2016-11-09 OSLON Black Flat (IR broad band emitter) - 120 Version 1.0 SFH 4735 Features: SMD epoxy package ThinGaN (UX:3) Wide viewing angle of 120 Improved Corrosion Robustness Low thermal resistance (Max. 9 K/W) Applications Illumination source for spectroscopy Notes Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which can be hazardous to the human eye. Products which incorporate these devices have to follow the safety precautions given in IEC 60825-1 and IEC 62471. Ordering Information Type: Total Radiant Flux Ordering Code Φ e [mw] I F = 350 ma, t p = 20 ms SFH 4735 200 Q65111A9885 Note: Measured with integrating sphere. 2016-11-09 1
Maximum Ratings (T A = 25 C) Parameter Symbol Values Unit Operation and storage temperature range T op ; T stg -40... 85 C Junction temperature T j 125 C Forward current I F 500 ma Surge current (t p 1 ms, D = 0) I FSM 1 A Power consumption P tot 1900 mw ESD withstand voltage (acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM) V ESD 2 kv Thermal resistance junction - soldering point R thjs 9 K / W Note: For the forward current and power consumption please see "maximum permissible forward current" diagram Characteristics (T A = 25 C) Parameter Symbol Values Unit Half angle (typ) ϕ ± 60 Forward voltage (I F = 350 ma, t p = 20 ms) Forward voltage (I F = 500 ma, t p = 100 µs) Reverse current (V R = 5 V) Radiant intensity (I F = 350 ma, t p =20 ms, λ = 350-600nm) Radiant intensity (I F = 350 ma, t p =20 ms, λ = 600-1050nm) Total radiant flux (I F = 350 ma, t p =20 ms, λ = 350-600nm) Total radiant flux (I F = 350 ma, t p =20 ms, λ = 600-1050nm) Spectral flux (I F = 350 ma, t p = 20 ms, λ = 750 nm) Spectral flux (I F = 350 ma, t p = 20 ms, λ = 850 nm) Spectral flux (I F = 350 ma, t p = 20 ms, λ = 950 nm) (typ (max)) V F 2.95 ( 3.5) V (typ (max)) V F 3 ( 3.8) V I R not designed for reverse operation µa I e, typ 59 mw/sr I e, typ 5 mw/sr (typ) Φ e 184 mw (typ) Φ e 16 mw (typ) Φ e, λ 60 µw/nm (typ) Φ e, λ 45 µw/nm (typ) Φ e, λ 45 µw/nm 2016-11-09 2
1) page 11 Relative Spectral Emission I rel = f (λ), T A = 25 C, I F = 350 ma, t p = 10 ms 1) page 11 Relative Total Radiant Flux Φ e /Φ e (350mA) = f (I F ), T A = 25 C, Single pulse, t p = 100 μs Max. Permissible Forward Current I F = f (T S ), R thjs = 9 K/W 1) page 11 Forward Current I F = f(v F ), single pulse, t p = 100 µs, T A = 25 C I F [ma] 1,0 SFH 4736 0,8 0,6 0,4 0,2 : D = 1 : D = 0,5 : D = 0,2 : D = 0,1 : D = 0,05 : D = 0,02 : D = 0,005 0,0 10-6 10-5 10-4 10-3 0,01 0,1 1 10 t p [s] 2016-11-09 3
Radiation Characteristics I rel = f(ϕ), T A = 25 C 1) page 11 40 30 20 10 0 OHL01660 ϕ 1.0 50 0.8 60 70 80 90 0.6 0.4 0.2 0 100 1.0 0.8 0.6 0.4 0 20 40 60 80 100 120 Package Outline Dimensions in mm. Type: SFH 4735 2016-11-09 4
Package OSLON Black Flat Approximate Weight: 0.2 g Package marking see drawing Note: IRED is protected by ESD device which is connected in parallel to chip. Recommended Solder Pad For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. 2016-11-09 5
Recommended Solder Pad Note: For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E 300 C T 250 200 240 C 217 C t P t L T p OHA04525 245 C 150 t S 100 50 25 C 0 0 50 100 150 200 250 s 300 t 2016-11-09 6
Profile Feature Profil-Charakteristik Ramp-up rate to preheat* ) 25 C to 150 C Time t S T Smin to T Smax Ramp-up rate to peak* ) T Smax to T P Liquidus temperature Time above liquidus temperature Symbol Symbol t S T L t L Minimum 60 Pb-Free (SnAgCu) Assembly Recommendation 2 3 K/s 100 120 2 3 217 Maximum 80 100 OHA04612 Unit Einheit s K/s C s Peak temperature Time within 5 C of the specified peak temperature T P - 5 K Ramp-down rate* T P to 100 C Time 25 C to T P T P t P 245 260 10 20 30 All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range 3 6 480 C s K/s s Taping Dimensions in mm. 2016-11-09 7
Tape and Reel 12 mm tape with 2000 pcs. on 180 mm reel W 1 D 0 P 0 P 2 F E W A N 13.0 ±0.25 P 1 Label Direction of unreeling W 2 Direction of unreeling Leader: min. 400 mm * Trailer: min. 160 mm * *) Dimensions acc. to IEC 60286-3; EIA 481-D OHAY0324 Tape dimensions [mm] Tape dimensions in mm W P 0 P 1 P 2 D 0 E F 12 + 0.3 / - 0.1 4 ± 0.1 4 ± 0.1 or 8 ± 0.1 2 ± 0.05 1.5 ± 0.1 1.75 ± 0.1 5.5 ± 0.05 Reel dimensions [mm] Reel dimensions in mm A W N min W 1 W 2max 180 12 60 12.4 + 2 18.4 Barcode-Product-Label (BPL) EX XAM AMP MPL LE OSRAM Opto Semiconductors ors (6P) BATCH ENO: 1234567890 E234 (1T) LOT NO: 1234567890 (9D) D/M: D/C: 1234 (X) PROD NO: 123456789(Q)QTY: AMD) AMD/ D C 9999 (G) GROUP: LX XXXX RoHS Compliant Pack: RXX DEMY BIN1: XX-XX-X-XXX-X ML Temp ST X XXX C X XXX X_X123_1234.1234 _123 234.1234 X XX-XX-X-X X-X-X OHA04563 2016-11-09 8
_< C). _< _< C). 11 0 _< 0144 Bin2: Q-1-20 Bin3: ML 2 2a 220 C R WET Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. Do not eat. Version 1.0 SFH 4735 Dry Packing Process and Materials OSRAM Moisture-sensitive label or print Barcode label Humidity indicator Barcode label Comparator check dot 5% 10% 15% If wet, parts still adequately dry. change desiccant If wet, examine units, if necessary bake units If wet, examine units, if necessary bake units 11 0 (9D) D/C: 0144 Bin2: Q-1-20 Bin3: ML Temp ST 2 220 C R 2a CAUTION This bag contains MOISTURE SENSITIVE OPTO SEMICONDUCTORS LEVEL If blank, see bar code label 1. Shelf life in sealed bag: 24 months at < 40 C and < 90% relative humidity (RH). 2. After this bag is opened, devices that will be subjected to infrared reflow, vapor-phase reflow, or equivalent processing (peak package body temp. If blank, see bar code label a) Mounted within at factory conditions of 30 C/60% RH. Floor time see below b) Stored at 10% RH. 3. Devices require baking, before mounting, if: a) Humidity Indicator Card is > 10% when read at 23 C ± 5 C, or b) 2a or 2b is not met. 4. If baking is required, reference IPC/JEDEC J-STD-033 for bake procedure. Bag seal date (if blank, seal date is identical with date code). Date and time opened: Moisture Level 1 Floor time > 1 Year Moisture Level 4 Floor time 72 Hours Moisture Level 2 Floor time 1 Year Moisture Level 5 Floor time 48 Hours Moisture Level 2a Floor time 4 Weeks Moisture Level 5a Floor time 24 Hours Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours Desiccant Humidity Indicator MIL-I-8835 OSRAM OHA00539 Note: Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card. Regarding dry pack you will find further information in the internet. Here you will also find the normative references like JEDEC. Transportation Packing and Materials Barcode label Barcode label CAUTION This bag contains MOISTURE SENSITIVE OPTO SEMICONDUCTORS LEVEL If blank, see bar code label 1. Shelf life in sealed bag: 24 months at < 40 C and < 90% relative humidity (RH). 2. After this bag is opened, devices that will be subjected to infrared reflow, vapor-phase reflow, or equivalent processing (peak package body temp. If blank, see bar code label a) Mounted within at factory conditions of 30 C/60% RH. Floor time see below b) Stored at 10% RH. 3. Devices require baking, before mounting, if: a) Humidity Indicator Card is > 10% when read at 23 C ± 5 C, or b) 2a or 2b is not met. 4. If baking is required, reference IPC/JEDEC J-STD-033 for bake procedure. Bag seal date (if blank, seal date is identical with date code). Date and time opened: Moisture Level 1 Floor time > 1 Year Moisture Level 4 Floor time 72 Hours Moisture Level 2 Floor time 1 Year Moisture Level 5 Floor time 48 Hours Moisture Level 2a Floor time 4 Weeks Moisture Level 5a Floor time 24 Hours Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours OSRAM Opto Semiconductors (6P) BATCH NO: 210021998 (1T) LOT NO: 123GH1234 Muster (X) PROD NO: 1 (9D) D/C: 0 425 (Q)QTY: 2000 LSY T676 Bin1: P-1-20 Multi TOPLED Temp ST 240 C R 3 260 C RT Additional TEXT R077 DEMY PACKVAR: R18 (G) GROUP: P-1+Q-1 OSRAM Opto Semiconductors (6P) BATCH NO: 210021998 (1T) LOT NO: 123GH1234 Muster (X) PROD NO: 1 0 425 (Q)QTY: 2000 LSY T676 Bin1: P-1-20 Multi TOPLED 240 C R 3 260 C RT Additional TEXT R077 DEMY PACKVAR: R18 (G) GROUP: P-1+Q-1 OSRAM Packing Sealing label OHA02044 Dimensions of transportation box in mm Width Length Height 195 ± 5 195 ± 5 30 ± 5 2016-11-09 9
Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version in the Internet. Packing Please use the recycling operators known to you. We can also help you get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components* may only be used in life-support devices** or systems with the express written approval of OSRAM OS. *) A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or system. **) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be endangered. 2016-11-09 10
Glossary 1) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 2016-11-09 11
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