Low Loss DuoPack : IGBT in TRENCHSTOP and Fieldstop technology with soft, fast recovery antiparallel Emitter Controlled HE diode Features: Very low V CE(sat) 1.5V (typ.) Maximum Junction Temperature 175 C Short circuit withstand time 5 s TRENCHSTOP and Fieldstop technology for 600V applications offers : very tight parameter distribution high ruggedness, temperature stable behavior very high switching speed Low EMI Very soft, fast recovery antiparallel Emitter Controlled HE diode Qualified according to JEDEC 1 for target applications Pbfree lead plating; RoHS compliant Complete product spectrum and PSpice Models : http://www.infineon.com/igbt/ C G E PGTO2203 (FullPak) Applications Washing Machine Air Condition Inverter and Variable Speed Drive Type V CE I C V CE(sat),Tj=25 C T j,max Marking Code Package 600V 1.5V 175 C K10T60 PGTO2203 (FullPAK) Maximum Ratings Parameter Symbol Value Unit Collectoremitter voltage, T j 25 C V C E 600 V DC collector current, limited by T jmax T C = 25 C T C = 100 C I C 11.7 7.2 Pulsed collector current, t p limited by T jmax I C p u l s 30 Turn off safe operating area, V CE = 600V, T j = 175 C, t p = 1µs 30 A Diode forward current, limited by T jmax T C = 25 C T C = 100 C I F 11.9 7.4 Diode pulsed current, t p limited by T jmax I F p u l s 30 Gateemitter voltage V G E 20 V Short circuit withstand time 2) V GE = 15V, V CC 400V, T j 150 C t S C 5 s Power dissipation, T C = 25 C P t o t 30 W Operating junction temperature T j 40...+175 Storage temperature T s t g 55...+150 C Isolation voltage V i s o l 2500 V r ms 1 JSTD020 and JESD022 2) Allowed number of short circuits: <1000; time between short circuits: >1s. IFAG IPC TD VLS 1 Rev. 2.5 20.09.2013
Thermal Resistance Parameter Symbol Conditions Max. Value Unit Characteristic IGBT thermal resistance, R t h J C 5 K/W junction case Diode thermal resistance, R t h J C D 5.8 junction case Thermal resistance, junction ambient R t h J A 80 Electrical Characteristic, at T j = 25 C, unless otherwise specified Parameter Symbol Conditions Static Characteristic Value min. typ. max. Collectoremitter breakdown voltage V ( B R ) C E S V G E =0V, I C =0.2mA 600 V Collectoremitter saturation voltage V C E ( s a t ) V G E = 15V, I C = T j =25 C T j =175 C Diode forward voltage V F V G E =0V, I F = T j =25 C T j =175 C Gateemitter threshold voltage V G E ( t h) I C =0.3mA,V C E =V G E 4.1 4.6 5.7 Zero gate voltage collector current I C E S V C E =600V, V G E =0V T j =25 C T j =175 C Gateemitter leakage current I G E S V C E =0V,V G E =20V 100 na Transconductance g f s V C E =20V, I C =15A 6 S Integrated gate resistor R G i n t none Ω 1.5 1.8 1.6 1.6 2.05 2.05 40 1000 Unit µa Dynamic Characteristic Input capacitance C i s s V C E =25V, 551 pf Output capacitance C o s s V G E =0V, 40 Reverse transfer capacitance C r s s f=1mhz 17 Gate charge Q G a t e V C C =480V, I C = Internal emitter inductance measured 5mm (0.197 in.) from case V G E =15V Short circuit collector current 1) I C ( S C ) V G E =15V,t S C 5 s V C C = 400V, T j = 25 C 62 nc L E 7 nh 100 A 1) Allowed number of short circuits: <1000; time between short circuits: >1s. IFAG IPC TD VLS 2 Rev. 2.5 20.09.2013
Switching Characteristic, Inductive Load, at T j =25 C Parameter Symbol Conditions IGBT Characteristic Value min. typ. max. Turnon delay time t d ( o n ) T j=25 C, 12 ns Rise time t r V C C=400V,I C=, V G E=0/15V,r G=23, 8 Turnoff delay time t d ( o f f ) L =60nH,C =40pF 215 Fall time t f 38 Turnon energy E o n L, C from Fig. E Energy losses include 0.16 mj Turnoff energy E o f f tail and diode reverse 0.27 recovery. Total switching energy E t s 0.43 AntiParallel Diode Characteristic Diode reverse recovery time t r r T j =25 C, Diode reverse recovery charge Q r r V R =400V, I F =, 0.38 µc Diode peak reverse recovery current I r r m di F /dt=88/ s 10 A Unit 115 ns Diode peak rate of fall of reverse di r r /dt 680 A/ s recovery current during t b Switching Characteristic, Inductive Load, at T j =175 C Parameter Symbol Conditions IGBT Characteristic Value min. typ. max. Turnon delay time t d ( o n ) T j=25 C, 10 ns Rise time t r V C C=400V,I C=, V G E=0/15V,r G=23, 11 Turnoff delay time t d ( o f f ) L =60nH,C =40pF 233 Fall time t f 63 Turnon energy E o n L, C from Fig. E Energy losses include 0.26 mj Turnoff energy E o f f tail and diode reverse 0.35 recovery. Total switching energy E t s 0.61 AntiParallel Diode Characteristic Diode reverse recovery time t r r T j =175 C Diode reverse recovery charge Q r r V R =400V, I F =, 0.92 µc Diode peak reverse recovery current I r r m di F /dt=88/ s 13 A Unit 200 ns Diode peak rate of fall of reverse di r r /dt 390 A/ s recovery current during t b IFAG IPC TD VLS 3 Rev. 2.5 20.09.2013
3 T C =80 C T C =110 C t p =1µs IC, COLLECTOR CURRENT 25A 2 15A 5A I c I c 10Hz 100Hz 1kHz 10kHz 100kHz IC, COLLECTOR CURRENT 20µs 50µs 1A 500µs 5ms 100ms 0,1A DC 1V 10V 100V 1000V f, SWITCHING FREQUENCY V CE, COLLECTOREMITTER VOLTAGE Figure 1. Collector current as a function of switching frequency (T j 175 C, D = 0.5, V CE = 400V, V GE = 0/15V, r G = 23 ) Figure 2. Safe operating area (D = 0, T C = 25 C, T j 175 C; V GE =0/15V) 30W Ptot, POWER DISSIPATION 25W 20W 15W 10W IC, COLLECTOR CURRENT 8A 6A 4A 5W 2A 0W 25 C 50 C 75 C 100 C 125 C 150 C 25 C 75 C 125 C T C, CASE TEMPERATURE Figure 3. Power dissipation as a function of case temperature (T j 175 C) T C, CASE TEMPERATURE Figure 4. Collector current as a function of case temperature (V GE 15V, T j 175 C) IFAG IPC TD VLS 4 Rev. 2.5 20.09.2013
3 3 25A V GE =20V 25A V GE =20V IC, COLLECTOR CURRENT 2 15A 15V 12V 10V 8V 6V IC, COLLECTOR CURRENT 2 15A 15V 12V 10V 8V 6V 5A 5A 0V 1V 2V 3V 4V V CE, COLLECTOREMITTER VOLTAGE Figure 5. Typical output characteristic (T j = 25 C) 0V 1V 2V 3V 4V 5V V CE, COLLECTOREMITTER VOLTAGE Figure 6. Typical output characteristic (T j = 175 C) IC, COLLECTOR CURRENT 25A 2 15A 5A =175 C 25 C 0V 2V 4V 6V 8V 10V VCE(sat), COLLECTOREMITT SATURATION VOLTAGE 3,0V 2,5V 2,0V 1,5V 1,0V 0,5V I C =2 I C = I C =5A 0,0V 50 C 0 C 50 C 100 C 150 C V GE, GATEEMITTER VOLTAGE Figure 7. Typical transfer characteristic (V CE =20V), JUNCTION TEMPERATURE Figure 8. Typical collectoremitter saturation voltage as a function of junction temperature (V GE = 15V) IFAG IPC TD VLS 5 Rev. 2.5 20.09.2013
t d(off) t d(off) 100ns 100ns t, SWITCHING TIMES 10ns t d(on) t f t, SWITCHING TIMES 10ns t d(on) t r t f t r 1ns 1ns 5A 15A 2 I C, COLLECTOR CURRENT Figure 9. Typical switching times as a function of collector current (inductive load, =175 C, V CE = 400V, V GE = 0/15V, r G = 23Ω, R G, GATE RESISTOR Figure 10. Typical switching times as a function of gate resistor (inductive load, = 175 C, V CE = 400V, V GE = 0/15V, I C =, 7V t, SWITCHING TIMES 100ns 10ns t d(on) t r t d(off) t f VGE(th), GATEEMITT TRSHOLD VOLTAGE 6V 5V 4V 3V 2V 1V min. typ. max. 1ns 25 C 50 C 75 C 100 C 125 C 150 C 0V 50 C 0 C 50 C 100 C 150 C, JUNCTION TEMPERATURE Figure 11. Typical switching times as a function of junction temperature (inductive load, V CE = 400V, V GE = 0/15V, I C =, r G =23Ω,, JUNCTION TEMPERATURE Figure 12. Gateemitter threshold voltage as a function of junction temperature (I C = 0.3mA) IFAG IPC TD VLS 6 Rev. 2.5 20.09.2013
E, SWITCHING ENERGY LOSSES 1,0m J 0,8m J 0,6m J 0,4m J 0,2m J ) E on and E ts include losses due to diode recovery E ts E off E on E, SWITCHING ENERGY LOSSES 0,8 mj 0,6 mj 0,4 mj 0,2 mj ) E on and E ts include losses due to diode recovery E ts E off E on 0,0m J 5A 15A I C, COLLECTOR CURRENT Figure 13. Typical switching energy losses as a function of collector current (inductive load, = 175 C, V CE = 400V, V GE = 0/15V, r G = 23Ω, 0,0 mj R G, GATE RESISTOR Figure 14. Typical switching energy losses as a function of gate resistor (inductive load, = 175 C, V CE = 400V, V GE = 0/15V, I C =, E, SWITCHING ENERGY LOSSES ) E on and E ts include losses 0,6mJ due to diode recovery 0,5mJ E ts 0,4mJ 0,3mJ E off 0,2mJ E on 0,1mJ E, SWITCHING ENERGY LOSSES 0,8mJ 0,6mJ 0,4mJ 0,2mJ ) E on and E ts include losses due to diode recovery E ts E off E on 0,0mJ 50 C 100 C 150 C 0,0mJ 300V 350V 400V 450V 500V 550V, JUNCTION TEMPERATURE Figure 15. Typical switching energy losses as a function of junction temperature (inductive load, V CE = 400V, V GE = 0/15V, I C =, r G = 23Ω, V CE, COLLECTOREMITTER VOLTAGE Figure 16. Typical switching energy losses as a function of collector emitter voltage (inductive load, = 175 C, V GE = 0/15V, I C =, r G = 23Ω, IFAG IPC TD VLS 7 Rev. 2.5 20.09.2013
1nF C iss VGE, GATEEMITTER VOLTAGE 15V 10V 5V 120V 480V c, CAPACITANCE 100pF C oss C rss 0V 0nC 20nC 40nC 60nC Q GE, GATE CHARGE Figure 17. Typical gate charge (I C =10 A) 10pF 0V 10V 20V V CE, COLLECTOREMITTER VOLTAGE Figure 18. Typical capacitance as a function of collectoremitter voltage (V GE =0V, f = 1 MHz) 12µs IC(sc), short circuit COLLECTOR CURRENT 15 125A 10 75A 5 25A 12V 14V 16V 18V tsc, SHORT CIRCUIT WITHSTAND TIME 10µs 8µs 6µs 4µs 2µs 0µs 10V 11V 12V 13V 14V V GE, GATEEMITTETR VOLTAGE Figure 19. Typical short circuit collector current as a function of gateemitter voltage (V CE 400V, T j 150 C) V GE, GATEEMITETR VOLTAGE Figure 20. Short circuit withstand time as a function of gateemitter voltage (V CE =400V, start at =25 C, max <150 C) IFAG IPC TD VLS 8 Rev. 2.5 20.09.2013
D=0.5 D=0.5 ZthJC, TRANSIENT THERMAL IMPEDANCE 0 0 K/W 0 1 K/W 0.2 0.1 0.05 0.02 0.01 single pulse R, ( K / W ), ( s ) 1.596 4.622 6 1.985 1.288 0.5623 5.06610 2 0.3324 4.15210 3 0.3531 6.05910 4 0.1730 7.86310 5 R 1 R 2 C 1= 1/R 1 C 2= 2/R 2 ZthJC, TRANSIENT THERMAL IMPEDANCE 10 0 K/W 10 1 K/W 0.2 0.1 0.05 0.02 0.01 single pulse R, ( K / W ), ( s ) 1.418 5.068 6 2.125 1.416 0.5890 6.45510 2 0.5424 5.73210 3 0.6311 1.01910 3 0.5061 1.49910 4 R 1 R 2 C 1= 1/R 1 C 2= 2/R 2 0 2 K/W 10µs 100µs 1ms 10ms100ms 1s 10s 10 2 K/W 10µs 100µs 1ms 10ms100ms 1s 10s t P, PULSE WIDTH Figure 21. IGBT transient thermal impedance (D = t p / T) t P, PULSE WIDTH Figure 22. Diode transient thermal impedance as a function of pulse width (D=t P /T) 300ns 0,8µC =175 C trr, REVERSE RECOVERY TIME 250ns 200ns 150ns 100ns 50ns =175 C =25 C Qrr, REVERSE RECOVERY CHARGE 0,7µC 0,6µC 0,5µC 0,4µC 0,3µC 0,2µC 0,1µC =25 C 0ns 20/µs 40/µs 60/µs 80/µs di F /dt, DIODE CURRENT SLOPE Figure 23. Typical reverse recovery time as a function of diode current slope (V R =400V, I F =, 0,0µC 20/µs 40/µs 60/µs 80/µs di F /dt, DIODE CURRENT SLOPE Figure 24. Typical reverse recovery charge as a function of diode current slope (V R = 400V, I F =, IFAG IPC TD VLS 9 Rev. 2.5 20.09.2013
14A =175 C 70/µs =25 C Irr, REVERSE RECOVERY CURRENT 12A 8A 6A 4A 2A =25 C dirr/dt, DIODE PEAK RATE OF FALL OF REVERSE RECOVERY CURRENT 60/µs 50/µs 40/µs 30/µs 20/µs 10/µs =175 C 20/µs 40/µs 60/µs 80/µs /µs 40/µs 60/µs 80/µs di F /dt, DIODE CURRENT SLOPE Figure 25. Typical reverse recovery current as a function of diode current slope (V R = 400V, I F =, di F /dt, DIODE CURRENT SLOPE Figure 26. Typical diode peak rate of fall of reverse recovery current as a function of diode current slope (V R =400V, I F =, 3 =25 C 175 C 2,0V I F =2 IF, FORWARD CURRENT 2 VF, FORWARD VOLTAGE 1,5V 1,0V 0,5V 5A 0V 1V 2V 0,0V 50 C 0 C 50 C 100 C 150 C V F, FORWARD VOLTAGE Figure 27. Typical diode forward current as a function of forward voltage, JUNCTION TEMPERATURE Figure 28. Typical diode forward voltage as a function of junction temperature IFAG IPC TD VLS 10 Rev. 2.5 20.09.2013
PGTO2203 (FullPAK) Please refer to mounting instructions IFAG IPC TD VLS 11 Rev. 2.5 20.09.2013
i,v di F /dt t =t Q =Q + t r r S F + Q r r S F t r r I F t S t F Q S Q F 10% I r r m t I r r m di 90% I r r m r r /dt V R Figure C. Definition of diodes switching characteristics T (t) j 1 r1 2 r 2 r n n p(t) r r 1 2 n r Figure A. Definition of switching times T C Figure D. Thermal equivalent circuit Figure B. Definition of switching losses IFAG IPC TD VLS 12 Rev. 2.5 20.09.2013
Published by Infineon Technologies AG 81726 Munich, Germany 2013 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of noninfringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. The Infineon Technologies component described in this Data Sheet may be used in lifesupport devices or systems and/or automotive, aviation and aerospace applications or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that lifesupport, automotive, aviation and aerospace device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. IFAG IPC TD VLS 13 Rev. 2.5 20.09.2013