Theory and applications of the Ion Beam Induced Charge (IBIC) technique

Similar documents
Modeling of charge collection efficiency degradation in semiconductor devices induced by MeV ion beam irradiation

A new protocol to evaluate the charge collection efficiency degradation in semiconductor devices induced by MeV ions

Theory and practice of Materials Analysis for Microelectronics with a nuclear microprobe

EE105 Fall 2015 Microelectronic Devices and Circuits: Semiconductor Fabrication and PN Junctions

Lecture 2. Introduction to semiconductors Structures and characteristics in semiconductors

Semiconductor Junctions

Semiconductor Detectors

Semiconductor Physics fall 2012 problems

Lecture 2. Introduction to semiconductors Structures and characteristics in semiconductors

Appendix 1: List of symbols

Section 12: Intro to Devices

Semiconductor Physics Problems 2015

Carriers Concentration and Current in Semiconductors

1 Name: Student number: DEPARTMENT OF PHYSICS AND PHYSICAL OCEANOGRAPHY MEMORIAL UNIVERSITY OF NEWFOUNDLAND. Fall :00-11:00

8.1 Drift diffusion model

Classification of Solids

MENA9510 characterization course: Capacitance-voltage (CV) measurements

Section 12: Intro to Devices

Lecture 2. Introduction to semiconductors Structures and characteristics in semiconductors. Fabrication of semiconductor sensor

For the following statements, mark ( ) for true statement and (X) for wrong statement and correct it.

ECE 340 Lecture 27 : Junction Capacitance Class Outline:

Semiconductor Physics fall 2012 problems

Quiz #1 Practice Problem Set

Semiconductor Detectors are Ionization Chambers. Detection volume with electric field Energy deposited positive and negative charge pairs

Semiconductor Physics and Devices

EECS130 Integrated Circuit Devices

Junction Diodes. Tim Sumner, Imperial College, Rm: 1009, x /18/2006

Lecture 15 OUTLINE. MOSFET structure & operation (qualitative) Review of electrostatics The (N)MOS capacitor

Lecture 15 - The pn Junction Diode (I) I-V Characteristics. November 1, 2005

MTLE-6120: Advanced Electronic Properties of Materials. Semiconductor p-n junction diodes. Reading: Kasap ,

FYS 3028/8028 Solar Energy and Energy Storage. Calculator with empty memory Language dictionaries

Sample Exam # 2 ECEN 3320 Fall 2013 Semiconductor Devices October 28, 2013 Due November 4, 2013

Lecture 15 OUTLINE. MOSFET structure & operation (qualitative) Review of electrostatics The (N)MOS capacitor

ECE 250 Electronic Devices 1. Electronic Device Modeling

Electronic Devices and Circuits Lecture 5 - p-n Junction Injection and Flow - Outline

1st Year-Computer Communication Engineering-RUC. 4- P-N Junction

Solid State Electronics. Final Examination

Lecture 2. Semiconductor Physics. Sunday 4/10/2015 Semiconductor Physics 1-1

PN Junction and MOS structure

Fundamentals of Semiconductor Physics

Solid State Physics SEMICONDUCTORS - IV. Lecture 25. A.H. Harker. Physics and Astronomy UCL

PN Junction

Session 6: Solid State Physics. Diode

Effective masses in semiconductors

Theory of Electrical Characterization of Semiconductors

Semiconductor-Detectors

collisions of electrons. In semiconductor, in certain temperature ranges the conductivity increases rapidly by increasing temperature

Diodes. anode. cathode. cut-off. Can be approximated by a piecewise-linear-like characteristic. Lecture 9-1

This is the 15th lecture of this course in which we begin a new topic, Excess Carriers. This topic will be covered in two lectures.

L03: pn Junctions, Diodes

Chap. 11 Semiconductor Diodes

Final Examination EE 130 December 16, 1997 Time allotted: 180 minutes

Spring Semester 2012 Final Exam

Lecture 7 PN Junction and MOS Electrostatics(IV) Metal Oxide Semiconductor Structure (contd.)

n i exp E g 2kT lnn i E g 2kT

UNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences. EECS 130 Professor Ali Javey Fall 2006

Semiconductor Physics. Lecture 6

Epitaxial SiC Schottky barriers for radiation and particle detection

Energetic particles and their detection in situ (particle detectors) Part II. George Gloeckler

Modelling of Diamond Devices with TCAD Tools

GaN based transistors

Nature of Lesson (Lecture/Tutorial) H3 WK No. Day/ Date. Remarks. Duration. 4.00pm 6.30pm ALL. 2.5 hours. Introduction to Semiconductors Lecture 01

Lecture 18. New gas detectors Solid state trackers

Engineering 2000 Chapter 8 Semiconductors. ENG2000: R.I. Hornsey Semi: 1

Lecture 8 PN Junction and MOS Electrostatics (V) Electrostatics of Metal Oxide Semiconductor Structure (cont.) October 4, 2005

EECS130 Integrated Circuit Devices

Week 3, Lectures 6-8, Jan 29 Feb 2, 2001

OPTI510R: Photonics. Khanh Kieu College of Optical Sciences, University of Arizona Meinel building R.626

pn JUNCTION THE SHOCKLEY MODEL

Review Energy Bands Carrier Density & Mobility Carrier Transport Generation and Recombination

Preliminary measurements of charge collection and DLTS analysis of p + /n junction SiC detectors and simulations of Schottky diodes

16EC401 BASIC ELECTRONIC DEVICES UNIT I PN JUNCTION DIODE. Energy Band Diagram of Conductor, Insulator and Semiconductor:

ESE 372 / Spring 2013 / Lecture 5 Metal Oxide Semiconductor Field Effect Transistor

Lecture 6 PN Junction and MOS Electrostatics(III) Metal-Oxide-Semiconductor Structure

PHYSICAL SCIENCES PART A

Semiconductor X-Ray Detectors. Tobias Eggert Ketek GmbH

Sheng S. Li. Semiconductor Physical Electronics. Second Edition. With 230 Figures. 4) Springer

Avalanche breakdown. Impact ionization causes an avalanche of current. Occurs at low doping

R. Ludwig and G. Bogdanov RF Circuit Design: Theory and Applications 2 nd edition. Figures for Chapter 6

STUDY OF SEMICONDUCTOR DEVICES EXPOSED TO SPATIAL RADIATION

Schottky Rectifiers Zheng Yang (ERF 3017,

ECE-342 Test 2 Solutions, Nov 4, :00-8:00pm, Closed Book (one page of notes allowed)

V BI. H. Föll: kiel.de/matwis/amat/semi_en/kap_2/backbone/r2_2_4.html. different electrochemical potentials (i.e.

n N D n p = n i p N A

Lecture 4 - PN Junction and MOS Electrostatics (I) Semiconductor Electrostatics in Thermal Equilibrium September 20, 2005

Electrical Resistance

Metal Semiconductor Contacts

FREQUENTLY ASKED QUESTIONS February 21, 2017

Introductory Nanotechnology ~ Basic Condensed Matter Physics ~

Lecture 13 - Carrier Flow (cont.), Metal-Semiconductor Junction. October 2, 2002

( )! N D ( x) ) and equilibrium

Semiconductor Physics and Devices

Schottky diodes. JFETs - MESFETs - MODFETs

ECE PN Junctions and Diodes

Unit IV Semiconductors Engineering Physics

6.012 Electronic Devices and Circuits

PHYS485 Materials Physics

Consider a uniformly doped PN junction, in which one region of the semiconductor is uniformly doped with acceptor atoms and the adjacent region is

Chemistry Instrumental Analysis Lecture 8. Chem 4631

EE 5344 Introduction to MEMS CHAPTER 5 Radiation Sensors

Transcription:

Università degli Studi di Torino Scuola di Dottorato in Scienza ed Alta Tecnologia Indirizzo di Fisica ed Astro9isica Ciclo XXV Theory and applications of the Ion Beam Induced Charge (IBIC) technique Candidate 07/03/2013 Jacopo Forneris Tutor Prof. Ettore Vittone Coordinator Prof. Guido Boffetta 3

I may not have gone where I intended to go, but I think I have ended up where I needed to be. Douglas Adams The long dark tea- time of the soul 1988 5

Table of Contents Table of Notations 13 Preface 15 Chapter 1 17 The Ion Beam Induced Charge microscopy 1.1 The interaction of MeV ions with matter 18 1.1.1 Nuclear and electronic energy loss 18 1.1.2 Electron- hole pair creation 19 1.2 The IBIC technique 20 1.2.1 The IBIC set- up 20 1.2.2 The interpretation of the IBIC signal 23 1.3 Applications of IBIC microscopy 24 1.3.1 Characterization of the electronic properties of semiconductors 24 1.3.2 Technological applications and future challenges 28 1.4 Discussion 29 Chapter 2 31 Charge induction in semiconductor detectors 2.1 Charge induction in semiconductor detectors 31 2.1.1 Energy balance of the system 31 2.1.2 The instantaneously induced charge 37 2.1.3 Contribution of the Gunn s term to the induced charge 39 pulse formation 2.1.4 An equation for the weighting potential 44 2.1.5 Weighting Nield and capacitance 46 2.1.6 Contribution of the coupling term to the induced charge 48 pulse formation 7

2.2 Examples and applications 55 2.2.1 Parallel plate capacitor 55 2.2.2 Abrupt Schottky junction in an ideal diode 57 2.3 Induced charge sharing in Gunn s theory 57 2.3.1 DeNinitions and general properties 58 2.3.2 Charge sharing in a N- electrode device 60 2.3.3 Charge sharing for position sensitive radiation detection 67 2.3.4 Topological approach to charge sharing position 68 sensitive detectors Chapter 3 71 Numerical tools for the simulation of IBIC experiments 3.1 Simulation tools and simulation strategies 71 3.2 The adjoint equation method 75 3.2.1 The adjoint equation strategy 75 3.2.2 The adjoint continuity equation 77 3.2.3 CCE pronile of an ideal one- dimensional n- type Schottky junction 83 3.3 The Monte Carlo method 88 3.3.1 The Monte Carlo approach 89 3.3.2 One- dimensional stochastic charge transport simulation 90 3.3.3 Monte Carlo approach in higher dimensional geometries 94 3.3.4 Discussion 98 Chapter 4 99 Modeling of IBIC experiments for the characterization of semiconductor devices 4.1 Lateral IBIC characterization of a 4H- SiC Schottky diode 99 4.1.1 Experimental 100 4.1.2 Modeling 106 4.1.3 Discussion 111 8

Table of contents 4.2 Lateral IBIC characterization of a p- type diamond Schottky diode 112 4.2.1 Experimental 112 4.2.2 Modeling 115 4.2.3 Discussion 119 4.3 Monte Carlo analysis of a charge sharing based p- i- n Si position 120 sensitive particle detector 4.3.1 Experimental 122 4.3.2 Modeling 123 4.3.3 Position sensitive ion detection 129 4.3.4 On the improvement of the position sensitivity resolution 131 4.3.5 Discussion 133 Chapter 5 135 Ion beam microfabrication and IBIC characterization of diamond particle detectors 5.1 IBIC characterization of a diamond particle detector 136 with buried graphitic micro- electrodes 5.1.1 Experimental 137 5.1.2 Modeling 143 5.1.3 Discussion 144 5.2 Charge transport properties in the cap- layer of an ion- beam 145 micro- fabricated diamond detector 5.2.1 Experimental 146 5.2.2 Modeling 150 5.2.3 Discussion 152 5.3 Characterization of an ion- beam- micromachined 153 multi- electrode diamond detector 5.3.1 Samples and electrical characterization 155 5.3.2 IBIC characterization 156 5.3.3 Discussion 161 5.4 Sharing of anomalous polarity pulses in an 162 ion- beam- micromachined multi- electrode diamond detector 9

5.4.1 Theoretical 162 5.4.2 IBIC characterization 165 5.4.3 Discussion 169 Conclusions 171 1. Discussion of results 171 2. Outlook and perspectives 174 Appendix 1 177 Development of an educational software describing the main features of the IBIC technique A1.1 Charged particle in a condenser 178 A1.2 Particles decay in a fully depleted diode 179 A1.3 Charged particles in a partially depleted diode 181 A1.4 Lateral IBIC experiment in a partially depleted diode 182 A1.5 Damaged layer in a fully depleted diode 182 A1.6 Frontal IBIC map of a polycrystalline sample 183 Appendix 2 185 Development of a Monte Carlo parallel code with increased computing performance A2.1 The sequential Monte Carlo code 185 A2.2 Parallel execution of the Monte Carlo algorithm 187 A2.3 Performance of the parallel program execution 190 A2.3.1 Number of simulated ions per generation point 191 A2.3.2 Number of generation points 191 A2.3.3 Work- Pool approach and load- balance 193 A2.3.4 Simulation speed- up 195 A2.4 Discussion 197 10

Table of contents Appendix 3 199 IAEA Coordinated Research Project: Modeling and validation of ion beam induced damage in semiconductors Appendix 4 201 A Monte Carlo software for the simulation of IBIC experiments Appendix 5 207 ScientiQic activities Appendix 6 213 Published papers Acknowledgements 255 Table of References 259 11

Table of Notations Δx Space step on a discrete grid Δt Time step on a discrete grid δn (δp) Re- distribution of electron (hole) volume density due to charge screening within the Debye s length ε Dielectric constant μn (μp) Electron (hole) mobility ρ0 Volume charge density at the electrostatic equilibrium ρ Probe charge density generated within the device volume Σi Surface of the i- th Dirichlet integration boundary τn (τp) Electron (hole) lifetime Lbi Built- in potential ψ0 Electric potential at the electrostatic equilibrium ψ Total electric potential in presence of a volume probe charge density ψ Electric potential associated with the volume probe charge density ψ- ψ0 Ω Device integration volume A Electrode s surface C(V) Voltage dependent capacitance CCE Charge collection ef9iciency Dn (Dp) Electron (hole) diffusivity ds Integration area element on the electrodes surface e Absolute value of the elementary electric charge E0 Electric 9ield at the electrostatic equilibrium E Total electric 9ield in presence of a volume probe charge density E Electric potential associated with the volume probe charge density J0 Electric current density at the electrostatic equilibrium J Electric current density of excess charge carriers ij Current induced at the j- th electrode ij,g Contribution of the Gunn s term to the current induced at the j- th electrode ij,c Contribution of the coupling term to the current induced at the j- th electrode Ln (Lp) Electron (hole) diffusion length n Normal vector to the integration domain s bounding surface ND (NA) Ionized donor (acceptor) volume density n0 (p0) Native volume density of free electrons (holes) at the electrostatic equilibrium ninit (pinit) Native volume density of free electrons (holes) at the electrostatic equilibrium in an unbiased semiconductor n (p ) Excess electron (hole) volume density generated within the device volume n (p) Total (native and generated) electron (hole) volume density n + (p + ) Solution of the adjoint electron (hole) continuity equation P0,n (P0,p) Probability for the electron (hole) to remain at the same position during the time interval `t 13

P±x,n (P±x,p) Pdec,p(x) Q Qe,h Q Qj,0 Qj Qj,G Qj,C q qj qj,g qj,c Rnp s0 t t0 T Vi v w x xb xi xf Nψ 0 /NVj NE 0 /NVj Probability for the electron (hole) to move a step right/left during the time interval `t Probability for the electron (hole) to recombine during the time interval `t Total induced charge vector associated with a multi- electrode device Total induced charge vector associated with electron (hole) motion a multi- electrode device Total charge stored within the device volume Charge bore by the j- th electrode at the electrostatic equilibrium Charge instantaneously bore by the j- th electrode Contribution of the Gunn s term to the charge instantaneously bore by the j- th electrode Contribution of the coupling term to the charge instantaneously bore by the j- th electrode Point- like probe charge density generated within the device volume Total charge induced at the j- th electrode by the probe charge distribution Contribution of the Gunn s term to the total charge induced at the j- th electrode by the probe charge distribution Contribution of the coupling term to the total charge induced at the j- th electrode by the probe charge distribution Linearized Shockley- Read- Hall recombination term Surface charge density at the Neumann boundaries of a device in electrostatic equilibrium Generic time parameter Instant of excess probe charge density generation Integration time associated with the external electronic chain Voltage applied at the i- th electrode Carriers drift velocity vector Depletion region width Generic space coordinates vector Space coordinates vector at the volume boundary surface Space coordinates vector associated with the initial position of a point- like probe charge Space coordinates vector associated with the 9inal position of a point- like probe charge Weighting potential associated with the j- th electrode Weighting 9ield associated with the j- th electrode 14

Preface The Ion Beam Induced Charge (IBIC) microscopy is an analytical technique that exploits the interaction of MeV ion beams, focused down to a micrometer spot size, with matter to investigate the electronic properties of semiconductor materials and devices. The reasons for the increasing utilization of the technique for material characterization are given by the wide availability of linear accelerator machines and by the expertise in ionizing radiation detection and signal ampli9ication, both due to the development of nuclear physics research in the past century. On the other hand, the reliability of the IBIC microscopy lies on the existence of a solid theoretical model, allowing to extract from the experimental results almost all the parameters required for the characterization of the electrical and electronic properties of the sample under test. In my Dissertation, the main features of the IBIC technique are investigated and discussed, together with an overview of the underlying theoretical model and the associated numerical methods for the simulation of experiments. Theoretical and numerical predictions are tested and validated against experimental data, and are exploited both to perform a characterization of the electronic properties of materials, and to face new challenging applications in physics and technology, such as the development of innovative 2- and 3- dimensional position sensitive ionizing radiation detectors. In Chapter 1, the IBIC microscopy will be introduced in its main features, through the discussion of the underlying physical phenomena, such as ion- matter interaction and charge induction mechanisms, and of the relevant applications in physics experiments and technology development. In Chapter 2, a systematic analysis of the induced charge pulse formation at the electrodes of a semiconductor device is presented. The discussion will focus on charge induction theorems, on relevant application examples and on charge sharing phenomena in multi- electrode devices. The implementation of the theoretical results for the development of suitable numerical tools to simulate the IBIC signal formation is discussed in Chapter 3. The resulting model, equipped with valuable simulation techniques, will be then validated and exploited in Chapter 4 in order to model the results of IBIC experiments, aiming at the characterization of emerging wide band- gap semiconductor materials as well as at the optimization of advanced charge sharing particle detection systems. Finally, Chapter 5 is devoted to the analysis and the development of novel fully ion- beam- micromachined 3- dimensional diamond particle detectors with integrated graphitic electrodes. 15