BC487, BC487B. High Current Transistors. NPN Silicon. Pb Free Packages are Available* Features. MAXIMUM RATINGS MARKING DIAGRAM

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Transcription:

High Current Transistors NPN Silicon Features PbFree Packages are Available* COLLECTOR 1 MAXIMUM RATINGS Rating Symbol alue Unit Collector Emitter oltage CEO 60 dc Collector Base oltage CBO 60 dc Emitter Base oltage EBO 5.0 dc Collector Current Continuous I C 0.5 Adc Total Device Dissipation @ T A = 25 C Derate above 25 C Total Device Dissipation @ T C = 25 C Derate above 25 C Operating and Storage Junction Temperature Range P D 625 5.0 P D 1.5 12 mw mw/ C W mw/ C T J, T stg 55 to +1 C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Thermal Resistance, JunctiontoAmbient Thermal Resistance, JunctiontoCase R JA C/W R JC 83.3 C/W 2 BASE 1 1 2 2 3 3 STRAIGHT LEAD BULK PACK TO92 CASE 29 STYLE 17 3 EMITTER BENT LEAD TAPE & REEL AMMO PACK MARKING DIAGRAM BC48 7x AYWW BC487 = Device Code x = nothing or B A = Assembly Location Y = Year WW = Work Week = PbFree Package (Note: Microdot may be in either location) ORDERING INFORMATION Device Package Shipping BC487 TO92 00 Units / Box BC487G TO92 (PbFree) 00 Units / Box BC487B TO92 00 Units / Box BC487BG TO92 (PbFree) 00 Units / Box BC487BRL1 TO92 0/Tape & Reel *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Semiconductor Components Industries, LLC, 11 November, 11 Rev. 2 1 Publication Order Number: BC487/D

ELECTRICAL CHARACTERISTICS (T A = 25 C unless otherwise noted) Characteristic Symbol Min Typ Max Unit OFF CHARACTERISTICS CollectorEmitter Breakdown oltage (Note 1) (I C = madc, I B = 0) (BR)CEO 60 dc CollectorBase Breakdown oltage (I C = Adc, I E = 0) EmitterBase Breakdown oltage (I E = Adc, I C = 0) Collector Cutoff Current ( CB = 40 dc, I E = 0) (BR)CBO 60 dc (BR)EBO 5.0 dc I CBO nadc ON CHARACTERISTICS* DC Current Gain (I C = madc, CE = 2.0 dc) (I C = madc, CE = 2.0 dc) BC487 BC487B (I C = Adc, CE = 5.0 dc)* h FE 40 60 160 15 260 400 400 CollectorEmitter Saturation oltage (I C = 0 madc, I B = madc) (I C = Adc, I B = madc) BaseEmitter Saturation oltage (I C = 0 madc, I B = madc) (I C = Adc, I B = madc) (1) DYNAMIC CHARACTERISTICS CurrentGain Bandwidth Product (I C = madc, CE = 2.0 dc, f = MHz) Output Capacitance ( CB = dc, I E = 0, f = MHz) Input Capacitance ( EB = 0.5 dc, I C = 0, f = MHz) 1. Pulse Test: Pulse Width = 0 s, Duty Cycle 2.0%. TURN-ON TIME CE(sat) BE(sat) 0.3 0.85 0.9 0.5 1.2 dc dc f T MHz C ob 7.0 pf C ib pf TURN-OFF TIME 5.0 s + 0 t r = 3.0 ns in - CC+40 R L R B OUTPUT 5.0 F *C S < 6.0 pf in + BB CC+40 R L R B OUTPUT 5.0 F *C S < 6.0 pf 5.0 s t r = 3.0 ns *Total Shunt Capacitance of Test Jig and Connectors For PNP Test Circuits, Reverse All oltage Polarities Figure 1. Switching Time Test Circuits 2

f, T CURRENT-GAIN BANDWIDTH PRODUCT (MHz) 0 2.0 CE = 2.0 3.0 5.0 7.0 C, CAPACITANCE (pf) 80 60 40 8.0 6.0 4.0 0.1 C ibo 0.5 2.0 5.0 R, REERSE OLTAGE (OLTS) C obo Figure 2. CurrentGain Bandwidth Product Figure 3. Capacitance t, TIME (ns) k 0 0 0 CC = 40 I C /I B = I B1 = I B2 5.0 7.0 t s t f t r t d @ BE(off) = 0.5 0 0 Figure 4. Switching Time r(t) TRANSIENT THERMAL RESISTANCE (NORMALIZED) 0.7 0.5 0.3 0.1 0.07 0.05 0.03 D = 0.5 0.1 0.01 SINGLE PULSE 0.02 SINGLE PULSE t, TIME (ms) Figure 5. Thermal Response P (pk) t 1 t 2 DUTY CYCLE, D = t 1 /t 2 D CURES APPLY FOR POWER PULSE TRAIN SHOWN READ TIME AT t 1 (SEE AN469) T J(pk) T C = P (pk) Z JC(t) T J(pk) T A = P (pk) Z JA(t) 0.02 Z JC(t) = r(t) R JC Z JA(t) = r(t) R JA 0.01 2.0 5.0 0 k 2.0 k 5.0 k k k k k 3

IC, COLLECTOR CURRENT (ma) k 0 0 0 T A = 25 C CURRENT LIMIT THERMAL LIMIT SECOND BREAKDOWN LIMIT s T C = 25 C BC489 ms 2.0 3.0 5.0 7.0 CE, COLLECTOR-EMITTER OLTAGE (OLTS) s Figure 6. Active Region Safe Operating Area 400 hfe, DC CURRENT GAIN 80 T J =125 C 25 C -55 C CE = 60 40 0.5 0.7 2.0 3.0 5.0 7.0 0 0 Figure 7. DC Current Gain, OLTAGE (OLTS) 0.8 0.6 0.4 BE(sat) @ I C /I B = BE(on) @ CE = CE, COLLECTOR-EMITTER OLTAGE (OLTS) CE(sat) @ I C /I B = 0 0 0.5 2.0 5.0 0 0.05 0.1 0.5 2.0 5.0 0.8 0.6 0.4 I C = ma ma ma 2 ma 0 ma Figure 8. On oltages Figure 9. Collector Saturation Region 4

R θ B, TEMPERATURE COEFFICIENT (m/ C) -1.2-1.6-2.0-2.4 R B for BE -2.8 0.5 2.0 5.0 0, OLTAGE (OLTS) - -0.6-0.4-0 -0.5 BE(sat) @ I C /I B = BE(on) @ CE = - CE(sat) @ I C /I B = - -2.0-5.0 - - - - - -0 Figure. BaseEmitter Temperature Coefficient Figure 11. On oltages CE, COLLECTOR-EMITTER OLTAGE (OLTS) - -0.6-0.4 I C = - ma - ma - ma -2 ma -0 ma - 0-0.05-0.1 - -0.5 - -2.0-5.0 - - - I B, BASE CURRENT (ma) R θ B, TEMPERATURE COEFFICIENT (m/ C) -1.2-1.6-2.0-2.4 R B for BE -2.8-0.5 - -2.0-5.0 - - - - - -0 Figure 12. Collector Saturation Region Figure 13. BaseEmitter Temperature Coefficient 5

PACKAGE DIMENSIONS TO92 (TO226) CASE 2911 ISSUE AM NOTES: A B STRAIGHT LEAD 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. BULK PACK 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND P BEYOND DIMENSION K MINIMUM. L SEATING INCHES MILLIMETERS PLANE K DIM MIN MAX MIN MAX A 0.175 05 4.45 5. B 0.1 4.32 5.33 C 0.125 0.165 3.18 4.19 D 0.016 0.021 0.407 0.533 X X D G 0.045 0.055 1.15 1.39 H 0.095 0.5 2.42 2.66 G J 0.015 0.0 0.39 0. H J K 0.0 --- 12. --- C L --- 6.35 --- N 0.080 0.5 2.04 2.66 P --- 0. --- 2.54 SECTION XX R 0.115 --- 2.93 --- 1 N 0.135 --- 3.43 --- N STYLE 17: PIN 1. COLLECTOR 2. BASE 3. EMITTER R A B BENT LEAD TAPE & REEL AMMO PACK NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. P T MILLIMETERS SEATING PLANE K DIM MIN MAX A 4.45 5. B 4.32 5.33 C 3.18 4.19 D 0.40 0.54 G X X D G 2.40 2.80 J 0.39 0. K 12. --- J N 2.04 2.66 P 1. 4.00 C R 2.93 --- SECTION XX 3.43 --- 1 N ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 36752175 or 8003443860 Toll Free USA/Canada Fax: 36752176 or 8003443867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 8002829855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 29 Japan Customer Focus Center Phone: 8135817 6 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative BC487/D