IXBK55N300 IXBX55N300

Similar documents
IXBK55N300 IXBX55N300

IXBH42N170 IXBT42N170

IXBX50N360HV. = 3600V = 50A V CE(sat) 2.9V. BiMOSFET TM Monolithic Bipolar MOS Transistor High Voltage, High Frequency. Advance Technical Information

IXBT24N170 IXBH24N170

IXBT12N300 IXBH12N300

MMIX4B22N300 V CES. = 3000V = 22A V CE(sat) 2.7V I C90

IXYX40N450HV = 4500V = 40A 3.9V. High Voltage XPT TM IGBT. Preliminary Technical Information TO-247PLUS-HV. Symbol Test Conditions Maximum Ratings T C

MMIX4B12N300 V CES = 3000V. = 11A V CE(sat) 3.2V. High Voltage, High Gain BIMOSFET TM Monolithic Bipolar MOS Transistor

IXXK200N60B3 IXXX200N60B3

IXGK120N60B3 IXGX120N60B3

IXGK75N250 IXGX75N250

IXYL60N450 V CES = 4500V I C110. High Voltage XPT TM IGBT. = 38A V CE(sat) 3.30V. Preliminary Technical Information. (Electrically Isolated Tab)

IXYH10N170CV1 V CES = 1700V I C110. High Voltage XPT TM IGBT w/ Diode. = 10A V CE(sat) 3.8V = 70ns. t fi(typ) Advance Technical Information TO-247 AD

IXGT16N170A IXGH16N170A IXGT16N170AH1 IXGH16N170AH1

IXBT20N360HV IXBH20N360HV

GenX3 TM 1200V IGBT IXGH50N120C3 V CES = 1200V I C110 = 50A. 4.2V t fi(typ) = 64ns. Preliminary Technical Information

IXGH60N60C3 = 600V I C110. GenX3 TM 600V IGBT V CES. = 60A V CE(sat) 2.5V t fi (typ) = 50ns. High Speed PT IGBT for kHz Switching TO-247 AD

IXYH16N250CV1HV. High Voltage XPT TM IGBT w/ Diode V CES I C110. = 2500V = 16A V CE(sat) 4.0V = 250ns. t fi(typ) Advance Technical Information

IXYX25N250CV1 IXYX25N250CV1HV

IXXH75N60C3D1 V CES = 600V I C110. XPT TM 600V IGBT GenX3 TM w/ Diode. = 75A V CE(sat) 2.3V t fi(typ) = 75ns

IXYH82N120C3 V CES = 1200V I C V XPT TM IGBT GenX3 TM. = 82A V CE(sat) 3.2V t fi(typ) = 93ns. High-Speed IGBT for khz Switching

IXYK100N120B3 IXYX100N120B3

IXYH40N120C3D1 V CES

IXXH80N65B4H1 V CES. XPT TM 650V IGBT GenX4 TM w/ Sonic Diode = 650V I C110. = 80A V CE(sat) 2.1V = 52ns. t fi(typ)

IXYH40N120C3 V CES = 1200V I C V XPT TM IGBT GenX3 TM. = 40A V CE(sat) 4.0V t fi(typ) = 38ns. Preliminary Technical Information

XPT TM 600V IGBT GenX3 TM w/diode MMIX1X200N60B3H1 = 600V I C110 V CES. = 72A V CE(sat) 1.7V t fi(typ) = 110ns. Preliminary Technical Information

IXXH60N65B4H1 V CES. XPT TM 650V IGBT GenX4 TM w/ Sonic Diode = 650V I C110. = 60A V CE(sat) 2.2V = 43ns. t fi(typ)

IXGH48N60A3D C

IXGL75N250 = 2500V I C90. High Voltage IGBT V CES. = 65A V CE(sat) 2.9V. Preliminary Technical Information. For Capacitor Discharge.

IXYB82N120C3H1 V CES

IXYA20N120C3HV IXYP20N120C3 IXYH20N120C3

IXYL40N250CV1 V CES. High Voltage XPT TM IGBT w/ Diode = 2500V I C110. = 40A V CE(sat) 4.0V = 134ns. t fi(typ) Advance Technical Information

HiPerFAST TM High Speed IGBT C2-Class w/ Diode

IXXR110N65B4H1. XPT TM 650V GenX4 TM w/ Sonic Diode V CES I C110. = 650V = 70A V CE(sat) 2.10V = 43ns. t fi(typ) (Electrically Isolated Tab)

IXGR72N60B3H1. GenX3 TM 600V IGBT w/ Diode = 600V = 40A. 1.80V t fi(typ) = 92ns. (Electrically Isolated Tab)

IXYN82N120C3H1 V CES

HiPerFAST TM IGBT with Diode

IXYN80N90C3H1 V CES = 900V I C V XPT TM IGBT GenX3 TM w/ Diode. = 70A V CE(sat) 2.7V t fi(typ) = 86ns. Advance Technical Information

HiPerFAST TM IGBT with Diode C2-Class High Speed IGBTs

IXFR18N90P V DSS. Polar TM HiPerFET TM Power MOSFET = 900V I D25 = 10.5A. R DS(on) 300ns. t rr

IXFH42N60P3. Polar3 TM HiperFET TM Power MOSFET. = 600V = 42A 185m. Preliminary Technical Information. R DS(on)

IXTH3N150 V DSS. High Voltage Power MOSFET = 1500V I D25 = 3A 7.3. R DS(on) N-Channel Enhancement Mode. Avalanche Rated. Fast Intrinsic Diode TO-247

IXTK5N250 IXTX5N250 = 2500V = 5A < 8.8Ω. High Voltage Power MOSFET w/ Extended FBSOA. Advance Technical Information. R DS(on)

IXFK120N30T IXFX120N30T

IXGN60N60C2 IXGN60N60C2D1

IXGH 40N60B2D1 IXGT 40N60B2D1. Mounting torque (M3) 1.13/10 Nm/lb.in.

IXTF1N450 = 4500V. High Voltage Power MOSFET = 0.9A 80. R DS(on) (Electrically Isolated Tab) N-Channel Enhancement Mode.

IXFH400N075T2 IXFT400N075T2

IXFK360N15T2 IXFX360N15T2

IXFL32N120P. Polar TM HiPerFET TM Power MOSFET V DSS I D25 = 1200V = 24A. 300ns. Preliminary Technical Information. R DS(on) t rr

IXBH 9N160G. High Voltage BIMOSFET TM Monolithic Bipolar MOS Transistor. I C25 = 9 A V CES = 1600 V V CE(sat) = 4.9 V typ.

TrenchMV TM Power MOSFET

IXTH80N65X2 V DSS. X2-Class Power MOSFET = 650V I D25. = 80A 38m. R DS(on) N-Channel Enhancement Mode Avalanche Rated TO-247 G D S

IXFK78N50P3 IXFX78N50P3

IXTA76N25T IXTP76N25T IXTQ76N25T IXTH76N25T

IXFA7N100P IXFP7N100P IXFH7N100P

IXTT440N04T4HV V DSS

IXFN140N30P. Polar TM Power MOSFET HiPerFET TM = 300V = 110A V DSS I D ns. t rr. N-Channel Enhancement Mode Avalanche Rated Fast Intrinsic Diode

HiPerFAST TM IGBT ISOPLUS247 TM

IXTN600N04T2. TrenchT2 TM GigaMOS TM Power MOSFET = 40V = 600A. N-Channel Enhancement Mode Avalanche Rated Fast Intrinsic Diode

IXTA50N25T IXTQ50N25T

TrenchT2 TM Power MOSFET

TrenchMV TM Power MOSFET

TrenchMV TM Power MOSFET

Trench Gate Power MOSFET

IXTA24N65X2 IXTP24N65X2 IXTH24N65X2

TrenchT2 TM Power MOSFET

IXFR230N20T V DSS. GigaMOS TM Power MOSFET = 200V = 156A. 8.0m t rr. 200ns. (Electrically Isolated Tab)

IXFN56N90P. = 900V = 56A 145m 300ns. Polar TM HiPerFET TM Power MOSFET V DSS I D25. R DS(on) t rr

Advance Technical Information IXFN80N60P3 V DSS. High Power Density Easy to Mount Space Savings Symbol Test Conditions Characteristic Values (T J

IXTA180N10T IXTP180N10T

IXFT100N30X3HV IXFH100N30X3

IXTH30N60L2 IXTQ30N60L2 IXTT30N60L2

MMIX1F520N075T2 = 75V = 500A. 1.6m. TrenchT2 TM GigaMOS TM HiperFET TM Power MOSFET. (Electrically Isolated Tab)

IXTY18P10T IXTA18P10T IXTP18P10T

IXFK300N20X3 IXFX300N20X3

IXTT16N10D2 IXTH16N10D2

IXTY4N65X2 IXTA4N65X2 IXTP4N65X2

IXTN200N10L2 V DSS = 100V = 178A. Linear L2 TM Power MOSFET w/ Extended FBSOA. Advance Technical Information

IGBT with Diode IXSN 80N60BD1 V CES

IXFT50N60P3 IXFQ50N60P3 IXFH50N60P3

IXFA270N06T3 IXFP270N06T3 IXFH270N06T3

IXFK240N25X3 IXFX240N25X3

IXFH42N65X2A V DSS = 650V I D25. X2-Class HiPerFET TM Power MOSFET. = 42A 72m. Advance Technical Information. R DS(on) AEC Q101 Qualified

IXTN660N04T4. TrenchT4 TM Power MOSFET = 40V = 660A. 0.85m. Advance Technical Information

IXFT150N30X3HV IXFH150N30X3 IXFK150N30X3

IXFT170N25X3HV IXFH170N25X3 IXFK170N25X3

IXTN660N04T4. TrenchT4 TM Power MOSFET = 40V = 660A. 0.85m. Advance Technical Information

IXFT60N50P3 IXFQ60N50P3 IXFH60N50P3

PolarHT TM Power MOSFET

PolarHT TM HiPerFET Power MOSFET

IXFT50N60X IXFQ50N60X IXFH50N60X

PolarHT TM Power MOSFET

IXGH48N60C3D1. GenX3 TM 600V IGBT with Diode V CES = 600V I C110. = 48A V CE(sat) 2.5V t fi(typ) = 38ns. High speed PT IGBT for kHz Switching

IXTT76P10THV IXTA76P10T IXTP76P10T IXTH76P10T

Advance Technical Information IXFN110N85X V DSS. High Power Density Easy to Mount Space Savings BV DSS. = 3mA 850 V. = 8mA

V CE(sat) IGBT IXSH/IXSM 40 N V 75 A 2.5 V High Speed IGBT IXSH/IXSM 40 N60A 600 V 75 A 3.0 V

IXTH10N100D2 IXTT10N100D2

IXBT22N300HV IXBH22N300HV

IRGB4056DPbF. n-channel Lead Free Package INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRAFAST SOFT RECOVERY DIODE

Transcription:

High Voltage, High Gain BiMOSFET TM Monolithic Bipolar MOS Transistor V CES = V 11 = 55A V CE(sat) 3.2V TO-264 (IXBK) Symbol Test Conditions Maximum Ratings V CES = 25 C to 15 C V V CGR = 25 C to 15 C, R GE = 1MΩ V V GES Continuous ±25 V V GEM Transient ±35 V 25 = 25 C ( Chip Capability ) 13 A I LRMS = 25 C ( Lead RMS Limit ) A 11 = 11 C 55 A M = 25 C, 1ms A SSOA V GE = 15V, T VJ = 125 C, R G = 2Ω M = 11 A G C E PLUS247 (IXBX) G G C E Tab Tab (RBSOA) Clamped Inductive Load @.8 V CES T SC V GE = 15V, = 125 C, (SCSOA) R G = 1Ω, V CE = 125V, Non-Repetitive 1 μs P C = 25 C 625 W -55... +15 C M 15 C T stg -55... +15 C T L Maximum Lead Temperature for Soldering C T SOLD 1.6 mm (.62 in.) from Case for 1 2 C M d Mounting Torque (TO-264 ) 1.13/1 Nm/lb.in. F C Mounting Force (PLUS247 )../4.5..27 N/lb. Weight TO-264 1 g PLUS247 6 g Symbol Test Conditions Characteristic Values ( = 25 C, Unless Otherwise Specified) Min. Typ. Max. BV CES = 1mA, V GE = V V V GE(th) = 4mA, V CE = V GE 3. 5. V ES V CE = V CES, V GE = V 5 μa = 125 C 3 ma I GES V CE = V, V GE = ± 25V ± na V CE(sat) = 55A, V GE = 15V, Note 1 2.7 3.2 V = 125 C 3.3 V G = Gate E = Emitter C = Collector Tab = Collector Features High Blocking Voltage International Standard Packages Low Conduction Losses High Current Handling Capability MOS Gate Turn-On - Drive Simplicity Advantages Easy to Mount Space Savings High Power Density Applications Uninterruptible Power Supplies (UPS) Switch-Mode and Resonant-Mode Power Supplies Capacitor Discharge Circuits Laser Generators 11 IXYS CORPORATION, All Rights Reserved DS158A(11/11)

Symbol Test Conditions Characteristic Values ( = 25 C Unless Otherwise Specified) Min. Typ. Max. g fs = 55A, V CE = 1V, Note 1 32 5 S C ies 7 pf C oes V CE = 25V, V GE = V, f = 1MHz 275 pf C res 83 pf Q g 335 nc Q ge = 55A, V GE = 15V, V CE = V 47 nc Q gc 13 nc t d(on) 54 ns Resistive Switching Times, T t J = 25 C r 37 ns I t C = 11A, V GE = 15V d(off) 23 ns V t CE = 125V, R G = 2Ω f 268 ns t d(on) 52 ns Resistive Switching Times, = 125 C t r 585 ns I t C = 11A, V GE = 15V d(off) 215 ns V t CE = 125V, R G = 2Ω f 2 ns TO-264 Outline 1 - GATE 2,4 - COLLECTOR 3 - EMITTER R thjc. C/W R thcs.15 C/W Reverse Diode PLUS 247 TM Outline Symbol Test Conditions Characteristic Values ( = 25 C Unless Otherwise Specified) Min. Typ. Max V F I F = 55A, V GE = V, Note 1 2.5 V t rr I F = 28A, V GE = V, -di F /dt = A/μs 1.9 μs I RM V R = V, V GE = V 54 A Note 1: Pulse Test, t μs, Duty Cycle, d 2%. Additional provisions for lead-to-lead isolation are required at V CE >V. IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions. 1 - GATE 2 - COLLECTOR 3 - EMITTER Dim. Millimeter Inches Min. Max. Min. Max. A 4.83 5.21.19.5 A 1 2.29 2.54.9. A 2 1.91 2.16.75.85 b 1.14 1..45.55 b 1 1.91 2.13.75.84 b 2 2.92 3.12.115.123 C.61..24.31 D. 21.34.819.8 E 15.75 16.13.6.635 e 5.45 BSC.215 BSC L 19.81.32.7. L1 3.81 4.32.15.17 Q 5.59 6..2.244 R 4.32 4.83.17.19 IXYS MOSFETs and IGBTs are covered 4,835,592 4,931,844 5,49,961 5,237,481 6,162,665 6,4,65 B1 6,683,344 6,727,585 7,5,734 B2 7,157,338B2 by one or moreof the following U.S. patents: 4,85,72 5,17,58 5,63,37 5,381,25 6,259,123 B1 6,534,343 6,71,5 B2 6,759,692 7,63,975 B2 4,881,16 5,34,796 5,187,117 5,486,715 6,36,728 B1 6,583,55 6,71,463 6,771,478 B2 7,71,537

Fig. 1. Output Characteristics @ = 25ºC V GE = 25V V 15V 25 Fig. 2. Extended Output Characteristics @ = 25ºC V GE = 25V V 15V 1V 15 1V 5 5V.5 1 1.5 2 2.5 3 3.5 4 5V 1 2 3 4 5 6 7 8 Fig. 3. Output Characteristics @ = 125ºC V GE = 25V V 15V 1.8 1.6 V GE = 15V Fig. 4. Dependence of V CE(sat) on Junction Temperature 1V VCE(sat) - Normalized 1.4 1.2 1. = 11A = 55A 5V.8 = 27.5A.5 1 1.5 2 2.5 3 3.5 4 4.5 5.6-5 -25 25 5 75 125 15 - Degrees Centigrade 5.5 Fig. 5. Collector-to-Emitter Voltage vs. Gate-to-Emitter Voltage 1 Fig. 6. Input Admittance 5. = 25ºC 1 1 VCE - Volts 4.5 4. 3.5 3. = 11A 55A = 125ºC 25ºC - ºC 2.5 2. 27.5A 5 6 7 8 9 1 11 12 13 14 15 V GE - Volts 3. 3.5 4. 4.5 5. 5.5 6. 6.5 7. 7.5 8. 8.5 9. V GE - Volts 11 IXYS CORPORATION, All Rights Reserved

Fig. 7. Transconductance 1 Fig. 8. Forward Voltage Drop of Intrinsic Diode 9 = - ºC 1 1 g f s - Siemens 7 5 3 25ºC 125ºC IF - Amperes = 25ºC = 125ºC 1 1 1 1 - Amperes.4.6.8 1. 1.2 1.4 1.6 1.8 2. 2.2 2.4 2.6 2.8 3. V F - Volts VGE - Volts 16 14 12 1 8 6 4 V CE = V = 55A I G = 1mA Fig. 9. Gate Charge Capacitance - PicoFarads, 1, 1, f = 1 MHz Fig. 1. Capacitance C ies C oes 2 C res 5 15 25 35 Q G - NanoCoulombs 1 5 1 15 25 3 35 Fig. 11. Reverse-Bias Safe Operating Area 1 Fig. 12. Maximum Transient Thermal Impedance Z(th)JC - ºC / W.1.1 = 125ºC R G = 2Ω dv / dt < 1V / ns 1 1 2 IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions..1.1.1.1.1 1 1 Pulse Width - Seconds

7 Fig. 13. Resistive Turn-on Rise Time vs. Junction Temperature 7 Fig. 14. Resistive Turn-on Rise Time vs. Collector Current R G = 2Ω, V GE = 15V V CE = 125V = 125ºC t r 5 = 2A = 11A t r 5 R G = 2Ω, V GE = 15V V CE = 125V = 25ºC 25 35 45 55 65 75 85 95 15 115 125 - Degrees Centigrade 1 1 1 2 - Amperes t r 7 7 6 6 6 6 Fig. 15. Resistive Turn-on Switching Times vs. Gate Resistance t r t d(on) - - - - = 125ºC, V GE = 15V V CE = 125V = 2A = 11A 11 9 7 t d(on) t f 3 31 29 2 27 2 25 Fig. 16. Resistive Turn-off Switching Times vs. Junction Temperature = 11A = 2A t f t d(off) - - - - R G = 2Ω, V GE = 15V V CE = 125V 2 2 2 2 1 1 t d(off) 5 5 2 1 5 2 3 4 5 6 7 8 9 1 11 12 13 14 15 R G - Ohms 23 25 35 45 55 65 75 85 95 15 115 125 - Degrees Centigrade Fig. 17. Resistive Turn-off Switching Times vs. Collector Current Fig. 18. Resistive Turn-off Switching Times vs. Gate Resistance 3 3 3 6 t f 3 3 3 2 2 2 t f t d(off) - - - - R G = 2Ω, V GE = 15V V CE = 125V 2 2 2 2 1 t d(off) t f 3 3 2 2 t f t d(off) - - - - = 125ºC, V GE = 15V V CE = 125V = 11A = 2A 5 4 3 2 t d(off) 2 = 125ºC, 25ºC 1 2 1 1 1 1 2 - Amperes 2 2 3 4 5 6 7 8 9 1 11 12 13 14 15 R G - Ohms 11 IXYS CORPORATION, All Rights Reserved

Fig. 19. Forward-Bias Safe Operating Area Fig.. Forward-Bias Safe Operating Area V CE(sat) Limit @ = 25ºC V CE(sat) Limit @ = 75ºC ID - Amperes 1 1 25µs µs 1ms ID - Amperes 1 1 25µs µs 1ms 1ms.1 = 15ºC = 25ºC Single Pulse ms DC.1 = 15ºC = 75ºC Single Pulse 1ms ms DC.1 1 1 1, 1, V DS - Volts.1 1 1 1, 1, V DS - Volts IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions. IXYS REF: B_55N (8T) 11-3-11-C

Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.