetic mesa structures fabricated by reactive ion etching with CO/NH 3 /Xe plasma chemistry for an all-silicon quantum computer Dong F Wang 1,2, Atsushi Takahashi 3, Yoshinori Matsumoto 2,3, Kohei M Itoh 2,3,Yoshihisa Yamamoto 2,4,Takahito Ono 5 and Masayoshi Esashi 6 1 Nanomachining and Nanotribology Laboratory (NNL), Graduate School of Science and Engineering, Ishinomaki Senshu University (isu), Ishinomaki 986-8580, Japan 2 Core Research for Evolution Science and Technology (CREST), Japan Science and Technology Agency (JST), Kawaguchi 332-0012, Japan 3 Department of Applied Physics and Physico-Informatics, Keio University, Yokohama 223-8522, Japan 4 Edward L Ginzton Laboratory, Department of Electrical Engineering and Applied Physics, Stanford University, Stanford, CA 94305-4085, USA 5 Graduate School of Engineering, Tohoku University, Sendai 980-8579, Japan 6 NewIndustry Creation Hatchery Center (NICHe), Tohoku University, Sendai 980-8579, Japan E-mail: wang@isenshu-u.ac.jp and dongfang@mems.mech.tohoku.ac.jp Received 25 August 2004 Published 9 May 2005 Online at stacks.iop.org/nano/16/990 Abstract Micromachining of magnetic materials is becoming a crucial technology for future magnetic systems/devicessuch as high-density magnetic recording heads, high-density patterned media, magnetic quantum devices, and micro-magnetic smart systems. alloy, one of the typical ferromagnetic materials, can be deposited and fabricated using current thin film and micromachining technologies, and it has found various applications in microsensors, microactuators, and microsystems. In our recent work, Ni 45 Fe 55 alloy with the highest saturation magnetic-flux density was selected as the micro-magnet for an all-silicon quantum computer. The micro-magnet was designed to create a large magnetic field gradient and to distinguish 29 nuclear spins arranged as chains in a 28 matrix with Larmor frequencies. This paper reports the micromachining of a Ni 45 Fe 55 alloy mesa structure for an all-silicon quantum computer and the preliminary evaluation of its effectiveness using a magnetic force microscope (MFM) andasuperconducting quantum interference device (SQUID). (Some figures in this article are in colour only in the electronic version) 1. Introduction The use of magnetic materials, with particular emphasis on ferromagnetic materials, in data storage systems, solid-state sensors, actuators, and micro- and nano-systems is gaining increasing interest. Soft ferromagnetic materials have thus far found the most usage in the above applications. However, hard magnetic materials have unique advantages that are driving their integration with micro-electro-mechanical systems (MEMS). 0957-4484/05/060990+05$30.00 2005 IOP Publishing Ltd Printed in the UK 990

Magnetic mesa structures fabricated by RIE with CO/NH 3 /Xe plasma chemistry for an all-silicon quantum computer 28 B 0 = 5 T Micro-magnet 28 cantilever layers Micro-magnet 29 layers Qubit #1 ω 1 28 (I=0) 29 (I=1/2) 28 Dy Magnet licon substrate Qubit #2 ω 2 29 Buffer layer B Figure 1. Schematic of an all-silicon quantum computer (left), and the design of a mesa structure with a micro-magnet (right). The most commonly used ferromagnetic material is alloy (e.g., permalloy, which is typically 81% Ni and 19% Fe) due to its combination of relatively high saturation flux density, low hysteretic losses, and near zero magnetostriction. Welldeveloped deposition and under-development micromachining of the alloy also facilitate the integration with MEMS. Micromachining of alloys is carried out mainly with ion milling, reactive ion etching (RIE), lift-off process, and electroplating [1]. As one of the two dry processes mentioned above, ion milling [2] ismostwidelyused, but it is limited by problems such as sidewall deposition and lack of selectivity. There is a strong interest in the development of plasma etching processes for magnetic multilayer structures, and the creation of long and narrow (thin) submicro- or nano-structures of alloys for practical applications [1, 3]. There are two basic plasma chemistriesthathave beenreported toetchalloys under high ion density conditions, namely Cl 2 -based [3 5] and CO/NH 3 [1, 6]. Cl 2 -based plasma offers good selectivity and anisotropy. However, the high temperature (greater than 200 C) associated with the etching process is likely to cause problems for micro- and nano-systems, and limit the wafer throughput. This process alsoexhibits problems because of relatively non-volatile products and corrosion caused by residual chlorine. The use of non-corrosive CO/NH 3 plasma chemistry offers a high etch rate of up to 65 nm min 1. The physically dominant nature of the etching process (physical sputtering rather than chemical reaction) may cause mask erosion, and thus lead to sloped sidewalls during deep etching [6]. This will limit the anisotropy to no better than 80. In our work, a newly developed CO/NH 3 /Xe plasma chemistry [7] wasused to micromachine Ni 45 Fe 55 alloy to obtain mesa structures down to 500 nm. The fabricated mesa structures can be used as micro-magnets to create a large magnetic field gradient and to distinguish 29 nuclear spins arranged as chains in a 28 matrix with Larmor frequencies for an all-silicon quantum computer. B o = 5 T Width Distance from the surface to homogeneous density region 2 µm Figure 2. An example of simulationresults, calculatedwith a finite element method using magnet Ver6.10 from Infolytica. The contour lines show plots that are the same magnetic flux density. The large magnet field gradient can be obtained along the static magnetic field and the homogeneous magnetic-flux density region exists at a distance about 150 nm from the micro-magnet surface. 2. Concept of an all-silicon quantum computer Figure 1 shows the proposed solid-state implementation of a quantum computer [8]. The quantum computer is to be constructed entirely out of silicon, with no electrical gates or impurities. This is based on the phenomenon exhibited by stable nuclear isotopes of silicon: 95.33% of natural silicon is 28 or 30, which are both spin 0, and 4.67% is 29, which is spin 1/2 andisperfect for being the qubit. Qubits are thus 29 nuclear spins arranged as chains in a 28 matrix with Larmor frequencies, and are distinguished by a large magnetic field gradient created by a nearby micro-magnet. An ensemble of copies, orthogonal to the gradient direction, avoids the difficulty in measuring the nuclear spin of single atoms. The readout could be performed using a magnetic resonance force 991

DFWanget al microscope (MRFM), which detects the oscillations of a thin 28 cantilever in which the rows of 29 atoms are embedded as shown in figure 1. 3. Design of mesa structure with alloy In order to obtain a strong magnetic gradient with homogeneous magnetic-flux density, the design of a micromagnet is carried out using Magnet Ver6.10 from Infolytica. The simulation was carried out with a two-dimensional micromagnet superimposed by a large homogeneous field B 0 of 5 T,andtheresult is shown in figure 2. In the case of 2 µm thickness and 1 µm width, a strong gradient larger than 1.4 Tµm 1,which is necessary for detecting a qubit qubit frequency difference of ω = 2π 2kHz[8], can be obtained at a distance about 150 nm from the upper or lower surface. Areasonable width between two neighbouring micro-magnets should be also considered to reduce mutual cancellation due to magnetic field superimposition. Considering the ensemble measurement of the spin-1/2 qubits within each chain, identical copies of the micro-magnet fabricated on one plane are therefore necessary. This is shown in figure 1 as an example of the micro-magnet design. 4. Micromachining of Ni 45 Fe 55 alloy mesa structure Ti (250 nm) (1) Ti,, Ti Sputtering & Photoresist Coating Ti (8 nm) (2) Photoresist Exposure & Development (3) Ti Etching (ICP RIE) (4) Etching (ICP RIE) (5) Ti Etching (ICP RIE) (1 µm) PPm) nce alloys can be both deposited and fabricated using current thin film technology and micromachining technology, ani 45 Fe 55 alloy with the highest saturation magnetic-flux density was selected as the micro-magnet for the all-silicon quantum computer. The fabrication sequence is briefly described as follows. As shown in figure 3, a(100)-oriented silicon wafer was used as a starting material. A Ti layer of 200 nm thickness, a Ni 45 Fe 55 thin film of 1 µm thickness, and a Ti layer of 8 nm thickness were deposited by ion beam sputtering using appropriate target materials. The top Ti layer was used as the mask material for etching Ni 45 Fe 55 thin film, while the bottom Ti layer was used as an interlayer to improve the bonding strength between the (100) and the Ni 45 Fe 55 thin film. The Ti pattern was defined by conventional photolithography with a UV cure and dry-etched by reactive ion etching (RIE) using SF 6 gas. The patterned Ti mask was then used to etch the Ni 45 Fe 55 thin film in the same chamber using RIE with a mixture gas of CO, NH 3 and Xe. Finally, the (100) was dry-etched using a plasma etcher to obtain the mesa structure. The amount of undercut that occurs during the (100) etch step should be determined by an optimum crosssectional width, that necessarily supports the micro-magnet and, at the same time, provides a homogeneous magnetic-flux density. Figure 4 shows SEM images of the fabricated mesa structure oftheni 45 Fe 55 thin film. The cross-section of the micro-magnet is about 1.2 µm inwidth and 1 µm inheight. A good anisotropy of about 80 was observed for the micromagnet without sidewall deposition, corrosion and residues. It is difficult to achieve a much more ideal profile of close to aright angle (90 ), because the top edges of the patterned Ti mask were slightly etched off through a physically dominant RIEprocess, because of the relatively lower etching selectivity ratio of Ni 45 Fe 55 to Ti in this study. However, chemical (6) Plasma Etching Figure 3. Fabrication sequence of a Ni 45 Fe 55 alloy mesa structure, where CO/NH 3 /Xe plasma chemistry was applied to etching the Ni 45 Fe 55 alloy. reaction was also believed to play a part in the physically dominant RIE process, since an increment of 10% in the etching rate of Ni 45 Fe 55 was observed when adding CO gas into NH 3 gas. The ion-assisted effect of Xe was further found to be helpful in improving the etching selectivity of CO/NH 3 gas. 5. Evaluation results The imaging results obtained using a magnetic force microscope (MFM) qualitatively depict the magnetic field gradient at the corresponding area (see figure 5) of the fabricated Ni 45 Fe 55 stripes. The evaluation result using a superconducting quantum interference device (SQUID) is shown infigure 6 and quantitatively indicates that the saturated magnetization is about 1.5 T when an external magnetic flux density of 5 T is applied. These results mean that there is no obvious deterioration in magnetization of the Ni 45 Fe 55 alloy after CO/NH 3 /Xe plasma etching. In future work, a nuclear magnetic resonance (NMR) measurement will be carried out to further verify the effectiveness of the large magnetic gradient created by the fabricated micro-magnet, which is crucially required for building an all-silicon quantum computer. A detectable Al layer of 5/2 nuclear spins could be applied to this NMR measurement [9]. The detailed consideration is to cover the fabricated micro-magnet with two Al layers separated by one 992

Magnetic mesa structures fabricated by RIE with CO/NH 3 /Xe plasma chemistry for an all-silicon quantum computer Remained thin Ti layer 1.2 µ m Figure 4. SEM images ofthefabricated Ni 45 Fe 55 alloy mesa structure; the cross-section of the micro-magnet is about 1.2 µm inwidth and 1 µm inheight. 2.0 Magnetization (T) 1.5 1.0 0.5 0.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 Applied magnetic flux density (T) Figure 6. Thesaturated magnetization of about 1.5 T was measured by a superconducting quantum interference device (SQUID) when an external magnetic flux density of 5 T was applied. 6. Summary Figure 5. Magnetic gradient image results at the corresponding area observed by a magnetic force microscope (MFM). The MFM thin film tip was magnetized perpendicular to the sample. The observed results were obtained using the fabricated Ni 45 Fe 55 alloy mesa structure magnetized either parallel (A) or perpendicular (B) to the substrate. Ti layer. If a large magnetic field gradient is imposed on the two separated Al layers, two different NMR frequencies, proportional to the imposed magnet field gradient, should be thus detected. Asuccessful fabrication of a Ni 45 Fe 55 alloy mesa structure was presented for an all-silicon quantum computer. Micro-magnet stripes with a good anisotropy of about 80 were achieved using reactive ion etching (RIE) with CO/NH 3 /Xe plasma chemistry. Asaturated magnetization of about 1.5 T, showing no obvious deterioration, was measured with a superconducting quantum interference device (SQUID) for the fabricated Ni 45 Fe 55 micromagnet, when superposed by a B 0 of 5 T. These results represent good progress towards the physical realization of an all-silicon quantum computer. Acknowledgments Part of this work was performed at Venture Business Laboratory (VBL) of Tohoku University, and Keio University. This work is financially supported by Core Research for Evolution Science and Technology (CREST) of the Japan Science and Technology Agency (JST). The Grant-in Aid support from Senshu University is also greatly appreciated. 993

DFWanget al References [1] Nakatani I 1996 Ultramicro fabrications on Fe Ni alloys using electron-beam writing and reactive ion etching IEEE Trans. Magn. 32 4448 [2] Gosan H and Esho S 1981 J. Vac. Sci. Technol. 18 23 [3] Cho H, Lee K P, Hahn Y B, Lambers E S and Pearton S J 2000 Effects of ultraviolet illumination on dry etch rates of -based magnetic multilayers J. Vac. Sci. Technol. A 18 1273 [4] Jung K B, Lambers E S, Childress J R, Pearton S J, Jenson M and Hurst A T 1997 Appl. Phys. Lett. 71 1255 [5] Jung K B, Hong J, Cho H, Caballeco J A, Childress J R, Pearton S J, Jenson M and Hurst A T 1999 Appl. Surf. Sci. 138/139 111 [6] Matsui N, Mashimo K, Egami A, Konishi A, Okada O and Tsukada T 2002 Etching characteristics of magnetic materials (Co, Fe, Ni) using Co/NH 3 gas plasma for hardening mask etching Vacuum 66 479 [7] Abe T, Hong Y G and Esashi M 2003 High-selectivity reactive ion etching with Co/NH 3 /Xe gas for micro/nanostructuring of 20% Fe Ni, Au, Pt, and Cu Proc. IEEE 16th MEMS p 574 [8] Ladd T D, Goldman J R, Yamaguchi F, Yamamoto Y, AbeEand Itoh K M 2002 All-silicon quantum computer Phys. Rev.Lett. 89 017901 [9] Takahashi A, Wang D F, Matsumoto Y and Itoh K M 2004 Development of micro magnet stripes for solid-state NMR quantum computing Proc. SPIE Int. Symp. on Smart Materials, Nano-, and Micro-Smart Systems p81 994