BC337, BC337-25, BC337-4 Amplifier Transistors NPN Silicon Features These are PbFree Devices COLLECTOR MAXIMUM RATINGS Rating Symbol alue Unit 2 BASE Collector Emitter oltage CEO 45 dc Collector Base oltage CBO 5 dc 3 EMITTER Emitter Base oltage EBO 5. dc Collector Current Continuous I C 8 madc Total Device Dissipation @ T A = 25 C Derate above 25 C Total Device Dissipation @ T C = 25 C Derate above 25 C P D 625 5. P D.5 2 mw mw/ C W mw/ C TO92 CASE 29 STYLE 7 Operating and Storage Junction Temperature Range THERMAL CHARACTERISTICS T J, T stg 55 to +5 C Characteristic Symbol Max Unit Thermal Resistance, JunctiontoAmbient R JA 2 C/W Thermal Resistance, JunctiontoCase R JC 83.3 C/W Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 2 2 3 3 STRAIGHT LEAD BULK PACK MARKING DIAGRAM BENT LEAD TAPE & REEL AMMO PACK BC33 7xx AYWW BC337xx = Device Code (Refer to page 4) A = Assembly Location Y = Year WW = Work Week =PbFree Package (Note: Microdot may be in either location) *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. Semiconductor Components Industries, LLC, 29 June, 29 Rev. 7 Publication Order Number: BC337/D
BC337, BC33725, BC3374 ELECTRICAL CHARACTERISTICS (T A = 25 C unless otherwise noted) Characteristic Symbol Min Typ Max Unit OFF CHARACTERISTICS CollectorEmitter Breakdown oltage (I C = ma, I B = ) (BR)CEO 45 dc CollectorEmitter Breakdown oltage (I C = A, I E = ) EmitterBase Breakdown oltage (I E = A, I C = ) Collector Cutoff Current ( CB = 3, I E = ) Collector Cutoff Current ( CE = 45, BE = ) Emitter Cutoff Current ( EB = 4., I C = ) (BR)CES 5 dc (BR)EBO 5. dc I CBO nadc I CES nadc I EBO nadc ON CHARACTERISTICS DC Current Gain (I C = ma, CE =. ) BC337 BC33725 BC3374 (I C = 3 ma, CE =. ) BaseEmitter On oltage (I C = 3 ma, CE =. ) CollectorEmitter Saturation oltage (I C = 5 ma, I B = 5 ma) h FE 6 25 6 63 4 63 BE(on).2 dc CE(sat).7 dc SMALLSIGNAL CHARACTERISTICS Output Capacitance ( CB =, I E =, f =. MHz) CurrentGain Bandwidth Product (I C = ma, CE = 5., f = MHz) C ob 5 pf f T 2 MHz r(t), NORMALIZED EFFECTIE TRANSIENT THERMAL RESISTANCE..7.5.3..7.5.3.2..5.2 D =.5.. SINGLE PULSE SINGLE PULSE JC (t) = (t) JC JC = C/W MAX JA (t) = r(t) JA JA = 375 C/W MAX D CURES APPLY FOR POWER PULSE TRAIN SHOWN READ TIME AT t T J(pk) T C = P (pk) JC (t)..2.5..2.5..5. 2. 5. 2 5 t, TIME (SECONDS) Figure. Thermal Response P (pk) t t2 DUTY CYCLE, D = t /t 2 2
BC337, BC33725, BC3374 dc T A = 25 C. s. ms T J = 35 C dc T C = 25 C CURRENT LIMIT THERMAL LIMIT SECOND BREAKDOWN LIMIT (APPLIES BELOW RATED CEO ). 3. 3 CE, COLLECTOR-EMITTER OLTAGE s Figure 2. Active Region Safe Operating Area h FE, DC CURRENT GAIN CE = T J = 25 C.. I C, COLLECTOR CURRENT (MA) Figure 3. DC Current Gain CE, COLLECTOR-EMITTER OLTAGE (OLTS)..8.6.4 T J = 25 C I C = ma ma 3 ma 5 ma.. I B, BASE CURRENT (ma) Figure 4. Saturation Region, OLTAGE (OLTS)..8.6.4 T A = 25 C BE(sat) @ I C /I B = CE(sat) @ I C /I B = BE(on) @ CE = Figure 5. On oltages, TEMPERATURE COEFFICIENTS (m/ C) θ + - -2 C for CE(sat) B for BE Figure 6. Temperature Coefficients C, CAPACITANCE (pf) C ib C ob. R, REERSE OLTAGE (OLTS) Figure 7. Capacitances 3
BC337, BC33725, BC3374 ORDERING INFORMATION Device Marking Package Shipping BC337G 7 5 Units / Bulk BC337RLG 7 2 / Tape & Reel BC33725G 725 5 Units / Bulk BC33725RLG 725 TO92 2 / Tape & Reel BC33725ZLG 725 (PbFree) 2 / Ammo Box BC3374G 74 5 Units / Bulk BC3374RLG 74 2 / Tape & Reel BC3374ZLG 74 2 / Ammo Box For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8/D. 4
BC337, BC33725, BC3374 PACKAGE DIMENSIONS TO92 (TO226) CASE 29 ISSUE AM R A N B STRAIGHT LEAD BULK PACK NOTES:. DIMENSIONING AND TOLERANCING PER ANSI Y4.5M, 982. 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. P L SEATING INCHES MILLIMETERS PLANE K DIM MIN MAX MIN MAX A.75 5 4.45 5.2 B.7 4.32 5.33 C.25.65 3.8 4.9 D.6.2.47.533 X X D G.45.55.5.39 H.95.5 2.42 2.66 G J.5.2.39.5 H J K.5 --- 2.7 --- C L 5 --- 6.35 --- N.8.5 2.4 2.66 P ---. --- 2.54 SECTION XX R.5 --- 2.93 --- N.35 --- 3.43 --- R T SEATING PLANE P G A X X B K C N BENT LEAD TAPE & REEL AMMO PACK D J SECTION XX NOTES:. DIMENSIONING AND TOLERANCING PER ASME Y4.5M, 994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. MILLIMETERS DIM MIN MAX A 4.45 5.2 B 4.32 5.33 C 3.8 4.9 D.4.54 G 2.4 2.8 J.39.5 K 2.7 --- N 2.4 2.66 P.5 4. R 2.93 --- 3.43 --- STYLE 7: PIN. COLLECTOR 2. BASE 3. EMITTER ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 563, Denver, Colorado 827 USA Phone: 33675275 or 8344386 Toll Free USA/Canada Fax: 33675276 or 83443867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 82829855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 42 33 79 29 Japan Customer Focus Center Phone: 835773385 5 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative BC337/D