Pulse Proof Thick Film Chip Resistors

Similar documents
Lead (Pb)-Free Thick Film, Rectangular High Value Chip Resistor

Lead (Pb)-Bearing Thick Film, Rectangular High Value Chip Resistor

Lead (Pb)-Free Thick Film, Rectangular, Trimmable Chip Resistors

Green Thick Film Chip Resistors

Lead (Pb)-free Thick Film, Rectangular Commodity Chip Resistors

Green Commodity Thick Film Chip Resistors

Long Side Termination Thick Film Chip Resistors

Fusible Carbon Film MELF Resistors

Lead (Pb)-Bearing Thick Film, Rectangular Chip Resistors

Lead (Pb)-Bearing Thick Film, Rectangular Chip Resistors

Lead (Pb)-free Thick Film, Rectangular, Precision Chip Resistors

Standard Carbon Film Leaded Resistors

Lead (Pb)-bearing Thick Film, Rectangular Chip Resistors

Lead (Pb)-free Thick Film, Rectangular Commodity Chip Resistors

Filter Inductors, High Current, Radial Leaded

Anti-Surge, High Power Thick Film Chip Resistors

Surface Mount Power Resistor Thick Film Technology

Conductive Polymer Aluminum Capacitors SMD (Chip), Low Impedance

Metal Film, Cylindrical Resistors

Molded Metal Film High Stability (< 0.25 % after 1000 h) High Temperature (up to 175 C) Precision Resistors

Standard Metal Film Leaded Resistors

50 W Power Resistor, Thick Film Technology, TO-220

5 mm Square Surface Mount Miniature Trimmers Multi-Turn Cermet Sealed

Pulse Proof, High Power Thick Film Chip Resistors

Aluminum Electrolytic Capacitors SMD (Chip) Long Life Vertical

Power Resistor Thick Film Technology

Pulse Proof, High Power Thick Film Chip Resistors

Aluminum Electrolytic Capacitors SMD (Chip), High Temperature, Low Impedance High Vibration Capability

Aluminum Capacitors SMD (Chip), High Temperature

Power Resistor for Mounting onto a Heatsink Thick Film Technology

Power Resistor Thick Film Technology

Aluminum Electrolytic Capacitors SMD (Chip), High Temperature, Low Impedance, High Vibration Capability

30 W Power Resistor Thick Film Technology

Aluminum Electrolytic Capacitors SMD (Chip), Very Low Z, High Vibration Capability

Small Signal Fast Switching Diode

Aluminum Capacitors SMD (Chip) Long Life Vertical

Standard Metal Film Leaded Resistors

Aluminum Electrolytic Capacitors Axial High Temperature High Voltage for E.L.B.

Small Signal Fast Switching Diode FEATURES

Aluminum Capacitors FEATURES APPLICATIONS PACKAGING

Aluminum Capacitors SMD (Chip) Long Life Vertical

Ruggedized Electrical Double Layer Energy Storage Capacitors

Platinum SMD Flat Chip Temperature Sensor

AC and Pulse Film/Foil Capacitors Radial Potted Type

Solid Tantalum SMD Capacitors TANTAMOUNT, Hi-Rel COTS, Low ESR, Metal Case

Power Resistors for Mounting Onto a Heatsink Thick Film Technology

Aluminum Capacitors FEATURES APPLICATIONS PACKAGING

Aluminum Capacitors Power Printed Wiring Style

Aluminum Electrolytic Capacitors Radial, Enhanced High Temperature, Low Impedance

Carbon Film Resistors, Standard

Energy Storage Double Layer Capacitors

Fusible, Non-Flammable Metal Film Leaded Resistors

Power Resistor for Mounting onto a Heatsink Thick Film Technology

Small Signal Zener Diodes

Power Resistor for Mounting onto a Heatsink Thick Film Technology

Double Metallized Polypropylene Film Capacitor Radial AC and Pulse Capacitor

High Ohmic/High Voltage Metal Glaze Leaded Resistors

Small Signal Fast Switching Diode

Small Signal Fast Switching Diode

Aluminum Electrolytic Capacitors Power Long Life Snap-In

Surface Mount Multilayer Ceramic Capacitors for Pulse Current Applications

Aluminum Electrolytic Capacitors Radial Miniature, Low Impedance

Solid Tantalum Chip Capacitors, TANTAMOUNT, Conformal Coated, Maximum CV, Low ESR

SMD Aluminum Solid Capacitors with Conductive Polymer

Aluminum Electrolytic Capacitors Power Standard Miniature Snap-In

Electrical Double Layer Energy Storage Capacitors Up to 3 V Operating Voltage

Aluminum Electrolytic Capacitors Axial Standard

Cemented Leaded Wirewound Precision Resistors

Small Signal Zener Diodes, Dual

Small Signal Fast Switching Diode FEATURES PART ORDERING CODE INTERNAL CONSTRUCTION TYPE MARKING REMARKS

Surface Mount Multilayer Ceramic Chip Capacitors for Ultra Small Commodity Applications

Small Signal Zener Diodes, Dual

RF Power Feed-Through Capacitors with Conductor Rod, Class 1 Ceramic

Aluminum Electrolytic Capacitors Axial Miniature, Long-Life

Zener Diodes FEATURES APPLICATIONS

Power Resistor for Mounting onto a Heatsink Thick Film Technology

Resin-Molded, Radial-Lead Solid Tantalum Capacitors

Trench MOS Barrier Schottky Rectifier for PV Solar Cell Bypass Protection

Surface Mount Multilayer Ceramic Chip Capacitor Solutions for High Voltage Applications

Aluminum Electrolytic Capacitors Power Economic Printed Wiring

Surface Mount Multilayer Ceramic Chip Capacitors DSCC Qualified Type 05007

Aluminum Electrolytic Capacitors Radial Miniature Long Life

RF Power Feed-Through Capacitors with Conductor Rod, Class 1 Ceramic

Power Resistor for Mounting onto a Heatsink Thick Film Technology

Surface Mount Multilayer Ceramic Chip Capacitors for High Q Commodity Applications

RF Power Plate Capacitors for Higher Voltages, Class 1 Ceramic

Two-Line ESD Protection in SOT-23

Silicon PIN Photodiode

Ultra Precision Thin Film MELF Resistors

Surface Mount Multilayer Ceramic Chip Capacitors with Integrated Resistor for High Pulse Current Applications

3/8" Square Panel Potentiometer Miniature - Cermet - Fully Sealed

FEATURES. Heatsink. 1 2 Pin 1 Pin 2

Dual High-Voltage Trench MOS Barrier Schottky Rectifier

Small Signal Zener Diodes

Silicon PIN Photodiode

Through Hole Transformers, Pulse, Trigger Type

Surface Mount Multilayer Ceramic Chip Capacitors for Safety Certified Applications

Thin Film MELF Resistors

4-Line BUS-Port ESD-Protection

Transcription:

Pulse Proof Thick Film Chip Resistors FEATURES High pulse performance, up to kw Stability R/R 1 % for 00 h at 70 C AEC-Q200 qualified Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 STANDARD ELECTRICAL SPECIFICATIONS TYPE CASE SIZE IMPERIAL CASE SIZE METRIC POWER RATING P 70 W LIMITING ELEMENT VOLTAGE U max. AC RMS /DC V TEMPERATURE COEFFICIENT ppm/k D/CRCW-IF RR05M 0.063 50 ± 200 D11/CRCW-IF RR1608M 0. 75 ± 200 D12/CRCW0805-IF 0805 RR2012M 0.125 150 ± 200 D25/CRCW1206-IF 1206 RR3216M 0.25 200 ± 200 CRCW12-IF 12 RR3225M 0.50 200 ± 200 CRCW-IF RR5025M 0.75 400 ± 200 CRCW-IF RR6332M 1.0 500 ± 200 TOLERANCE % RESISTANCE RANGE SERIES Notes These resistors do not feature a limited lifetime when operated within the limits of rated dissipation, permissible operating voltage, and permissible film temperature. However, the resistance typically increase due to the resistor s film temperature over operating time, generally known as drift. The drift may exceed the stability requirements of an individual application circuit and thereby limits the functional time. Marking: See data sheet Surface Mount Resistor Marking (document number 20020). Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material. TECHNICAL SPECIFICATIONS PARAMETER UNIT D/ CRCW-IF D11/ CRCW-IF D12/ CRCW0805-IF D25/ CRCW1206-IF CRCW12-IF CRCW-IF CRCW-IF Rated dissipation P (1) 70 W 0.063 0.1 0.125 0.25 0.5 0.75 1.0 Operating voltage U max. AC RMS /DC V 50 75 150 200 200 400 500 Insulation voltage U ins (1 min) V 75 0 200 300 300 300 300 Insulation resistance > 9 Operating temperature range C -55 to +155 Failure rate h -1 < 0.1 x -9 Mass mg 0.65 2 5.5 16 25.5 40.5 Note (1) The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the printe-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 155 C is not exceeded. Revision: 17-Mar-15 1 Document Number: 20024

PART NUMBER AND PRODUCT DESCRIPTION Part Number: CRCW08051R00JNEAIF C R C W 0 8 0 5 1 R 0 0 J N E A I F TYPE VALUE TOLERANCE TCR PACKAGING SPECIAL CRCW CRCW CRCW0805 CRCW1206 CRCW12 CRCW CRCW R = Decimal K = Thousand J = % K = % Product Description: D12/CRCW0805-IF 200 1R0 5 % ET1 e3 N = ± 200 ppm/k EA, EB, EC, ED, EE, EF, EG, EH, EI, EL Up to 2 digits IF = Pulse proof D12/CRCW0805-IF 200 1R0 5 % ET1 e3 TYPE TCR RESISTANCE VALUE TOLERANCE PACKAGING LEAD (Pb)-FREE D/CRCW-IF D11/CRCW-IF D12/CRCW0805-IF D25/CRCW1206-IF CRCW12-IF CRCW-IF CRCW-IF ± 200 ppm/k 1R0 = 1 K = k % % ET1, ET2, ET3, ET4, ET5, ET6, ET7, ET8, ET9, EF4, E02, E67, E82 e3 = Pure tin termination finish PACKAGING TYPE CODE QUANTITY CARRIER TAPE WIDTH PITCH REEL DIAMETER D/CRCW-IF ED = ET7 000 8 mm 2 mm EE = EF4 50 000 330 mm/13" EI = ET2 5000 ED = ET3 000 8 mm 2 mm EL = ET4 20 000 285 mm/11.25" D11/CRCW-IF EE = ET8 50 000 330 mm/13" EA = ET1 5000 EB = ET5 000 8 mm 4 mm 285 mm/11.25" EC = ET6 20 000 Paper tape acc. to 330 mm/13" IEC 60286-3 EA = ET1 5000 Type 1a D12/CRCW0805-IF EB = ET5 000 8 mm 4 mm 285 mm/11.25" EC = ET6 20 000 330 mm/13" EA = ET1 5000 D25/CRCW1206-IF EB = ET5 000 8 mm 4 mm 285 mm/11.25" EC = ET6 20 000 330 mm/13" EA = ET1 5000 CRCW12-IF EB = ET5 000 8 mm 4 mm 285 mm/11.25" EC = ET6 20 000 330 mm/13" CRCW-IF EF = E02 4000 Pressed tape 12 mm 4 mm CRCW-IF EG = E67 2000 acc. to 8 mm IEC 60286-3 12 mm EH = E82 4000 Type 1b 4 mm Revision: 17-Mar-15 2 Document Number: 20024

DIMENSIONS in millimeters T2 L I b H W a SIZE T1 DIMENSIONS RECOMMENDED SOLDER PAD DIMENSIONS REFLOW SOLDERING WAVE SOLDERING IMPERIAL METRIC L W H T1 T2 a b l a b l RR05M 1.0 ± 0.05 0.5 ± 0.05 0.35 ± 0.05 0.25 ± 0.05 0.2 ± 0.1 0.4 0.6 0.5 RR1608M 1.55 + - 0.05 0. 0.85 ± 0.1 0.45 ± 0.05 0.3 ± 0.2 0.3 ± 0.2 0.5 0.9 1.0 0.9 0.9 1.0 0805 RR2012M 2.0 + - 0. 0.20 1.25 ± 0.15 0.45 ± 0.05 0.3 + 0.20-0. 0.3 ± 0.2 0.7 1.3 1.2 0.9 1.3 1.3 1206 RR3216M 3.2 + - 0.20 0. 1.6 ± 0.15 0.55 ± 0.05 0.45 ± 0.2 0.4 ± 0.2 0.9 1.7 2.0 1.1 1.7 2.3 12 RR3225M 3.2 ± 0.2 2.5 ± 0.2 0.55 ± 0.05 0.45 ± 0.2 0.4 ± 0.2 0.9 2.5 2.0 1.1 2.5 2.2 RR5025M 5.0 ± 0.15 2.5 ± 0.15 0.6 ± 0.1 0.6 ± 0.2 0.6 ± 0.2 1.0 2.5 3.9 1.2 2.5 3.9 RR6332M 6.3 ± 0.2 3.15 ± 0.15 0.6 ± 0.1 0.6 ± 0.2 0.6 ± 0.2 1.0 3.2 5.2 1.2 3.2 5.2 FUNCTIONAL PERFORMANCE Pulse Power (W) Maximum pulse dissipation as a function of the pulse duration, single pulse 0 000 000 00 0 12 1206 0805 1 0.1 0.01 0.000001 0.00001 0.0001 0.001 0.01 0.1 1 0 Pulse Duration (s) Maximum pulse load, single pulse; applicable if P 0 and n 00 and Û Û max. ; for permissible resistance change equivalent to 8000 h operation Revision: 17-Mar-15 3 Document Number: 20024

Pulse Power (W) Maximum pulse dissipation as a function of the pulse duration, continuous pulse loading 0 000 000 00 0 12 1206 0805 1 0.1 0.01 0.000001 0.00001 0.0001 0.001 0.01 0.1 1 0 Pulse Duration (s) Maximum pulse load, continuous pulses; applicable if P P (ϑ amb ) and Û Û max. ; for permissible resistance change equivalent to 8000 h operation Pulse Voltage Û max. (V) 2000 1800 1600 1400 1200 00 800 600 1206/12 400 0805 200 0-6 - 5-4 - 3-2 - 1 1 Pulse Duration t i (s) Maximum pulse voltage, single and continuous pulses; applicable if P P max. ; for permissible resistance change equivalent to 8000 h operation Revision: 17-Mar-15 4 Document Number: 20024

Single-pulse high voltage overload test 1.2 µs/50 µs EN 140000 4.27 Peak Voltage (V) 000 00 12 1206 0805 0 1 1 0 00 000 0 000 Resistance Value (Ω) Pulse load rating in accordance to EN 60115-1, 4.27; 1.2 μs/50 μs; 5 pulses at 12 s intervals; for permissible resistance change 1 % Single-pulse high voltage overload test µs/700 µs EN 140000 4.27 Peak Voltage (V) 000 00 12 1206 0805 0 1 1 0 00 000 0 000 Resistance Value (Ω) Pulse load rating in accordance to EN 60115-1, 4.27; μs/700 μs; pulses at 1 min intervals; for permissible resistance change 1 % Revision: 17-Mar-15 5 Document Number: 20024

Derating Fraction of Rated Dissipation P 70 (%) 0 50 0-50 0 50 70 0 150 Ambient Temperature ϑ amb ( C) TEST PROCEDURES AND REQUIREMENTS EN 60115-1 CLAUSE IEC 60082-2 TEST METHOD TEST PROCEDURE REQUIREMENTS PERMISSIBLE CHANGE ( R) STABILITY CLASS 1 OR BETTER Stability for product type: 1 to 0 k 4.5 - Resistance - %; % 4.7 - Voltage proof U = 1.4 x U ins ; 60 s No flashover or breakdown 4.13 - Short time overload 4.17.2 58 (Td) Solderability 4.8.4.2 - Temperature coefficient 4.19 14 (Na) Rapid change of temperature U = 2.5 x P 70 x R 2 x U max.; duration acc. to style Solder bath method; Sn60Pb40; non-activated flux; (235 ) C, (2 ± 0.2) s Solder bath method; Sn96.5Ag3Cu0.5; non-activated flux; (245 ) C, (3 ± 0.3) s (20/- 55/20) C and (20/125/20) C 30 min. at - 55 C; 30 min. at 125 C 5 cycles 00 cycles ± (0.25 % R + 0.05 ) Good tinning ( 95 % covered); no visible damage Good tinning ( 95 % covered); no visible damage ± 200 ppm/k ± (0.25 % R + 0.05 ) Revision: 17-Mar-15 6 Document Number: 20024

TEST PROCEDURES AND REQUIREMENTS EN 60115-1 CLAUSE IEC 60082-2 TEST METHOD TEST PROCEDURE Stability for product type: 4.23 - Climatic sequence: - REQUIREMENTS PERMISSIBLE CHANGE ( R) STABILITY CLASS 1 OR BETTER 1 to 0 k 4.23.2 2 (Ba) Dry heat 125 C; 16 h 4.23.3 30 (Db) Damp heat, cyclic 55 C; 90 % RH; 24 h; 1 cycle 4.23.4 1 (Aa) Cold - 55 C; 2 h 4.23.5 13 (M) Low air pressure 1 kpa; (25 ) C; 1 h 4.23.6 30 (Db) Damp heat, cyclic 55 C; 90 % RH; 24 h; 5 cycles 4.23.7 - DC load U = P 70 x R 4.25.1 - Endurance at 70 C 4.18.2 58 (Td) Resistance to soldering heat 4.24 78 (Cab) Damp heat, steady state U = P 70 x R U max. 1.5 h on; 0.5 h off; 70 C; 00 h 70 C; 8000 h Solder bath method (260 ) C; ( ± 1) s (40 ± 2) C; (93 ± 3) % RH; 56 days ± (2 % R + 0.1 ) ± (0.25 % R + 0.05 ) 4.25.3 - Endurance at upper category temperature 155 C; 00 h 4.27 - Single pulse high voltage overload, μs/700 μs Û = x P 70 x R 2 x U max. ; pulses All tests are carried out in accordance with the following specifications: EN 60115-1, generic specification EN 140400, sectional specification EN 140401-802, detail specification IEC 60068-2-x, environmental test procedures Packaging of components is done in paper or blister tapes according to IEC 60286-3. Revision: 17-Mar-15 7 Document Number: 20024

Legal Disclaimer Notice Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, ), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability. Statements regarding the suitability of products for certain types of applications are based on s knowledge of typical requirements that are often placed on products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer s technical experts. Product specifications do not expand or otherwise modify s terms and conditions of purchase, including but not limited to the warranty expressed therein. Except as expressly indicated in writing, products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the product could result in personal injury or death. Customers using or selling products not expressly indicated for use in such applications do so at their own risk. Please contact authorized personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of. Product names and markings noted herein may be trademarks of their respective owners. 2017 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED Revision: 08-Feb-17 1 Document Number: 900