FEATURES Polarized aluminium electrolytic capacitors, non-solid, self healing handbook, 2 columns SMD-version, rectangular case, insulated Miniaturized, high CV per unit volume, low height Flexible terminals, reflow and wave solderable Charge and discharge proof Supplied in blister tape on reel. CCB059 Fig. Component outline. APPLICATIONS SMD technology, boards with restricted mounting height General applications, consumer electronics, low profile and lightweight equipment handbook, halfpage longer life 9 CLL CCB004 Decoupling, smoothing, filtering and buffering. QUICK REFERENCE DATA DESCRIPTION VALUE Nominal case sizes (L W H in mm) 8.8.7.9 and.9.7.9 Rated capacitance range, C R 0.47 to 22 µf Tolerance on C R 0 to +50% or ±20% Rated voltage range, U R 6. to 6 V Category temperature range 40 to +85 C Endurance test at 85 C 000 hours Useful life at 85 C 500 hours Useful life at 40 C,.4 I R applied 40000 hours Shelf life at 0 V, 85 C 500 hours Resistance to soldering heat test immersion in solder: 0 s at 260 C or 20 s at 25 C Based on sectional specification IEC 84-8/CECC 200 Climatic category IEC 68 40/085/56 998 Jan 29 86
Selection chart for C R, U R and relevant nominal case sizes (L W H in mm) Preferred types in bold. C R U R (V) (µf) 6. 0 6 25 40 6 0.47 8.8.7.9.0 8.8.7.9 2.2 8.8.7.9.9.7.9. 8.8.7.9.9.7.9 4.7 8.8.7.9.9.7.9 6.8 8.8.7.9.9.7.9 0 8.8.7.9.9.7.9 5.9.7.9 22.9.7.9 SMD 998 Jan 29 87
MECHANICAL DATA handbook, halfpage handbook, halfpage 2 2.9 2 2.9 2.7 2.7 2.7 2.7 4..9 4..9 7.5 9 MGB099-0.8 2.2 MGB00 - a. b. Dimensions in mm. a. Case size 8.8.7.9 mm. b. Case size.9.7.9 mm. Fig.2 Dimensional outlines. PACKAGING QUANTITIES Tape on reel packaging: 0 per reel. MARKING The capacitors are marked (where possible) with the following information: Rated capacitance (in µf) Rated voltage code (see Table ), the U R code letter indicates the position of the decimal point in the capacitance value Name of manufacturer (PHILIPS) sign indicating the cathode. The anode is identified by bevelled edges. Examples for C nom ; U R marking: H22 represents 0.22 µf; 6 V 2G2 represents 2.2 µf; 40 V 22C represents 22 µf; 6. V. Table Rated voltage marking code U R (V) 6. 0 6 25 40 6 Code letter C D E F G H 998 Jan 29 88
MOUNTING The capacitors are designed for automatic placement on printed-circuit boards or hybrid circuits. Optimum dimensions of soldering pads depend upon soldering method, mounting accuracy, print lay-out and/or adjacent components. For recommended pad dimensions, refer to Fig. and Table 2. handbook, full pagewidth G D G D E B A F E B A F SMD C C CCB02 solder land/,,,, solder paste pattern solder resist pattern occupied area tracks or dummy tracks Fig. Recommended pad dimensions for reflow and wave soldering; see Table 2. Table 2 Recommended soldering pad dimensions in mm (placement accuracy ±0.25 mm); see Fig. NOMINAL CASE SIZE L W H FOR REFLOW SOLDERING FOR WAVE SOLDERING (mm) A B C D E F G A B C D E F G 8.8.7.9 9.7.5 2.9 2.5.0 0. 4.4.5 4. 4.7.7 2.9 4.0 8.4.9.7.9 2.9 6.5 2.9 2.5 6.0. 4.4 6.8 7.4 4.7.7 6. 7. 8.4 998 Jan 29 89
handbook, full pagewidth a flow-direction of solder + + c d b + + MGB0 For dimensions a, b, c and d, refer to Table. Flow direction of solder preferably onto side-walls or plus-side of the capacitors. Fig.4 Minimum distances between capacitors on a printed-circuit board for wave soldering. Soldering Table Minimum distances between capacitors; see Fig.4 Soldering conditions are defined by the curve, temperature versus time. The temperature is that measured on the soldering pad during processing. For imum conditions of different soldering methods see Figs 5, 6 and 7. Any temperature/time curve which does not exceed the specified imum curves may be applied. After soldering under imum conditions, some drift of the electrical parameters may occur. Typical behaviour which can be expected under these circumstances is shown in Fig.8. NOMINAL CASE SIZE L W H (mm) Maximum temperature load Table 4 a min (mm) Curing conditions for SMD-glue b min (mm) c min (mm) d min (mm) 8.8.7.9 2 2 6.8 6.8.9.7.9 5 5 6.8 6.8 MAX. T amb ( C) MAX. EXPOSURE TIME (minutes) 25 0 40 50 60 0.5 AS A GENERAL PRINCIPLE, TEMPERATURE AND DURATION SHALL BE THE MINIMUM NECESSARY REQUIRED TO ENSURE GOOD SOLDERING CONNECTIONS. 998 Jan 29 90
280 T PAD o ( C) 260 MBC488 240 220 80 60 40 20 00 80 0 50 00 50 t (s) 250 Fig.5 Maximum temperature load during infrared reflow soldering. SMD 280 T PAD o ( C) 260 MBC489 240 220 80 60 40 20 00 80 0 50 00 50 t (s) 250 Fig.6 Maximum temperature load during vapour phase reflow soldering. 998 Jan 29 9
280 T PAD o ( C) 260 MBC490 240 220 80 60 40 20 00 80 0 50 00 50 t (s) 250 Fig.7 Maximum temperature load during (double-) wave soldering. values ndbook, full pagewidth before soldering C0 C C (%) 4 0 4 8 MGB02 I L0 I L I L0 (%) 00 00 0 without voltage applied with rated voltage applied tan δ 0 tan δ 00 tan δ 0 (%) 00 0 Z 0 Z Z 0 (%) 00 00 soldering & cooling time 0 8 minutes hour 0 hours 00 hours recovery duration Fig.8 Typical drift of electrical parameters after soldering under imum conditions, and subsequent recovery. 998 Jan 29 92
998 Jan 29 9 ELECTRICAL DATA AND ORDERING INFORMATION Unless otherwise specified, all electrical values in Table 5 apply at T amb =20 C, P = 86 to 06 kpa, RH = 45 to 75%. SYMBOL DESCRIPTION C R rated capacitance at 00 Hz (tolerance 0 to +50% or ±20%) I R rated RMS ripple current at 00 Hz, 85 C I L. leakage current after minute at U R I L5. leakage current after 5 minutes at U R Tan δ. dissipation factor at 00 Hz ESR equivalent series resistance at 00 Hz (calculated from tan δ and C R ) Z. impedance at 0 khz Table 5 U R (V) Electrical data and catalogue numbers; preferred types in bold C R 00 Hz (µf) NOMINAL CASE SIZE L W H (mm) CASE CODE I R 00 Hz 85 C (ma) I L min (µa) I L5 5 min (µa) Tan δ 00 Hz ESR 00 Hz (Ω) Z 0 khz (Ω) Ordering example Electrolytic capacitor 085 series 0 µf/6 V; 0/+50% Nominal case size:.9.7.9 mm; Form BR Catalogue number: 2222 085 2509. CATALOGUE NUMBER 2222........ 0/+50% ±20% BLISTER TAPE ON REEL FORM BR BLISTER TAPE ON REEL FORM BR 6. 0.0 8.8.7.9 a 4. 0.0 48 20 085 209 085 609 22.9.7.9 20 6. 0.0 22 9 085 2229 085 6229 0 6.8 8.8.7.9 a 0 4. 0.25 59 24 085 24688 085 64688 5.9.7.9 8 6. 0.25 27 085 2459 085 6459 6 4.7 8.8.7.9 a 9 5.2 0.20 68 26 085 25478 085 65478 0.9.7.9 6 6. 0.20 2 2 085 2509 085 6509 25. 8.8.7.9 a 8 5.2 0.8 87 27 085 268 085 668 6.8.9.7.9 4 6. 0.8 42 085 26688 085 66688 40 2.2 8.8.7.9 a 7 5.2 0.6 20 2 085 27228 085 67228 4.7.9.7.9 7.4 0.6 54 5 085 27478 085 67478 6 0.47 8.8.7.9 a 4 4. 0.0 40 20 085 28477 085 68477.0 8.8.7.9 a 6 4. 0.2 90 55 085 2808 085 6808 2.2.9.7.9 6. 0.4 87 25 085 28228 085 68228..9.7.9 7.4 0.4 68 7 085 288 085 688 Philips Components SMD
Additional electrical data Voltage PARAMETER CONDITIONS VALUE Surge voltage for short periods Reverse voltage U s.5 U R U rev V Current Leakage current after minute at U R I L 0.02C R U R +µa after 5 minutes at U R I L5 0.002C R U R +µa Inductance Equivalent series inductance (ESL) nominal case size 8.8.7.9 mm typ. nh nominal case size.9.7.9 mm typ. nh 998 Jan 29 94
Capacitance (C).2 C C 0.0 MGB0 2 0.8 2 0.6 Curve : 6. V. Curve 2: 25 V. Curve : 6 V. C 0 = capacitance at 20 C, 00 Hz. 0.4 40 20 0 20 40 60 80 00 o Tamb ( C) Fig.9 Typical multiplier of capacitance as a function of ambient temperature. SMD MGB04. C 2 C 0.0 0.9 0.8 2 0.7 Curve : 6. V. Curve 2: 25 V. Curve : 6 V. C 0 = capacitance at 20 C, 00 Hz. 0.6 0 0 2 0 f (Hz) 0 4 Fig.0 Typical multiplier of capacitance as a function of frequency. 998 Jan 29 95
Dissipation factor (tan δ) 0 MGB05 tan δ 2 4 5 6 7 8 9 Curve : 6. V. Curve 2: 0 V. Curve : 6 V. Curve 4: 25 V. Curve 5: 40 V. Curve 6: 6 V,.5 µf to. µf. Curve 7: 6 V, µf. Curve 8: 6 V, 0.22 µf to 0.47 µf. Curve 9: 0. µf. f = 00 Hz. 0 0 2 60 40 20 0 20 40 60 80 00 o Tamb ( C) Fig. Typical tan δ as a function of ambient temperature. 0 MGB06 tan δ 2 4 5 6 Curve : 6. V. Curve 2: 0 V. Curve : 6 V. Curve 4: 25 V. Curve 5: 40 V. Curve 6: 6 V,.5 µf to. µf. Curve 7: 6 V, µf. Curve 8: 6 V, 0.22 µf to 0.47 µf. Curve 9: 0. µf. T amb =20 C. 7 8 9 0 0 2 0 0 2 0 0 4 f (Hz) Fig.2 Typical tan δ as a function of frequency. 0 5 998 Jan 29 96
Impedance (Z) MGB07-0 4 Z ( Ω) 0 2 4 0 2 5 Curve : 0. µf. Curve 2: 0.22 µf. Curve : 0.47 µf. Curve 4: µf. Curve 5: 2.2 µf. Case size 8.8.7.9 mm. T amb =20 C. 0 0 2 0 0 4 0 5 f (Hz) Fig. Typical impedance as a function of frequency. 0 6 SMD 0 Z ( Ω) 0 2 2 4 5 MGB08-6 0 Curve : 2.2 µf. Curve 2:. µf. Curve : 4.7 µf. Curve 4: 6.8 µf. Curve 5: 0 µf. Curve 6: 5 µf. Case size.9.7.9 mm. T amb =20 C. 0 2 0 0 4 0 5 f (Hz) 0 6 Fig.4 Typical impedance as a function of frequency. 998 Jan 29 97
RIPPLE CURRENT AND USEFUL LIFE Table 6 Multiplier of ripple current (I R ) as a function of frequency FREQUENCY I R MULTIPLIER (Hz) U R = 6. to 6 V U R =25to40V U R =6V 50 0.8 0.75 0.7 00.0.0.0 00.2..55 000.5.55.9 000.45.7 2. 0000.5.8 2.5 handbook, full pagewidth I A I R..2. MBC24.0 2.8 2.6 2.4 2.2 lifetime multiplier 2.0.8.6.0 4.0 6.0.0.5 2.0.4.2.0 0.8 0.5 0.0 50 70 20 0 0 5 40 50 60 70 80 90 00 T ( C) amb o () I A = actual ripple current at 00 Hz. I R = rated ripple current at 00 Hz, 85 C. () Useful life at 85 C and I R applied: 500 hours. Fig.5 Multiplier of useful life as a function of ambient temperature and ripple current load. 998 Jan 29 98
SPECIFIC TESTS AND REQUIREMENTS General tests and requirements are specified in this handbook, Section Tests and Requirements. Table 7 Test procedures and requirements NAME OF TEST TEST REFERENCE PROCEDURE (quick reference) REQUIREMENTS Mounting IEC 84-8, subclause 4. Endurance IEC 84-8/ CECC 200, subclause 4.5 shall be performed prior to tests mentioned below; method: reflow or (double-) wave soldering; for imum temperature load refer to Chapter Mounting T amb =85 C; U R applied; 000 hours C/C: ±0% tan δ spec. limit I L5 2 spec. limit C/C: ±20% tan δ 2 spec. limit Z spec. limit I L5 spec. limit Useful life CECC 00, subclause.8. T amb =85 C; U R and I R applied; 500 hours C/C: ±50% tan δ spec. limit Z spec. limit I L5 spec. limit Shelf life (storage at high temperature) IEC 84-8/ CECC 200, subclause 4.7 T amb =85 C; no voltage applied; 500 hours after test: U R to be applied for 0 minutes, 24 to 48 hours before measurement no short or open circuit total failure percentage: % C/C, tan δ, Z: for requirements see Endurance test above I L5 2 spec. limit SMD 998 Jan 29 99