Non-traditional methods of material properties and defect parameters measurement

Similar documents
Monitoring of recombination characteristics of the proton irradiated diodes by microwave absorption transients

Fluence dependent variations of recombination and deep level spectral characteristics in neutron and proton irradiated MCz, FZ and epi-si structures

characterization in solids

High-Speed Quadratic Electrooptic Nonlinearity in dc-biased InP

Investigation of Optical Nonlinearities and Carrier Dynamics in In-Rich InGaN Alloys

Joint ICTP-IAEA Workshop on Physics of Radiation Effect and its Simulation for Non-Metallic Condensed Matter.

Semiconductor Detectors

Visualization of Xe and Sn Atoms Generated from Laser-Produced Plasma for EUV Light Source

Carrier lifetime variations during irradiation by 3-8 MeV K in MCZ Si

SURVEY OF RECENT RADIATION DAMGE STUDIES AT HAMBURG

Hussein Ayedh. PhD Studet Department of Physics

Multiple Exciton Generation in Quantum Dots. James Rogers Materials 265 Professor Ram Seshadri

High-resolution photoinduced transient spectroscopy of radiation defect centres in silicon. Paweł Kamiński

Uniform excitation: applied field and optical generation. Non-uniform doping/excitation: diffusion, continuity

Carriers Concentration and Current in Semiconductors

EE 6313 Homework Assignments

Nature, Vol 458, 2009 Leon Camenzind FMM University of Basel,

ESE 372 / Spring 2013 / Lecture 5 Metal Oxide Semiconductor Field Effect Transistor

SEMICONDUCTOR MATERIAL AND DEVICE CHARACTERIZATION

Semiconductor Physical Electronics

Laser heating of noble gas droplet sprays: EUV source efficiency considerations

Electrically active defects in semiconductors induced by radiation

Second-Harmonic Generation Studies of Silicon Interfaces

Single Photon detectors

Theory of Electrical Characterization of Semiconductors

Lecture 15: Optoelectronic devices: Introduction

Charge Collection and Space Charge Distribution in Epitaxial Silicon Detectors after Neutron-Irradiation

Development of Radiation Hard Si Detectors

n i exp E g 2kT lnn i E g 2kT

Chalcogenide semiconductor research and applications. Tutorial 2: Thin film characterization. Rafael Jaramillo Massachusetts Institute of Technology

Basics of Infrared Detection

Session 5: Solid State Physics. Charge Mobility Drift Diffusion Recombination-Generation

The annealing of interstitial carbon atoms in high resistivity n-type silicon after proton irradiation

POSITRON AND POSITRONIUM INTERACTIONS WITH CONDENSED MATTER. Paul Coleman University of Bath

Optical and Photonic Glasses. Lecture 30. Femtosecond Laser Irradiation and Acoustooptic. Professor Rui Almeida

Measurement of CO 2 laser absorption by thin plasma as a 13.5 nm EUV light source!

Sheng S. Li. Semiconductor Physical Electronics. Second Edition. With 230 Figures. 4) Springer

Basics and Means of Positron Annihilation

Introduction into Positron Annihilation

Laser Diodes. Revised: 3/14/14 14: , Henry Zmuda Set 6a Laser Diodes 1

A study of the double-acceptor level of the silicon divacancy in a proton irradiated n-channel CCD.

Carrier transport: Drift and Diffusion

Positron Annihilation Spectroscopy - A non-destructive method for material testing -

Transient grating measurements of spin diffusion. Joe Orenstein UC Berkeley and Lawrence Berkeley National Lab

Laser processing of materials. Temperature distributions

Semiconductor Device Physics

Carrier dynamics in highly-excited TlInS 2 : Evidence of 2D electron-hole charge separation at parallel layers. Supporting information

Identify two CDW amplitude modes with extremely small energy scales in LaAgSb2 by ultrafast pump-probe measurement

PN Junction

Diagnostics of Filamentation in Laser Materials with Fluorescent Methods

Appendix 1: List of symbols

smal band gap Saturday, April 9, 2011

Physics of lead tungstate scintillators

PHOTOVOLTAICS Fundamentals

Out-of-equilibrium electron dynamics in photoexcited topological insulators studied by TR-ARPES

Semilab Technologies for 450mm Wafer Metrology

Electronic Supplementary Information. Thermal Annealing Reduces Geminate Recombination in TQ1:N2200 All- Polymer Solar Cells

THz experiments at the UCSB FELs and the THz Science and Technology Network.

Status Report: Charge Cloud Explosion

Investigation of SiC by Positrons

Carrier Recombination

3.1 Introduction to Semiconductors. Y. Baghzouz ECE Department UNLV

2. Point Defects. R. Krause-Rehberg

STUDY OF SEMICONDUCTOR DEVICES EXPOSED TO SPATIAL RADIATION

Semiconductor Detectors are Ionization Chambers. Detection volume with electric field Energy deposited positive and negative charge pairs

Studying of the Dipole Characteristic of THz from Photoconductors

Enhancement of Ionization Efficiency of Acceptors by Their Excited States in Heavily Doped p-type GaN and Wide Bandgap Semiconductors

Course overview. Me: Dr Luke Wilson. The course: Physics and applications of semiconductors. Office: E17 open door policy

Status Report: Multi-Channel TCT

Ionization Detectors

University of Louisville - Department of Chemistry, Louisville, KY; 2. University of Louisville Conn Center for renewable energy, Louisville, KY; 3

MEASUREMENT OF MINORITY-ARRIER LIFETIME IN SILICON SOLAR CELLS BY THE PHOTOCONDUCTIVE DECAY METHOD*

The Electromagnetic Properties of Materials

Epitaxial SiC Schottky barriers for radiation and particle detection

collisions of electrons. In semiconductor, in certain temperature ranges the conductivity increases rapidly by increasing temperature

OPTI510R: Photonics. Khanh Kieu College of Optical Sciences, University of Arizona Meinel building R.626

UNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences. Professor Ali Javey. Spring 2009.

EUROPEAN ORGANIZATION FOR NUCLEAR RESEARCH STUDIES OF THE RADIATION HARDNESS OF OXYGEN-ENRICHED SILICON DETECTORS

Unit IV Semiconductors Engineering Physics

Lecture 11 Midterm Review Lecture

EEE4106Z Radiation Interactions & Detection

Electron temperature is the temperature that describes, through Maxwell's law, the kinetic energy distribution of the free electrons.

Q. Shen 1,2) and T. Toyoda 1,2)

Title: Ultrafast photocurrent measurement of the escape time of electrons and holes from

Chapter 1 Overview of Semiconductor Materials and Physics

5.74 Introductory Quantum Mechanics II

Ultrafast X-Ray-Matter Interaction and Damage of Inorganic Solids October 10, 2008

Organic Device Simulation Using Silvaco Software. Silvaco Taiwan September 2005

Optical Spectroscopy of Advanced Materials

Lecture 20 Optical Characterization 2

Semiconductor X-Ray Detectors. Tobias Eggert Ketek GmbH

For the following statements, mark ( ) for true statement and (X) for wrong statement and correct it.

ORTEC. Review of the Physics of Semiconductor Detectors. Interaction of Ionizing Radiation with Semiconductor Detectors. Heavy Charged Particles

EE 472 Solutions to some chapter 4 problems

Supplementary Materials

Nonlinear UV Absorption Properties of Bulk 4H SiC Authors: Vincent Meyers*, Daniel Mauch, James Dickens, Andreas Neuber

Transient thermal gratings and carrier-induced gratings in diffusion experiments

phase retardance THz intensity ratio THz filling factor in air : 0.2 filling factor in si : 0.8 length of air : 4um length of si : 16um depth : 27.

Astronomical Observing Techniques 2017 Lecture 9: Silicon Eyes 1

Nonlinear Optics (NLO)

Transcription:

Non-traditional methods of material properties and defect parameters measurement Juozas Vaitkus on behalf of a few Vilnius groups Vilnius University, Lithuania

Outline: Definition of aims Photoconductivity kinetics Free carrier diffusion and capture process measurement Photo-Hall and magnetoresistance Photo-ionization spectroscopy

A few general words: Profile of our group self-formed 40 years ago as: measurement of properties of high resistivity and wide bandgap materials. These materials have many different type of local levels and, usually, different non-uniformities. Therefore it was developed or modified a few of methods for exclusion or activation of a definite level or non-uniformity. The modification of methods was oriented on: Exclusion of an origins of nonlinearities; Avoiding an influence of contacts; Creation of scenario that allows to understand the process.

Free carrier kinetics

Direct measurement of trapping and recombination: photoconductivity decay (short pulse excitation) 1 τ M =1/γ nm (M-m) 3 1 2 E C E M E R 2 τ N =1/γ nm Ν CM Θ I = 1/[γ nm Ν CM + γ nm (M-m)] Θ II = 1/[γ nm Ν CM ] 4 E V τ 3 τ R =1/γ nr (R-r) 4 τ P =1/γ pr r asymp τ 1 + M m 0 = R 2 ( N + ) CM n 0 Measurement of this dependence: E.Gaubas talk!

Limitations and possibilities Excitation pulse duration: ~10 ps, ~10 ns and longer pulses or mosulated dc light. Generation of carriers direct band-band or extrinsic (via deep levels or from/to deep level) Problems appears in high quality samples due to influence of the recombination at the surface (if the diffusion is significant)

Transient gratings Free carriers change the refractive index of semiconductor, therefore if the excitation is by the light interference pattern, then semiconductor become as a periodical grating. The incident or probe beam pulse will diffract in it.

Transient gratings - contactless, non-destructive semiconductor homogeneity control parameters (D, S, τ and etc.) measurement method I λ sample I -1 I I 0 Λ I +1 Also allows to indicate the internal electric field related to impurities if the optical symmetry allows the effect.

Two step excitation spectroscopy: generation of carriers via deep centers G.G.Macfarlane et al, J.Phys.Chem.Solids 8,(1959) 388-392. Diff. Efficiency a. u. 10-1 10-2 10-3 10-4 10-5 Ι 0 = 0.7 mj/cm 2 -p 17 (irradiated) -p 17 Reference Si Ι 0 = 0.7 mj/cm 2 -p 17 (irradiated) -p 17 Reference 0 50 100 150 200 250 300 Temperature, K Identification if the centre is localized or Hydrogen-type

Free carrier lifetime (trapping time and diffusion) measurement by transient grating method I λ sample I -1 I I 0 Λ I +1 1 1 4 π = + 2 τ τ Λ G R 2 D

Diffraction efficiency (a. u.) 10 0 10-1 10-2 Λ = 4.0 µm = 1900 ps I excitation = 5 mj/cm 2 Si (CE2419) Λ = 9.5 µm = 300 ps Λ = 5.8 µm = 400 ps Λ = 4.9 µm = 480 ps Λ = 4.4 µm = 740 ps 0 500 1000 1500 Delay (ps) Λ = 4.4 µm = 640 ps Λ = 4.0 µm = 1310 ps I excitation = 5 mj/cm 2 Si (CH2259) Λ = 9.5 µm = 300 ps Λ = 5.8 µm = 370 ps Λ = 4.9 µm = 440 ps 0 500 1000 1500 Delay (ps)

1 1 CE 2419, ( phi_p [cm -2 ] 1.06 x 10 14 ), τ R > 15 ns CH 2210, ( phi_p [cm -2 ] 1.06 x 10 14 ), τ R > 15 ns Diffraction efficiency. (a. u.) CE 2437, ( phi_p [cm -2 ] 1.84 x 10 14 ), τ R > 15 ns CE 2458, ( phi_p [cm -2 ] 4.25 x 10 14 ), τ R = 11 ns 0,1 CH 2219, ( phi_p [cm -2 ] 1.84 x 10 14 ), τ R > 15 ns CH 2237, ( phi_p [cm -2 ] 4.25 x 10 14 ), τ R = 9 ns CH 2253, ( phi_p [cm -2 ] 6.36 x 10 14 ), τ R = 7 ns 0,1 CE 2459, ( phi_p [cm -2 ] 6.36 x 10 14 ), τ R = 9 ns CH 2259, ( phi_p [cm -2 ] 9.80 x 10 14 ), τ R = 6 ns 200 400 600 800 1000 1200 Delay time (ps) 200 400 600 800 1000 1200 Delay time (ps) I 0 = 0.2 mj/cm 2, grating period Λ=60 µm (decay time ~ recombination (trapping) time)

Diffraction efficiency. (a. u.) Diffraction efficiency. (a. u.) 1 0,1 0,01 1 0,1 0,01 1E-3 CE 2458, CE 2419, ( phi_p [cm -2 ] 1.06 x 10 14 ), = 370 ps, D = 17.6 cm 2 /s CE 2437, ( phi_p [cm -2 ] 1.84 x 10 14 ), = 395 ps, D = 16.5 cm 2 /s ( phi_p [cm -2 ] 4.25 x 10 14 ), = 390 ps, D = 16.3 cm 2 /s CE 2459, ( phi_p [cm -2 ] 6.36 x 10 14 ), = 390 ps, D = 16.2 cm 2 /s 200 300 400 500 600 700 CH 2210, ( phi_p [cm -2 ] 1.06 x 10 14 ), = 400 ps, D = 16.3 cm 2 /s CH 2253, ( phi_p [cm -2 ] 6.36 x 10 14 ), Delay time (ps) = 360 ps, D = 17.4 cm 2 /s CH 2259, ( phi_p [cm -2 ] 9.80 x 10 14 ), = 380 ps, D = 16.2 cm 2 /s CE 2419, I 0 = 0.12 mj/cm 2 I 0 = 0.25 mj/cm 2 ( phi_p [cm -2 ] 1.06 x 10 14 ), 1 = 450 ps, D = 14.4 cm 2 /s CE 2437, ( phi_p [cm -2 ] 1.84 x 10 14 ), I 0 = 0.12 mj/cm 2 CH 2219, ( phi_p [cm -2 ] 1.84 x 10 14 ), = 400 ps, D = 16.2 cm 2 /s CH 2237, ( phi_p [cm -2 ] 4.25 x 10 14 ), = 385 ps, D = 16.4 cm 2 /s 0,1 0,01 1E-3 1 0,1 0,01 1E-3 CE 2458, ( phi_p [cm -2 ] 4.25 x 10 14 ), = 455 ps, D = 14.2 cm 2 /s = 445 ps, D = 14.2 cm 2 /s CE 2459, ( phi_p [cm -2 ] 6.36 x 10 14 ), = 440 ps, D = 14.2 cm 2 /s 200 300 400 500 600 700 800 900 1000 1100 1200 Delay time (ps) CH 2210, ( phi_p [cm -2 ] 1.06 x 10 14 ), = 460 ps, D = 14.1 cm 2 /s CH 2253, ( phi_p [cm -2 ] 6.36 x 10 14 ), = 430 ps, D = 14.4 cm 2 /s CH 2219, ( phi_p [cm -2 ] 1.84 x 10 14 ), = 470 ps, D = 13.7 cm 2 /s CH 2259, ( phi_p [cm -2 ] 9.80 x 10 14 ), = 440 ps, D = 13.9 cm 2 /s I 0 = 0.25 mj/cm 2 CH 2237, ( phi_p [cm -2 ] 4.25 x 10 14 ), = 445 ps, D = 14.1 cm 2 /s 200 300 400 500 600 700 800 Delay time (ps) 100 200 300 400 500 600 700 800 900 1000 1100 1200 1300 Delay time (ps) Workshop on Defect Analysis in Radiation Grating Damaged period Λ=5 Silicon µm (diffusion Detectors, influence). Hamburg, 23./24. August 2006 J. Vaitkus

1/ (ps -1 ) 3 2 Si (CH2259) D = 12.5 cm 2 /s ( D = 0.1 cm 2 /s) τ R = 5.7 ns ( τ R = 0.3 ns) I excitation = 5 mj/cm 2 1 0 Si (CE2419) D = 13.6 cm 2 /s ( D = 0.1 cm 2 /s) τ R > 30 ns 1 2 3 4 5 6 1/Λ (µm -2 ) Excitation Si (CE2419) Si (CE2459) Si (CH2259) (mj/cm 2 ) 1.06 10 14 cm -2 6.36 10 14 cm -2 9.80 10 14 cm -2 0.7 D (cm 2 /s) 16 (± 0.1) 15.7 (± 0.1) 17.2 (± 0.1) τ R (ns) > 30 >30 20 (± 2) 5.0 D (cm 2 /s) 13.6 (± 0.1) 13.1 (± 0.1) 12.5 (± 0.3) τ R (ns) > 30 > 30 5.7 (± 0.3)

Photo-Hall effect I t Intense laser pulse An influence of impurities on free carrier mobility. The indications of scattering on impurities, clusters and etc.: According the scattering coefficient value According the different dependence on temperature B Magnetic field up to 2 T Digital processing: High input impedance, small capacitance!

E H 2 ( 1) eini ( t) Ai µ i ( t) i () t = BEx i e i n ( t) µ ( t) i i () t = w[ E E ( t) ] B = r web U µ H Transient Photo-Hall and photo-magnetoresistance effects 1. Basic relationships: r H H 0 H 2 < τ > = m 2 < τ > H (4) (2) (3) µ = ρ ρ ( t) = T ( B) B M µ B T M e < τ m > m eff 3 2 < τ m >< τ m > < τ m > = 4 < τ > m 2 2 (1) (5) (6) < 1 1 >= τ m i < τ m > Matthiessen s rule i 1 µ H () t = 1 µ 0 + βvs () t N() t (7) (8)

1 µ H () t Transient Photo-Hall and photo-magnetoresistance effects 2. Practical considerations: = 1 µ 0 + βvs () t N() t 1 1 1 1 1 (9) wbe U 0 ( ) 0 0 1 0 () H = = = + U SN S N SN H 0 β v µ µ t βvu H 0 ± U () 1 H (10) Y t = + (11) U H S t N t = const Y t (12) [ ( ) ( )] ( ) (8) µ s µ ion. i. ~ T 3 2 ( ) * 1 /2 = 2 e N m kt S s 1 Further analyze depends on the model and a number of re-chargeable centers µ. ~ T 1 barr

Photo-Hall effect If the sample has micro/nano nonuniformities, then the signal is more complex dependent on parameters. (That should be in a case of change of conductivity type) It changes an effective active volume therefore changes the effective Hallmobility (a lot of models, quite complicated expressions)

Photo-ionization spectrum Measurement of photoconductivity (possible effect also: quenching of photoconductivity, if additional excitation is used), photo-voltage, short circuit current. Possible regime of constant signal: varying of excitation. It excludes different non-linearities. Determination of defect optical ionization energy.

Si photoconductivity spectrum Example of data from literature: Sample from Hamburg: 10-6 10-7 Si CH2237 4,25e+14p T=79K I (A) 10-8 10-9 2006.06.24 0,8 1,0 1,2 1,4 1,6 1,8 ε (ev)

Conclusions: 1. It exists additional (time consuming) methods for carrier capture processes and defect parameters measurement. 2. It is most important to have the samples, that are interesting for supplier. Thank You for Your attention!