Hybrid Energy Storage Capacitors

Similar documents
Hybrid Energy Storage Capacitors

Hybrid Energy Storage Aluminum Capacitors

Energy Storage Double Layer Capacitors

Ruggedized Electrical Double Layer Energy Storage Capacitors

Electrical Double Layer Energy Storage Capacitors Up to 3 V Operating Voltage

Aluminum Electrolytic Capacitors Power Economic Printed Wiring

Aluminum Electrolytic Capacitors Radial Semi-Professional

Conductive Polymer Aluminum Capacitors SMD (Chip), Low Impedance

Aluminum Electrolytic Capacitors Axial Standard

Aluminum Electrolytic Capacitors SMD (Chip) Long Life Vertical

Aluminum Electrolytic Capacitors Axial High Temperature High Voltage for E.L.B.

Aluminum Electrolytic Capacitors Radial, Enhanced High Temperature, Low Impedance

Aluminum Electrolytic Capacitors Radial Miniature Long Life

Aluminum Electrolytic Capacitors Radial Miniature, Low Impedance

Aluminum Electrolytic Capacitors Power Standard Miniature Snap-In

Aluminum Electrolytic Capacitors Axial Miniature, Long-Life

Aluminum Electrolytic Capacitors Power Long Life Snap-In

Aluminum Capacitors Power Printed Wiring Style

Aluminum Capacitors FEATURES APPLICATIONS PACKAGING

Aluminum Capacitors FEATURES APPLICATIONS PACKAGING

Aluminum Electrolytic Capacitors SMD (Chip), High Temperature, Low Impedance High Vibration Capability

Aluminum Capacitors SMD (Chip) Long Life Vertical

Aluminum Capacitors SMD (Chip), High Temperature

Aluminum Electrolytic Capacitors SMD (Chip), Very Low Z, High Vibration Capability

Double Layer Capacitors

Aluminum Electrolytic Capacitors SMD (Chip), High Temperature, Low Impedance, High Vibration Capability

Aluminum Capacitors SMD (Chip) Long Life Vertical

Filter Inductors, High Current, Radial Leaded

Aluminum Capacitors Power Standard Miniature Snap-In

Aluminum Electrolytic Capacitors Power Long Life Snap-In

Aluminum Capacitors SMD (Chip) Standard. Table 1

SMD Aluminum Solid Capacitors with Conductive Polymer

Aluminum Capacitors Radial Miniature, High Voltage

Lead (Pb)-Bearing Thick Film, Rectangular High Value Chip Resistor

Molded Metal Film High Stability (< 0.25 % after 1000 h) High Temperature (up to 175 C) Precision Resistors

Fusible Carbon Film MELF Resistors

Aluminum Capacitors Power Long Life Snap-In

Pulse Proof Thick Film Chip Resistors

Aluminum Capacitors Radial Very Low Impedance

Lead (Pb)-Free Thick Film, Rectangular High Value Chip Resistor

Double Metallized Polypropylene Film Capacitor Radial AC and Pulse Capacitor

Aluminum Capacitors Axial Miniature, Long-Life

SuperTan Extended (STE) Capacitors, Wet Tantalum Capacitors with Hermetic Seal

5 mm Square Surface Mount Miniature Trimmers Multi-Turn Cermet Sealed

AC and Pulse Film/Foil Capacitors Radial Potted Type

50 W Power Resistor, Thick Film Technology, TO-220

Resin-Molded, Radial-Lead Solid Tantalum Capacitors

AC Line Rated Ceramic Disc Capacitors Class X1, 760 V AC, Class Y1, 500 V AC

Standard Carbon Film Leaded Resistors

Wet Tantalum Capacitors, High Energy, Ultra High Capacitance, -55 C to +125 C Operation

RF Power Feed-Through Capacitors with Conductor Rod, Class 1 Ceramic

Small Signal Fast Switching Diode

4-Line BUS-Port ESD-Protection

Power Resistor for Mounting onto a Heatsink Thick Film Technology

Wet Tantalum Capacitors, High Energy, Ultra High Capacitance, -55 C to +125 C Operation

Surface Mount Multilayer Ceramic Capacitors for Pulse Current Applications

Power Resistor Thick Film Technology

Surface Mount Multilayer Ceramic Chip Capacitors for Ultra Small Commodity Applications

Surface Mount Multilayer Ceramic Chip Capacitors for High Q Commodity Applications

Small Signal Zener Diodes

Power Resistor Thick Film Technology

30 W Power Resistor Thick Film Technology

Surface Mount Multilayer Ceramic Chip Capacitors for Safety Certified Applications

Surface Mount Power Resistor Thick Film Technology

Resin-Molded, Radial-Lead Solid Tantalum Capacitors

RF Power Feed-Through Capacitors with Conductor Rod, Class 1 Ceramic

Lead (Pb)-free Thick Film, Rectangular Commodity Chip Resistors

Small Signal Fast Switching Diode

Green Thick Film Chip Resistors

RF Power Plate Capacitors for Higher Voltages, Class 1 Ceramic

Lead (Pb)-Free Thick Film, Rectangular, Trimmable Chip Resistors

Aluminum Capacitors Solid Axial

Solid Tantalum Chip Capacitors, TANTAMOUNT, Conformal Coated, Maximum CV, Low ESR

3/8" Square Panel Potentiometer Miniature - Cermet - Fully Sealed

Solid Tantalum SMD Capacitors TANTAMOUNT, Hi-Rel COTS, Low ESR, Metal Case

DC Film Capacitors MKT Axial Type

Surface Mount Multilayer Ceramic Chip Capacitor Solutions for High Voltage Applications

FEATURES. Note 138D 306 X0 006 C 2 E3 MODEL CAPACITANCE CAPACITANCE TOLERANCE DC VOLTAGE RATING AT +85 C

Optocoupler, Phototransistor Output, LSOP-4, 110 C Rated, Long Mini-Flat Package

Trench MOS Barrier Schottky Rectifier for PV Solar Cell Bypass Protection

Small Signal Fast Switching Diode FEATURES

AC and Pulse Double Metallized Polypropylene Film Capacitors MMKP Radial Potted Type

DC Film Capacitors MKT Radial Lacquered Type

Dual High-Voltage Trench MOS Barrier Schottky Rectifier

Metallized Polyester Film Capacitors MKT Radial Potted Types

Power Resistor for Mounting onto a Heatsink Thick Film Technology

AC and Pulse Metallized Polypropylene Film Capacitors MKP Radial Potted Type

FEATURES. Heatsink. 1 2 Pin 1 Pin 2

Optocoupler, Phototransistor Output, Single Channel, Half Pitch Mini-Flat Package

Power Resistors for Mounting Onto a Heatsink Thick Film Technology

Silicon PIN Photodiode

Solid-Electrolyte TANTALEX Capacitors, Axial-Leaded, Molded Case

Aluminum Capacitors Radial Low Leakage Current

Solid-Electrolyte TANTALEX Capacitors, Hermetically Sealed, Axial-Lead, CECC Approved

High Current Density Surface Mount Trench MOS Barrier Schottky Rectifier

Single Phase Fast Recovery Bridge (Power Modules), 61 A

Surface Mount Multilayer Ceramic Chip Capacitors DSCC Qualified Type 05007

Green Commodity Thick Film Chip Resistors

Silicon PIN Photodiode, RoHS Compliant

Transcription:

9 HVC ENYCAP Hybrid Energy Storage Capacitors EATURES Polarized energy storage capacitor with high capacity and energy density flexibility:. V (single cell) to.8 V /. V /. V / 7. V / 8. V (multiple cells) Available in stacked throughhole (STH, radial), surfacemount flat (SM) and lay flat configurations (LC) with wire and connectors Useful life: up to h at 8 C No cell balancing necessary Soft and low transientvoltagecontrolled charging characteristic Nonhazardous electrolyte Maintenancefree, no service necessary Evaluation kits for engineering are available under ordering code: MAL999E Material categorization: for definitions of compliance please see www.vishay.com/doc?999 APPLICATIONS Power backup for memory controller, flash backup, RAID systems, SRAM, DRAM Power failure and write cache protection for enterprise SSD and HDD Real time clock power source Burst power support for flash lights, wireless transmitters Backup power for industrial PC s and industrial controls Storage device for energy harvesting Emergency light and micro UPS power source Image is not to scale MARKING The capacitors are marked with the following information: Rated capacitance (in ) Rated voltage (in V) Date code Negative / positive terminal identification PACKAGING Supplied in ESD trays only Revision: Mar8 Document Number: 89 ARE SUBJECT TO SPECIIC DISCLAIMERS, SET ORTH AT www.vishay.com/doc?9

9 HVC ENYCAP QUICK REERENCE DATA DESCRIPTION Nominal case size (Ø D x L in mm) Stacked ThroughHole (STH) Nominal case size (Ø W x L x H in mm) SurfaceMount lat (SM) Nominal case size (W x L x H in mm) Lay lat (LC) Rated capacitance range, C R VALUE SINGLE CELL CELLS CELLS CELLS CELLS CELLS 7 x. x. x x 7 x 7 x. x x. 7 x x x x x x 7. 7 x x. x x. 7 x 7. x 7. x x 7. x x x x. x x. 7 x x x x x x x x. x x. 7 x. x. x x 7. 7 x x x x. x x.. x x.. x x.. x 8 x.. x x.. x 7 x... 9.... 9.... 9.... 9... 9... 9. Tolerance on C R at C % to 8 % Rated voltage, U R. V.8 V. V. V 7. V 8. V Maximum surge voltage, U S (max. s). V. V.8 V. V 8. V 9. V Minimum stored energy Energy density Ws 7 Ws Ws 9 Ws Ws Ws Ws Ws Ws Ws Ws 8 Ws 7 Ws Ws Ws 9 Ws/g to Ws/g Category temperature range. : C to 7 C. /. / 9. : C to 8 C Storage temperature range C to 8 C Ws 87 Ws 7 Ws 7 Ws Ws 9 Ws., Useful life at U R at C: 8 h at 7 C: 8 h at 7 C: h. : at 7 C: h. : at 8 C: h 9. : at 8 C: h at C: h at C: h at C: h Shelf life h at upper category temperature Climatic category IEC 8 / 8 / SELECTION CHART OR C R, U R, AND ORM AT UPPER CATEGORY TEMPERATURE (UCT) C R U R (V) ORM ()..8.. 7. 8. 9 A 7. x. 7. x. 7. x 7. 7. x. 7. x. 7. x. B B 7. x. 7. x. 7. x 7. 7. x. 7. x. 7. x. C 7. x 7. x. D 7. x 7. x. E 7. x. x.. x. x.. x. x. A. x.. x.. x 7.. x.. x.. x. B B. x.. x.. x 7.. x.. x.. x. C. x. x. D. x. x. E. x. x.. x. x.. x. x.. x. x.. x. x.. x. x.. x 8. x.. x. x.. x 7. x. I K G H x x x x 7. x x x x x x 7. x x x x x x 7. x x Revision: Mar8 Document Number: 89 ARE SUBJECT TO SPECIIC DISCLAIMERS, SET ORTH AT www.vishay.com/doc?9

9 HVC ENYCAP DIMENSIONS in millimeters AND AVAILABLE ORMS STACKED THROUGH HOLE CONIGURATION (STH): Examples VERTICAL MOUNT Ø D max. L max. Ø.8 Ø... ( x) ig. orm A: Stacked Through Hole (example cells, pins) () STACKED THROUGH HOLE CONIGURATION (STH): Examples HORIZONTAL MOUNT Ø D max. L max. Ø. ig. orm B: Stacked Through Hole (example cells, pins) ()... ( x) Ø D max. L max. Ø. ( x)... ( x) Note () Bottom and top are not isolated ig. orm B: Stacked Through Hole (example cells, keyed polarity pins) () SURACE MOUNT LAT CONIGURATION (SM): Examples L max..8 max... ( x). ( x). ( x)... ( x) Ø D max. ( x) ig. orm C: Surface Mount lat (single cell, keyed polarity) Revision: Mar8 Document Number: 89 ARE SUBJECT TO SPECIIC DISCLAIMERS, SET ORTH AT www.vishay.com/doc?9

9 HVC ENYCAP.8 max. (including tags thickness). ( x) _. 8.9. ( x) R. (inner radius).. Ø 7. max..7 ( x).. ig. orm D: Surface Mount lat (single cell, keyed polarity). ( x).8 max. Ø D max.... Ø. max.. ( x).. ig. orm D: Surface Mount lat (single cell, keyed polarity). ( x). ( x) ( x).. ( x) Ø D max. ( x).8 max. ig. 7 orm E: Surface Mount lat. ( x) ( x).8 max. H max. ± ( x). ( x) ( x) L max. ig. 8 orm E: Surface Mount lat ( x) ( x). ( x) ( x). ( x).8 max. H max. L max. ig. 9 orm E: Surface Mount lat Revision: Mar8 Document Number: 89 ARE SUBJECT TO SPECIIC DISCLAIMERS, SET ORTH AT www.vishay.com/doc?9

9 HVC ENYCAP www.vishay.com LAY LAT CONIGURATION (LC) WITH CONNECTOR: Example cells in series Red (AWG 8, UL ) Pin : red Ø Dmax. Black (AWG 8, UL ) Pin : black Molex connector; Housing: Terminal: 8. max. Lmax. ig. orm : Lay lat (example for cells) 7 max. Lmax.. max.. ( x). ( x). ( x) ig. orm I: Stacked Through Hole Oval (PCBD).. ( x) 7 max. Lmax..... ( x) ( x) ig. orm K: Stacked Through Hole Oval Horizontal max. max. Lmax... ( x) ( x). ( x) ig. orm G: Stacked Through Hole Oval (PCBD) Revision: Mar8 Document Number: 89 ARE SUBJECT TO SPECIIC DISCLAIMERS, SET ORTH AT www.vishay.com/doc?9

9 HVC ENYCAP max.. L max... ( x).. ( x). ( x) ig. orm H: Stacked Through Hole Oval Horizontal Table DIMENSIONS in millimeters, MASS AND PACKAGING QUANTITIES NOMINAL CASE SIZE ORM Ø D D x L x H (mm) max. L max. L max. H MASS max. (g) 7. x 7. x. A, B, B 7... 7... 7. x 7. x. C 7. 7. 7. 8.. 7. x 7. x. D 7. 7. 7... 7. x 7. x. A, B, B 7.....8 7. x 7. x 7. A, B, B 7. 7. 7.8.. 7. x 7. x. A, B, B 7.....8 7. x 7. x. A, B, B 7..... 7. x 7. x. A, B, B 7..8.8... x. x. A, B, B...... x. x. C... 8... x. x. D...... x. x. A, B, B...... x. x 7. A, B, B. 8. 7.8... x. x. A, B, B...... x. x. A, B, B...... x. x. A, B, B..8.8.. 7. x. x. E 7..8.8 8... x. x. E... 8... x. x. E...8 8.... x. x. E...8 8.... x. x. E...8 8.... x. x. E...8 8.... x. x....... x. x....... x. x....... x 8. x.. 8. 8.... x. x..... 7.. x 7. x.. 7. 7.. 9. x x. I, K 7 x... ±.. x x 7. I, K 7 x. 7. 7. ±.. x x. I, K 7 x. 9. 9. ±.. x x. G, H x.7. ±. 7. x x 7. G, H x 7. 7... x x. G, H x.... x x. G, H x.... x x 7. G, H x 7.8.8 ±.. x x. G, H x.. ±.. Revision: Mar8 Document Number: 89 ARE SUBJECT TO SPECIIC DISCLAIMERS, SET ORTH AT www.vishay.com/doc?9

ELECTRICAL DATA SYMBOL C R UCT DESCRIPTION Rated capacitance, tolerance % / 8 %, measured by constant current discharge method Upper category temperature I L Max. leakage current after h at U R R I Max. internal resistance at khz Note Unless otherwise specified, all electrical values in Table apply at T amb = C, P = 8 kpa to kpa and RH = % to 7 % 9 HVC ENYCAP ORDERING EXAMPLE Hybrid Storage Capacitor /. V Nominal case size: Ø. mm x. mm; orm B Ordering code: MAL99E Table ELECTRICAL DATA AND ORDERING INORMATION U R (V) C R () NOMINAL CASE SIZE Ø D x L D x L x H (mm) CASE CODE OR M (mm) (mm) UCT ( C) I L h (ma) ESR AC () khz () ESR DC () () MIN. STORAGE ENERGY (Ws) PACKAGING QUANTITIES ORDERING CODE STACKED THROUGH HOLE CONIGURATION (STH) VERTICAL MOUNT. 7. x. pin A 7. 7.. 7.. 8 MAL99E.8 7. x. pin A 7. 7... 9. 8 MAL99E. 7. x 7. pin A 7. 7. 7...8 8 MAL99E. 7. x. pin A 7. 7... 8. 8 MAL99E 7. 7. x. pin A 7. 7.. 7.. 8 MAL99E 8. 7. x. pin A 7. 7... 7. 8 MAL99E.. x. pin A. 8... 7. 8 MAL99E.8. x. pin A. 8.... 8 MAL99E.. x 7. pin A. 8..8 7.. 8 MAL99E.. x. pin A. 8... 7. 8 MAL99E 7.. x. pin A. 8... 87. 9 MAL99E 8.. x. pin A. 8.... 9 MAL99E STACKED THROUGH HOLE CONIGURATION (STH) HORIZONTAL MOUNT. 7. x. pin B. 7.. 7.. MAL99E.8 7. x. pin B. 7... 9. MAL99E. 7. x 7. pin B 7. 7. 7...8 9 MAL99E. 7. x. pin B 8.8 7... 8. 9 MAL99E 7. 7. x. pin B 7.. 7.. MAL99E 8. 7. x. pin B. 7... 7. MAL99E.. x. pin B. 8... 7. MAL99E.8. x. pin B.8 8.... MAL99E.. x 7. pin B 8. 8..8 7.. 8 MAL99E.. x. pin B. 8... 7. 9 MAL99E 7.. x. pin B. 8... 87. MAL99E 8.. x. pin B.7 8.... MAL99E. 7. x. pin B.8. 7.. 7.. MAL99E.8 7. x. pin B.. 7... 9. MAL99E. 7. x 7. pin B 7.. 7. 7...8 9 MAL99E. 7. x. pin B.. 7... 8. 9 MAL99E 7. 7. x. pin B.. 7.. 7.. MAL99E 8. 7. x. pin B.. 7... 7. MAL99E.. x. pin B.. 8... 7. MAL99E.8. x. pin B.8. 8.... MAL99E.. x 7. pin B 8.. 8..8 7.. 8 MAL99E.. x. pin B.. 8... 7. 9 MAL99E 7.. x. pin B.. 8... 87. MAL99E 8.. x. pin B.. 8.... MAL99E Revision: Mar8 7 Document Number: 89 ARE SUBJECT TO SPECIIC DISCLAIMERS, SET ORTH AT www.vishay.com/doc?9

9 HVC ENYCAP ELECTRICAL DATA AND ORDERING INORMATION U R (V) C R () NOMINAL CASE SIZE Ø D x L D x L x H (mm) CASE CODE OR M (mm) (mm) UCT ( C) I L h (ma) ESR AC () khz () ESR DC () () MIN. STORAGE ENERGY (Ws) PACKAGING QUANTITIES ORDERING CODE SURACE MOUNT LAT CONIGURATION (SM). 7. x 7. x. pin C 7.. 7.. MAL99E.. x. x. pin C 8... 7. MAL99E. 7. x 7. x. pin D 7.. 7.. MAL99E.. x. x. pin D 8... 7. MAL99E.8 7. x. x. pin E 7... 9. MAL99E.8. x. x. pin E 8.... MAL99E.. x. x. pin E 7. 7...8 7 MAL99E.. x. x. pin E 8..8 7.. MAL99E.. x. x. pin E 7... 8. 7 MAL99E.. x. x. pin E 8... 7. MAL99E LAY LAT CONIGURATION (LC).. x. x. pin 8... 7. MAL99E.8. x. x. pin 8.... MAL99E.. x. x. pin 8..8 7.. MAL99E.. x 8. x. pin 8... 7. MAL99E 7.. x. x. pin 8... 87. MAL99E 8.. x 7. x. pin 8.... MAL99E STACKED THROUGH HOLE OVAL.8 x x. pin I 8.... MAL99E. x x 7. pin I 7. 8..7.. MAL99E. x x. pin I 8.... MAL99E. 9 x x. pin G 8.... MAL99E.8 9 x x 7. pin G 7. 8...9. MAL99E. 9 x x. pin G 8.... MAL99E. 9 x x. pin G. 8...8. MAL99E 7. 9 x x 7. pin G 7. 8..7. 7. MAL997E 8. 9 x x. pin G. 8..9.7 9. MAL998E STACKED THROUGH HOLE OVAL HORIZONTAL.8 x x. pin K 8.... MAL99E. x x 7. pin K 8..7.. MAL99E. x x. pin K 8.... MAL99E. 9 x x. pin H 8.... MAL99E.8 9 x x 7. pin H 8...9. MAL99E. 9 x x. pin H 8.... MAL99E. 9 x x. pin H 8...8. MAL99E 7. 9 x x 7. pin H 8..7. 7. MAL997E 8. 9 x x. pin H 8..9.7 9. MAL998E Notes () ESR AC khz are typical values () ESR DC are typical values Table LOAD CURRENTS AND VOLTAGES C R RECOMMENDED () CHARGE CURRENT MAX. CHARGE CURRENT Note () n... number of cells, permanent operation below lowest discharge voltage is not permitted MAX. DISCHARGE CURRENT LOWEST DISCHARGE VOLTAGE () ma to 8 ma ma ma n x.8 V ma to ma ma 7 ma n x.8 V ma to ma. A. A n x.8 V 9. A to A. A A n x.8 V Revision: Mar8 8 Document Number: 89 ARE SUBJECT TO SPECIIC DISCLAIMERS, SET ORTH AT www.vishay.com/doc?9

9 HVC ENYCAP MEASURING O CHARACTERISTICS CAPACITANCE (C) Capacitance shall be measured by constant current discharge method. DISCHARGE CURRENT AS A UNCTION O RATED CAPACITANCE PARAMETER VALUE UNIT Rated capacitance, C R 9 Discharge current, I D 9 ma U R U U ΔU CAPACITANCE C () I D (A) U R (V) U (V) U (V) t (s) t (s). 8. 8..9 >..8.7.9 >.... >.... > 9.9...7 > 9.9.8.7.9 > 9.9... > 9.9... > 9.9 7..7. > 9.9 8. 8..9 > Note or U see also Table A min t t (s) ig. Diagram for Capacitance Measurement V C Constant current discharger Capacitance value C R is given by discharge current I D, time t and rated voltage U R, according to the following equation: C R U R U U U t t I D C R or I D, U, and U the following definitions have to be used: Table Rated capacitance, in Rated voltage, in V Starting voltage, in V Ending voltage, in V drop at internal resistance, in V Time from start of discharge until voltage U is reached, in s Time from start of discharge until voltage U is reached, in s Discharge current, in A I D A x t s t s = U V U V CAPACITANCE C () I D (A) U R (V) U (V) U (V) t (s) t (s)....7 >..8.7.9 >.... >.... >. 7..7. >. 8. 8..9 >....7 >..8.7.9 >.... >.... >. 7..7. > ig. Test Circuit for Capacitance Measurement INTERNAL RESISTANCE (R I ) AT khz R I U C V = ig. 7 Test Circuit for R I Measurement LEAKAGE CURRENT (I L ) A ma Leakage current shall be measured after min application of rated voltage U R : I L A khz U S V = V ig. 8 Test Circuit for Leakage R S Ω C V C Revision: Mar8 9 Document Number: 89 ARE SUBJECT TO SPECIIC DISCLAIMERS, SET ORTH AT www.vishay.com/doc?9

9 HVC ENYCAP I L (μa) Curve : 9 (. V to 8. V) Curve : (.8 V to. V) Curve : (. V to 8. V) Curve : (. V to 8. V) 7 8 Time (h) ig. 9 Typical Leakage at C as a unction of Time Table VOLTAGE TO BE USED OR SERIES CONNECTION N CELLS IN SERIES U R (V) U (V) U (V)...7.8.7.9...... 7..7. 8. 8..9 DISCHARGE CHARACTERISTICS Backup time of 9 HVC series capacitors depends on minimum memory holding voltage and discharge current (corresponding with the current consumption of the load). or minimum backup times of standard and vertical miniaturized series see ig. to ig. (charging time h and CCCV charging according to table ). Backup time (s) C = (. V to 8. V). Discharge current (ma) ig. Typical Backup Time as a unction of Discharge Backup time (s) C = (. V to 8. V). Discharge current (ma) ig. Typical Backup Time as a unction of Discharge Revision: Mar8 Document Number: 89 ARE SUBJECT TO SPECIIC DISCLAIMERS, SET ORTH AT www.vishay.com/doc?9

9 HVC ENYCAP Backup time (s) Backup time (s) C = (.8 V to. V). Discharge current (ma) ig. Typical Backup Time as a unction of Discharge C = 9 (. V to 8. V) Discharge current (ma) ig. Typical Backup Time as a unction of Discharge CHARGE CHARACTERISTICS Charge cc ma/. V and discharge ma/. V Charge cccv ma/. V min and discharge ma/. V 7. 7. (V). (V)... ig. Constant (CC) with VLimit Charging Method at RT Typical Charge / Discharge Characteristics at RT: /. V 7 8 ig. Constant (CC)Constant (CV) Charging Method at RT Typical Charge / Discharge Characteristics at RT: /. V Charge cc ma/. V and discharge ma/. V Charge cccv ma/. V min and discharge ma/. V (V) (V) ig. Constant (CC) with VLimit Charging Method at RT Typical Charge / Discharge Characteristics at RT: /. V 7 8 9 ig. 7 Constant (CC)Constant (CV) Charging Method at RT Typical Charge / Discharge Characteristics at RT: /. V Note Charge and discharge cycles at room temperature (RT) maximal cycles at room temperature allowed! Revision: Mar8 Document Number: 89 ARE SUBJECT TO SPECIIC DISCLAIMERS, SET ORTH AT www.vishay.com/doc?9

9 HVC ENYCAP Charge cc ma /. V and discharge ma /. V Charge cccv ma /. V min and discharge ma /. V (V) (V) 8 8 ig. 8 Constant (CC) with VLimit Charging Method at RT Typical Charge / Discharge Characteristics at RT: /. V ig. 9 Constant (CC)Constant (CV) Charging Method at RT Typical Charge / Discharge Characteristics at RT: /. V Charge cc ma /. V and discharge A /. V Charge cccv ma /. V min and discharge A /. V (V) (V) 8 8 ig. Constant (CC) with VLimit Charging Method at RT Typical Charge / Discharge Characteristics at RT: 9 /. V ig. Constant (CC)Constant (CV) Charging Method at RT Typical Charge / Discharge Characteristics at RT: 9 /. V Note Charge and discharge cycles at room temperature (RT) maximal cycles at room temperature allowed! CHARGING VOLTAGE AT DIERENT TEMPERATURES OPERATING TEMPERATURE RANGE C UP TO C C UP TO C C UP TO 7 C / 8 C cell U R. V cells U Charge voltage R. V U R U R n () x. x (T[ C] ) cells U R.9 V > cells U R. V Notes Capacitor is polarized, product will be damaged if reverse charged s higher than specified need to be avoided; otherwise reduction of life time, internal gas generation or damage of HVC hybrid capacitor will occur or other operating temperatures, a temperature derating factor has to be considered for correct charging voltage Surge voltage is only allowed a few seconds per day, but not as a charging process () n... number of cells DERATING Working voltage at temperatures above C should be below rated voltage U R. A deratingfactor of. mv/ C per cell is recommended. Revision: Mar8 Document Number: 89 ARE SUBJECT TO SPECIIC DISCLAIMERS, SET ORTH AT www.vishay.com/doc?9

9 HVC ENYCAP PRODUCT AND MOUNTING CHARACTERISTICS Attention: parts are precharged at delivery handle appropriate. At delivery products are precharged and voltage over terminals is near nominal voltage. Short circuiting of product terminals is permitted. Do not short circuit permanently. Short circuiting of charged cells may heat up the cells. or printed circuit board mounting it has to be taken into account, that for certain form factors top and bottom of products may not be insulated. Capacitor disposal methods should be in accordance with local and state regulations. Table. TEST PROCEDURES AND REQUIREMENTS NAME O TEST Notes () n... number of cells () R I equals ESR AC or ESR DC ENYCAP TESTS SUBCLAUSE PROCEDURE (quick reference) Damp heat, steady state. h at C; RH 9 % to 9 %; no voltage applied Endurance.. Useful life.. Storage at upper category temperature.7 Self discharge.. Characteristics at high and low temperature.9 Surge voltage. T amb = 7 C / 8 C; rated voltage U R applied;., : h, 9 : h T amb = 7 C / 8 C; rated voltage U R applied;., : h, 9 : h T amb = 7 C / 8 C; no voltage applied; h h storage at room temperature after application of U R for h Step : reference measurement at C of C, R I, and I L Step : measurement at C Step : measurement at C Step : measurement at 7 C Step : measurement at C Max. s at room temperature U S = n () x. V REQUIREMENTS () C/C: ± % R I x spec. limit I L x spec. limit C/C: ± % R I x spec. limit I L x spec. limit C/C: ± % R I x spec. limit I L x spec. limit C/C: ± % R I x spec. limit I L x spec. limit Remaining voltage: (U R x.9) C/C: ± % of C value R I x the C value I L x the C value No change of parameter! After surge voltage, discharge product below rated voltage Table.: Stacked Through Hole configuration (STH), Surface Mount lat configuration (SM), and Lay lat configuration with Connector TEST PROCEDURES AND REQUIREMENTS NAME O TEST ENYCAP TESTS SUBCLAUSE PROCEDURE (quick reference) Notes Robustness bending limited to ±, force in direction of tab / pin, no twisting allowed Solder bath test: max. allowed case temperature during test is e.g. 8 C or immersion of one () pad only Wave soldering allowed () R I equals ESR AC or ESR DC REQUIREMENTS () Robustness of terminations. Tensile strength; application of load force in pin / tab direction for s: N: for product size Ø 8 mm No breaks N: for product size Ø < 8 mm Resistance to soldering heat. C; s C/C: ± % R I and I L spec. limit Solderability. Solder bath; C; s; one pin immersed 7 % tinning Vibration.8 Hz to Hz;. mm; directions; h per direction C/C: ± % R I and I L spec. limit Revision: Mar8 Document Number: 89 ARE SUBJECT TO SPECIIC DISCLAIMERS, SET ORTH AT www.vishay.com/doc?9

9 HVC ENYCAP SOLDERING As a general principle, temperature and duration shall be the minimum necessary required to ensure good soldering connections. However, the maximum specified soldering time and case temperature should never be exceeded. EVALUATION KIT Evaluation kits are available under ordering code: MAL999E. The engineering kit includes a charge and discharge demo board with different 9 HVC capacitor samples. or further details, please contact hybridstorage@vishay.com. Statements about product lifetime are based on calculations and internal testing. They should only be interpreted as estimations. Also due to external factors, the lifetime in the field application may deviate from the calculated lifetime. In general, nothing stated herein shall be construed as a guarantee of durability. Revision: Mar8 Document Number: 89 ARE SUBJECT TO SPECIIC DISCLAIMERS, SET ORTH AT www.vishay.com/doc?9

Legal Disclaimer Notice Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, UNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, Vishay ), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, noninfringement and merchantability. Statements regarding the suitability of products for certain types of applications are based on Vishay s knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer s technical experts. Product specifications do not expand or otherwise modify Vishay s terms and conditions of purchase, including but not limited to the warranty expressed therein. Except as expressly indicated in writing, Vishay products are not designed for use in medical, lifesaving, or lifesustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. 7 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED Revision: 8eb7 Document Number: 9