MPC-D403 MPC-D404. Ultra-small Peltier Coolers. High impedance Low control current High power efficiency

Similar documents
Design Guidelines for SFT Chipsets Assembly

Analog Technologies. ATEC1 49 Circular TEC Modules

Mitigating Semiconductor Hotspots

TeraLED. Thermal and Radiometric Characterization of LEDs. Technical Specification.

FPF1003A / FPF1004 IntelliMAX Advanced Load Management Products

ASMT-UYBG / ASMT-UYBH / ASMT-UYBJ 0.25W Warm White Power PLCC4 Surface Mount LED Datasheet

ASMT-QYBG / ASMT-QYBH / ASMT-QYBJ 0.5W Warm White Power PLCC4 Surface Mount LED Datasheet

Near 1000 ТЕС models with wide range oftemperature differences and cooling power are availaыe

ASMT-UYBG / ASMT-UYBH 0.25W Warm White Power PLCC4 Surface Mount LED. Datasheet

SM98A Harsh Media Backside Absolute Pressure Series

Supplementary Information for On-chip cooling by superlattice based thin-film thermoelectrics

S150PTD-1A. Technical Data Sheet. 3.2x1.6mm, Phototransistor LED Surface Mount Chip LED. Features: Descriptions: Applications:

Super Bright LEDs, Inc.

High Temperature Difference TEC Modules. Figure 1. The Photo of Actual Sealed TEC modules

Display Surface-mount ELSS-205SYGWA/S530-E2/S290

ASMT-UWBG / ASMT-UWBH / ASMT-UWBJ 0.25W Cool White Power PLCC4 Surface Mount LED Datasheet

Micro-coolers fabricated as a component in an integrated circuit

5mm photodiode PD333-3C/H0/L2

GXUAN V/3W V4 series

Analog Technologies. ATE1-17 TEC Modules

HI-POWER / LED MICRO-08

EYP-DFB TOC03-000x

Prototype 16: 3-omega thermal characterization chip (Device C )

WTSC144.xxx Wire Bonding Temperature Silicon Vertical Capacitor

TTC-1001 Thermal Test Chip Application Information

5.0mm x 5.0mm SURFACE MOUNT LED LAMP. Descriptions. Features. Package Dimensions

SMD Top View LEDs EAPL4014WA1

ATE A TEC Module

Display Surface-mount ELSS-406SURWA/S530-A3/S290

Dr. Michael Müller. Thermal Management for LED applications

LPSC424.xxx Low Profile Silicon Capacitor

Silicon PIN Photodiode Version 1.3 SFH 213

Features of Uni-Thermo

SPP03N60S5 SPB03N60S5

S-5743 A Series 125 C OPERATION HIGH-WITHSTAND VOLTAGE HIGH-SPEED BIPOLAR HALL EFFECT LATCH IC. Features. Applications. Package.

ATE1-65-R8A TEC Module

Application Note 02_01 TELUX

Silicon PIN Photodiode with very short switching time Version 1.3 SFH 229

Small Signal Fast Switching Diode

GXUAN V/16W V3 series

GXUAN V/6W V3 series

SMD B EASV1003WA1. Applications Telecommunication: indicator and backlighting in telephone and fax. Flat backlight for LCD, switch and symbol.

Product description. Developing lighter, more compact and. photoelectric sensor offers completely. ligent features: the sensors feature

TESTING THERMOELECTRIC GENERATORS. Introduction. Test Considerations. Application Note n by Thermoelectric Conversion Systems Limited (TCS)

3mm Photodiode PD204-6B

H21A1 / H21A2 / H21A3 PHOTOTRANSISTOR OPTICAL INTERRUPTER SWITCH

Display Surface-mount ELSS-511UBWA/C470

SGM7SZ00 Small Logic Two-Input NAND Gate

SMD MID Power LED 67-21S/KK5C-HXXXXXXXX2833Z6/2T(EMM)

ieverred.com ieverred.com

LMM-H04 Mass Air Flow Sensor

EAHP1215WA2. Features. Description. Applications

Surface Mount RF Schottky Barrier Diodes. Technical Data. GUx. HSMS-281x Series

Silicon PIN Photodiode

SFH 213 FA. Radial T1 3/4. Applications. Features: Ordering Information. Produktdatenblatt Version 1.1 SFH 213 FA. Silicon PIN Photodiode

TeraLED. Thermal and Radiometric Characterization of LEDs. Technical Specification.

1.0% (1.2 V to 1.45 V output product: 15 mv) 150 mv typ. (3.0 V output product, I OUT = 100 ma)

S-57M1 Series HIGH-SPEED BIPOLAR HALL EFFECT LATCH. Features. Applications. Package. ABLIC Inc., Rev.1.

Small Signal Fast Switching Diode FEATURES

Silicon PIN Photodiode Version 1.3 SFH 203 PFA

70 mv typ. (2.8 V output product, I OUT = 100 ma)

Everlight EZHVD 1W LED Series

4-PIN PHOTOTRANSISTOR OPTOCOUPLERS

Wir schaffen Wissen heute für morgen

3mm Advanced Super Flux LEDs B84-YSC-A1T1U1DH-AM

High-Speed Switching of IR-LEDs (Part I) Background and Datasheet Definition

Technical Data Sheet Silicon PIN Photodiode

Technical Data Sheet 1206 Package Phototransistor

Silicon PIN Photodiode Version 1.3 SFH 206 K

INTEGRATED CIRCUITS. 74LVC138A 3-to-8 line decoder/demultiplexer; inverting. Product specification 1998 Apr 28

SMD MID Power LED 67-22ST/KK3C-HXXXXXXXX5670Z8/2T

High performance DC link capacitor/bus sourcing dual Infineon HybridPACK TM Drive inverters for EV applications

TLF80511TF. Data Sheet. Automotive Power. Low Dropout Linear Fixed Voltage Regulator TLF80511TFV50 TLF80511TFV33. Rev. 1.

Detection of S pole Detection of N pole Active "L" Active "H" Nch open-drain output Nch driver built-in pull-up resistor. f C = 250 khz typ.

SMD MID Power LED 67-22ST/KK2C-HXXXXXXXXA7A9Z3/2T(PRE)

Very low conduction losses Low forward voltage drop Low thermal resistance High specified avalanche capability High integration ECOPACK 2 compliant

High Efficiency Standard Rectifier

Technical Notes. Introduction. PCB (printed circuit board) Design. Issue 1 January 2010

PHOTODARLINGTON OPTICAL INTERRUPTER SWITCH

SGM7SZ32 Small Logic Two-Input OR Gate

Features of Uni-Thermo

RoHS. Specification CUD8DF1A. Drawn Approval Approval. 서식 Rev: 00

OPPA European Social Fund Prague & EU: We invest in your future.

4-PIN PHOTOTRANSISTOR OPTOCOUPLERS

Laird Thermal Systems Application Note. Precise Temperature Control for Medical Analytical, Diagnostic and Instrumentation Equipment

AC INPUT/PHOTOTRANSISTOR OPTOCOUPLERS

EVERLIGHT ELECTRONICS CO., LTD.

*1. Attention should be paid to the power dissipation of the package when the output current is large.

5V/400mA Low Drop Voltage ILE4275 TECHNICAL DATA

OSRAM OSTAR Observation Application Note

Thermal Management of SMT LED Application Note

P-LED EALP03SXARA0-AM. Lead (Pb) Free Product - RoHS Compliant

Applications Photointerrupters IR remote control of hi-fi and TV sets, dimmers, remote controls of various equipment

High Power Infrared Emitter (940 nm) Version 1.3 SFH Features: High Power Infrared LED Emission angle ± 11 High radiant intensity

SFH Radial T1 3/4. Applications. Features: Ordering Information. Produktdatenblatt Version 1.1 SFH 2504

SMD B 23-22B/R7G6C-A30/2A

1μA Ultra-Tiny Shunt Voltage Reference

Applications Photointerrupters IR remote control of hi-fi and TV sets, dimmers, remote controls of various equipment

EVERLIGHT ELECTRONICS CO., LTD.

Thermal Management of Golden DRAGON LED Application Note

Transcription:

MPC-D MPC-D Ultra-small Peltier Coolers High impedance Low control current High power efficiency

MPC-D / D. Introduction. General description The MPC- / D micro chip-sized thermoelectric coolers (TEC) offer a superior performance in the world -smallest available feature-sizes and can be handled in automated volume assembly processes. Thanks to the patented wafer-based thin-film MEMSlike micro-structuring process, the MPC-D / D micro-cooler offer the industry s highest packing density of up to thermoelectric leg pairs per mm. By the high electrical impedance of the MPC-D / D, a very power- and cost-efficient design for the control and drive circuitry can be realized (< cm ). The typical workload operating parameters of the MPC-D / D range between ma to ma for the control current and a related voltage of about. V to. V. The MPC-D / have a maximum cooling power of. W, resp.. W (equivalent to > W/cm ). The MPC-D / D are the ideal choice for today s cost and performance sensitive fiber optic-, photonics- and sensor- applications.. Features High internal electrical resistance MPC-D Small control currents at high-voltage - small footprint control electronics - low-cost peripheral components Power-efficient TEC-controller design - less system energy consumption and heat dissipation Very small feature-size. mm & super thin. mm ( µm) - miniaturization of fiber optic, photonics- and sensor-applications Suitable for high-volume packaging processes Key performance data: T a = C MPC-D MPC-D R elec Ω Ω max. W. W T max Air K K Micropelt TEC assembled in TO-package T max Vacuum K K I max. A. A U max. V. V Footprint. mm. mm Micropelt Datasheet DSLCxve page

MPC-D / D. Applications Fast thermal control with a very small footprint for very low current thermal management MPC-D / D temperature control of low active components Laser diodes / VCSELs Sensors Photonics / Power LED s Example: = mw; T = K; R th = K/W A traditional TEC (electrical resistance. Ω) requires a typical control current of up to A and related voltage of about. V. As result, the power control system requires expensive components, like output stages and filter components (L and C). The power efficiency at high load currents will be limited to approx. % to % due to high parasitic elements within the system. At its typical workload conditions within the control range, the efficiency will be limited to % - %.. Typical application diagram TEC control & drive application can be developed with a very high efficiency, due to the high internal electrical resistance of the MPC-D / D. In comparison with traditional TEC devices, the MPC- D / D operate at much lower control currents at higher voltages, enabling very power-efficient control circuits with less power -consumption & -dissipation. When using the MPC-D / D, the overall system power balance (TEC-control and DC/DC converter) will be > % better compared to a traditional TEC Peltier element. Traditional Peltier coolers do have a typical internal resistance of < Ω and operate at much higher currents and lower voltages, which has negative impact on the system costs and power house holding of the TECcontroller circuitry. Micropelt s MPC-D / D operate at typical control current levels of up to ma and related voltage of up to. V. The control- and power-management circuitry can therefore be optimized to perform with a very high efficiency around %, also during the typical workload conditions with a very small footprint (< cm ). Working with Micropelt s MPC-D / D : High electrical resistance & small control currents Cost-savings for the required drive and filter components Much better energy-balance, both in max. and typical workload of the control range - max range: % vs. % - % - low workload: % vs. % - % Less energy consumption & heat dissipation Smaller footprint for the control & drive electronics Micropelt Datasheet DSLCxve page

MPC-D / D. Electrical parameters MPC-D Ta = C MPC-D Ta = C MPC-D Peltier cooler at C, atmosphere mw mw mw mw mw mw mw mw mw mw............ Peltier cooler at C, atmosphere =. K = mw ΔT =. K max = mw =. K = mw ΔT =. K max = mw............ Peltier cooler at C, atmosphere =. K =. K =. K =. K =. K =. K =. K =. K =. K =. K............ Micropelt Datasheet DSLCxve page

MPC-D / D. Electrical parameters MPC-D Ta = C MPC-D Ta = C MPC-D Peltier cooler at C, atmosphere mw mw mw mw mw mw mw mw mw mw............ Peltier cooler at C, atmosphere =. K = mw ΔT =. K max = mw =. K = mw ΔT =. K max = mw............ Peltier cooler at C, atmosphere =. K =. K =. K =. K =. K =. K =. K =. K =. K =. K............ Micropelt Datasheet DSLCxve page

MPC-D / D. Application information. Product dimensions. Handling & Assembly Recommendations regarding handling of Micropelt s TEC devices are given in the application note Assembly Instructions for Thermoelectric Thin Film Devices.. mm. mm Please contact info@micropelt.com for more information.. mm. mm. Ordering information Engineering samples are available from stock. Currently backside metallization is TiPt.. mm MPC-D. mm MPC-D-M MPC-D-M For high volumes customized metallization is possible. Please contact info@micropelt.com. mm. mm. mm. mm MPC-D. mm. mm Chip ID MPC-D MPC-D Dimensions [mm] cold side hot side bond-pads. x.. x.. x.. x.. x.. x. Thickness [mm] (H).. Micropelt Datasheet DSLCxve page

MPC-D / D. Appendix Thermal Engineering Micropelt s patented micro-structuring process of thermoelectric thin films allows for adaptation of electrical, thermal and physical properties of a cooler to optimally match your system s requirements. One-off charges apply and scale economies may be reduced. Make your choice. Please submit your specification we look forward to exploring your options. Prototyping Micropelt devices are a new class of TECs. If you feel uncomfortable handling and assembling them, let us do that for you first - giving you a head start for a quick launch of your new product. mypelt Simulation Tool For those who want to check device matching with actual application data beforehand we have built our simulation tool mypelt. Please get in touch: info@micropelt.com r EH GmbH Gansacker a Umkirch Germany Office: + / - Mail: info@micropelt.com www.micropelt.com Micropelt Datasheet DSLCxve page