Spec. No.: RHC K HTS 0001 /8 Date: 2017. 1. 10 Specification Title: FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE & HIGH OHM Style:,20 RoHS COMPLIANCE ITEM Halogen and Antimony Free Product specification contained in this specification are subject to change at any time without notice If you have any questions or a Purchasing Specification for any quality Agreement is necessary, please contact our sales staff. Note: Stock conditions Temperature: +5 C +35 C Relative humidity: 25% 75% The period of guarantee: Within 2 year from shipmen t by the company. Solderability shall be satisfied. Hokkaido Research Center Approval by: T. Sannomiya Drawing by: M. Shibuya
,20 Page: 1/7 1. Scope 1.1 This specification covers the detail requirements for fixed thick film chip resistors; rectangular type & high ohm, style of,20. 1.2 Applicable documents JIS C 5201: 1994, JIS C 5202: 1990 2. Classification Type designation shall be the following form. (Example) RHC 20 10G0 M TP 1 2 3 4 5 Style 1 Fixed thick film chip resistors; rectangular type & high ohm 2 Size 3 Rated resistance 10G0 10G0-->10GΩ 4 Tolerance on rated resistance J ±5% K ±10% M ±20% N ±30% H ±50% 5 Packaging form B Bulk (loose package) TP Paper taping Style 3. Rating 3.1 The ratings shall be in accordance with Table 1. Style Rated voltage (V) 15 Temperature coefficient of resistance (10 6 / C) Rated resistance range (Ω) 100M 270M 0 2,000 100M 4G 100M 150G 100M 1G ±2,000 100M 10G ±4,000 100G 150G Table 1 Tolerance on rated resistance J(±5%) K(±10%) M(±20%), N(±30%), H(±50%) J(±5%), K(±10%) M(±20%), N(±30%), H(±50%) Preferred number series for resistors E12 Style Working temperature range( C) 55~+155 55~+125
,20 Page: 2/7 3.2 Derating The derated values of load at temperature in excess of 70 C shall be as indicated by the following curve. 100 Percentage of the load (%) Area of recommended operation 0 55 70 125 155 Ambient temperature ( C) Figure 1 Derating curve 4. Packaging form The standard packaging form shall be in accordance with Table 2. Table 2 Symbol Packaging form Standard packaging quantity / units B Bulk (loose package) 1,000 pcs. TP Paper taping 8mm width, 4mm pitches 5,000 pcs. 5. Dimensions 5.1 The resistor shall be of the design and physical dimensions in accordance with Figure 2 and Table 3. L c H W c d d 5.2 Net weight (Reference) Style Net weight(mg) 2 5 Figure 2 Table 3 Style L W H c d 1.6±0.1 +0.15 0.8 0.05 0.45±0.10 0.3±0.1 0.3±0.1 2.0±0.1 1.25±0.10 0.55±0.10 0.4±0.2 0.4±0.2
,20 Page: 3/7 6. Performance 6.1 The standard condition for tests shall be in accordance with Sub clause 3, JIS C 5202: 1990. 6.2 The performance shall be satisfied in Table 4. Table 4(1) No. Test items Condition of test (JIS C 5202) Performance requirements 1 DC resistance Sub clause 5.1 Measuring voltage: 15 V Within the specified tolerance of rated resistance. 2 Temperature Sub clause 5.2 See table 1. characteristics of Test condition: 5 C / 35 C resistance 3 Voltage coefficient Sub clause 5.3 Measuring voltage: 5 V / 15 V 4 Insulation resistance Sub clause 5.6 The resistor shall be fixed on the test fixture as shown in Figure 4. Test potential: 100 Vdc Test period: 1 min. 5 Capacitance Measuring voltage: 1 V Measuring frequency: 10 khz, 100kHz, 1MHz 100MΩ R<100GΩ: Within ±1 %/V 100GΩ R 150GΩ: Within ±2 %/V 100MΩ R 10GΩ: Within 0 2 %/V 100GΩ R 150GΩ: Within ±10 %/V 10 TΩ min. 1 pf max. 6 Terminal strength (Pulling test) Lead wire (: φ0.4 mm, : φ0.47 mm) shall be soldered to the center of terminal. One side is fixed and the specified load shall be applied to the other side in the direction of axial. Duration: 10 s ± 1 s 7 Substrate bending test Sub clause 6.1.4 (1) The resistor shall be mounted on the test substrate as shown in Figure 3. Bending value: 5 mm (Among the fulcrums: 90 mm) Duration: 10 s ± 1 s 8 Resistance to soldering heat Sub clause 6.10 Test by a piece. Temp. of solder bath: 260 C ± 5 C Immersion time: 10 s ± 1 s After immersion into solder, leaving at the room temp. for 1h or more and then measure the resistance. 9 Solderability Sub clause 6.11 Test by a piece. Flux: Rosin Methanol Temp. of solder bath: 235 C ± 5 C Immersion time: 2 s ± 0.5 s Not be peeled off by the pulling force under 5 N. : 3 N No evidence of mechanical damage. 100MΩ R 10GΩ: Within ±1 % 10GΩ<R 150GΩ: Within ±2 % 100MΩ R 10GΩ: Within ±1 % 100GΩ R 150GΩ: Within ±5 % No evidence of appearance damage The surface of terminal immersed shall be min. of 95% covered with a new coating of solder.
,20 Page: 4/7 Table 4(2) No. Test items Condition of test (JIS C 5202) Performance requirements 10 Temperature cycling Sub clause 7.4 Test cycle: 5 cycles for duty cycle as specified below. Step Temperature ( C) Time (min) 1 Room temp. 2 3 2 55±3 30 3 Room temp. 2 3 4 : 155±2 : 125±2 30 11 Humidity Sub clause 7.5 Test temp. & relative humidity: 40 C ± 2 C & 90 95 % +48 Test period: 1,000 h 12 Load life Sub clause 7.10 Test temp. & relative humidity: 70 C ± 2 C Test voltage: Cycle of 1 h 30 min. ON and 30 min. OFF at dc rated voltage. +48 Test period: 1,000 h 0 0 100MΩ R 10GΩ: Within ±1 % 10GΩ<R 150GΩ: Within ±2 % 100MΩ R 10GΩ: Within ±1 % 100GΩ R 150GΩ: Within ±5 % No evidence of appearance damage 100MΩ R 10GΩ: Within ±2 % 10GΩ<R 150GΩ: Within ±5 % 100MΩ R 10GΩ: Within ±2 % 100GΩ R 150GΩ: Within ±5 % No evidence of appearance damage 100MΩ R 10GΩ: Within ±3 % 10GΩ<R 150GΩ: Within ±5 % 100MΩ R 10GΩ: Within ±3 % 100GΩ R 150GΩ: Within ±20 % No evidence of appearance damage
,20 Page: 5/7 7. Test substrate a :Copper clad d d c 1 4.5 :Solder resist 40 70 100 b Soldering land Style a b c d 1.0 3.6 1.2 3.0 1.2 4.0 1.65 3.0 Figure 3 RHC BOUND STRENGTH OF THE END FACE PLATING TEST SUBSTRATE Remark 1). Material: Epoxide woven glass Thickness: 1.6mm Thickness of copper clad: 0.035mm Metal block measurement Point A Insulation plate Metal plate R0.5mm Measurement point B Insulation surface Component Figure 4 Pressure by spring (1±0.2N)
,20 Page: 6/7 8. Taping 8.1 Applicable documents JIS C 0806 3: 2014, EIAJ ET 7200C: 2010 8.2 Taping dimensions Paper taping (8mm width, 4mm pitches) Taping dimensions shall be in accordance with Figure 5 and Table 5. t 1 Sprocket hole +0.1 φ1.5 0 4±0.1 2±0.05 1.75±0.1 A B 8±0.2 t 2 Carrier cavity 4±0.1 3.5±0.05 Direction of unreeling Figure 5 Table 5 Style A B t 1 t 2 1.15±0.15 1.9±0.2 0.6±0.1 0.8max. 1.65±0.15 2.5±0.2 0.8±0.1 1.0max. 1). The cover tapes shall not cover the sprocket holes. 2). Tapes in adjacent layers shall not stick together in the packing. 3). Components shall not stick to the carrier tape or to the cover tape. 4). Pitch tolerance over any 10 pitches ±0.2mm. 5). The peel strength of the top cover tape shall be with in 0.1N to 0.5N on the test method as shown in the following Figure 6. 6). When the tape is bent with the minimum radius for 25 mm, the tape shall not be damaged and the components shall maintain their position and orientation in the tape. 7). In no case shall there be two or more consecutive components missing. The maximum number of missing components shall be one or 0.1%, whichever is greater. 8). The resistors shall be faced to upward at the over coating side in the carrier cavity. Top cover tape Carrier tape Direction of unreeling 165 to180 Peel off (About 300mm/min) Figure 6
,20 Page: 7/7 8.3 Reel dimension Reel dimensions shall be in accordance with the following Figure 7 and Table 6. Plastic reel (Based on EIAJ ET 7200C) Marking A 2±0.5 φ13±0.2 +1 φ60 0 0 φ180 1.5 φ21±0.8 Marking B Figure 7 Table 6 Style A B Note, 20 +1.0 9 0 11.4±1.0 Injection molding 13±1.0 Vacuum forming Note: Marking label shall be marked on a place of Marking A or two place of marking A and B. A B 8.4 Leader and trailer tape. 160mm min. 100mm min. 400mm min. End Start Trailer Direction of unreeling Figure 8 Leader 9. Marking on package The label of a minimum package shall be legibly marked with follows. 9.1 Marking A (1) Classification (Style, Rated resistance, Tolerance on rated resistance, Packaging form) (2) Quantity (3) Lot number (4) Manufacturer s name or trade mark (5) Others 9.2 Marking B (KAMAYA Control label)