True Room Temperature Bonding a novel process for the creation of health tech consumables ATB ir. Richard Bijlard Technogation - Invenios Technogation Invenios Dec 2014
Presentation Overview Invenios Group From Lab to POC Challenges at creating advanced consumables ATB (True Room Temperature Bonding) Applications
Invenios Worldwide Langen (Hessen) Germany Santa Barbara, California, USA Eindhoven Netherlands
Health Tech Trends: from Lab to POC Laboratory: Large degree of freedom, versatile, high-end Stationary, expensive, specialist-use..
Lab-On-a-Chip Select necessary functionalities for test Shrink in size and in price! possible to scale down? absolutely necessary? combination possible? controllable -> pre-programmed! inputs and outputs? unambiguous interpretation of results! reproducible? mass-producible? low cost?
Some necessary L-O-C functions I/O sample intake: capillary, active pump, process sequence control: valves,.. reagent availability: pre-loaded / externally connected Heating/cooling electrodes? fluid? Measurement / readout sample processing: separation? chemical / electical / optical on-chip, external display,
And if you do it right, you get a solution that is: Very portable! (true Point-of-care solution) Cheap (uses less reagents, sample..) Fast Easy-to-use Safe
Design & Construction of Consumables Base material: Paper: very cheap! Plastic: cheap, easy to process Glass: transparancy, low autofluorescence, thermally stable, resistant against solvents Silicon: very mature semiconductor processes and tools available Construction: depends on material(s) ideal situation: combine materials! application dictates formfactor. the smaller, the better! (cheaper, portable,..!) FOTURAN PSGC
Pre-loaded Consumables / Sensors Problem - Need to have locally coated/functionalised structures but chip needs to be hermetically closed - Glueing introduces toxicity - Anodic Bonding and Diffusion Bonding are NOT options:
Ambient (Room) Temperature Bonding (patented) (->2) True Room temperature < 30 o C (->1) Two or more substrates (different CTEs possible!) Thin film blocking layer on interface No glue or high temperatures Appropriate wavelength laser Very locally created plasma, so bulk of the material stays at room temperature
Room Temperature Bonding - Characteristics High bond strength > strength of the base material Low temperatures, heat impacted zone < 1 µm of bond joint Possible to create electrical leads in the same process step Embed fluids or biomaterial/-coatings (Fibronectin, Poly-acrylamide gel, PFTE / Teflon, ) Seals hermetically and in a vacuum, inert gas or even under water, if required Scalable process, designed for operating in clean room production lines
What can you bond? The following substrates can be bonded together in any combination: Several types of Glasses Quartz/Fuzed Silica Sapphire Silicon Silicon Nitride Silicon Oxide Metals (Gold, Titanium, ) Several plastics
Properties Comparison DIFFUSION ANODIC ADHESIVE Ambient Temperature (ATB ) High bond stability X X X Simple, low-cost process Surface Prep X X? X Applicable for materials with mismatched CTE s X X Chemically resistant? X Hermetically seals X X High transparency X X Temperature stable X Proprietary X Bonds in a vacuum X X X
DNA sequencing Chips, Lab-on-a-chip Dispensing Cancer Research Chip Electrofluidic lens
Application: Pressure Control Valve Made of glass Opening controlled by reference pressure Wavefront guides prevent bubbles Passive, implantable Very durable
Pressure Control Valve
Conclusions Trend towards Point Of Care requires small, smart and dedicated solutions All materials have pros and cons. advanced consumables combine best properties ATB enables connection of multiple materials on room temperature and does not harm biocoatings or materials
Thank you for your attention! Richard Bijlard Business Development Europe Technogation (an Invenios company) phone: 06-4759 4741 email: bijlard@technogation.com www.technogation.com Technogation Invenios Dec 2014