2018-03-08 VCSEL pulsed laser in small footprint QFN - 0.6 W pulsed power Preliminary Version 0.1 PLPVQ 940A Features: Multimode VCSEL Optical output power 0.6 W (pulsed) Laser wavelength 940 nm Laser aperture 10 µm (diameter) x 40 µm (pitch) Cost effective package for high volume applications Applications Flood illuminator for mobile applications Notes Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which can be hazardous to the human eye. Products which incorporate these devices have to follow the safety precautions given in IEC 60825-1 "Safety of laser products". Ordering Information Type: Peak wavelength Peak output power Ordering Code λ peak [nm] P opt [W] I F = 1 A, t p = 9 ms PLPVQ 940A 940 0.6 Q65112A6002 2018-08-10 1
Maximum Ratings Parameter Symbol Values Unit Operating temperature range T op 0... 60 C Storage temperature range T stg -40... 85 C Junction temperature T j 110 C Reverse voltage V R 5 V Forward current I F 0.75 A Surge current I FSM 1.2 A Output power (continuous wave) P cw 0.48 W Characteristics (I F = 1 A, t p = 9 ms, f = 60 Hz, T A = 25 C) Parameter Symbol Values Unit min typ max Peak wavelength 2) page 10 λ peak 932 940 948 nm Spectral width (FWHM) 2) page 10 Δλ 1.5 nm Peak output power 2) page 10 P opt 0.5 0.6 0.75 W Threshold current I th 0.11 A Forward voltage 2) page 10 V F 1.5 2.2 2.5 V Fall Time t f 1 ns Rise time t r 1 ns Aperture size 10 µm Field of view (HFOV) Θ 65 Field of view (VFOV) Θ 78 Wall plug efficiency WPE 27 % (after diffusor) Temperature coefficient of wavelength TC λ 0.07 0.1 nm / K Thermal resistance R th JS 22 K / W 2018-08-10 2
3) page 10 Relative Spectral Emission (typ) I rel = f(λ), P opt = 0.6 W, t p = 9 ms, T A = 25 C Optical Peak Output Power P opt = f(i F ), t p = 9 ms, T A = 25 C 3) page 10 P opt [a. u.] 1.0 PLPVQ 940A P opt [W] PLPVQ 940A 0.6 0.8 0.6 0.4 0.4 0.2 0.2 0.0 930 935 940 945 950 λ [nm] 3) page 10 Far-Field Illumination Pattern P opt = 0.6 W, d = 20 mm (distance to flat screen), T A = 25 C (rectangle shows HFOV & VFOV) 0.0 Forward Voltage3) page 10 V F = f(i F ), t p = 9 ms, T A = 25 C 0.0 0.2 0.4 0.6 0.8 1.0 1.2 I F [A] V F [V] PLPVQ 940A 2.2 2.0 1.8 1.6 1.4 0.0 0.2 0.4 0.6 0.8 1.0 1.2 IF [A] 2018-08-10 3
Package Outline Dimensions in mm. (tolerances are specified with ±0.1 mm) 2018-08-10 4
Reflow Soldering Profile Product complies to MSL Level 3 acc. to JEDEC J-STD-020E 300 C T 250 200 240 C 217 C t P t L T p OHA04525 245 C 150 t S 100 50 25 C 0 0 50 100 150 200 250 s 300 t Profile Feature Profil-Charakteristik Ramp-up rate to preheat* ) 25 C to 150 C Time t S T Smin to T Smax Ramp-up rate to peak* ) T Smax to T P Liquidus temperature Time above liquidus temperature Symbol Symbol t S T L t L Minimum 60 Pb-Free (SnAgCu) Assembly Recommendation 2 3 K/s 100 120 2 3 217 Maximum 80 100 OHA04612 Unit Einheit s K/s C s Peak temperature Time within 5 C of the specified peak temperature T P - 5 K Ramp-down rate* T P to 100 C Time 25 C to T P T P t P 245 260 10 20 30 All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range 3 6 480 C s K/s s 2018-08-10 5
Taping Dimensions in mm. Tape and Reel 8 mm tape with 2500 pcs. on 180 mm reel W 1 D 0 P 0 P 2 F E W A N 13.0 ±0.25 P 1 Label Direction of unreeling W 2 Direction of unreeling Leader: min. 400 mm * Trailer: min. 160 mm * *) Dimensions acc. to IEC 60286-3; EIA 481-D OHAY0324 2018-08-10 6
_< C). _< WET Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. Do not eat. Tape dimensions [mm] Tape dimensions in mm W P 0 P 1 P 2 D 0 E F 8 + 0.3 / -0.1 4 ± 0.1 2 ± 0.05 or 4 ± 0.1 Reel dimensions [mm] Reel dimensions in mm 2 ± 0.05 1.5 ± 0.1 1.75 ± 0.1 3.5 ± 0.05 A W N min W 1 W 2max 180 8 60 8.4 + 2 14.4 Barcode-Product-Label (BPL) Dry Packing Process and Materials OSRAM Moisture-sensitive label or print Barcode label Humidity indicator Barcode label Comparator check dot 5% 10% 15% If wet, parts still adequately dry. change desiccant If wet, examine units, if necessary bake units If wet, examine units, if necessary bake units CAUTION LEVEL If blank, see bar code label This bag contains MOISTURE SENSITIVE OPTO SEMICONDUCTORS 1. Shelf life in sealed bag: 24 months at < 40 C and < 90% relative humidity (RH). 2. After this bag is opened, devices that will be subjected to infrared reflow, vapor-phase reflow, or equivalent processing (peak package body temp. If blank, see bar code label a) Mounted within at factory conditions of 30 C/60% RH. Floor time see below b) Stored at 10% RH. 3. Devices require baking, before mounting, if: a) Humidity Indicator Card is > 10% when read at 23 C ± 5 C, or b) 2a or 2b is not met. 4. If baking is required, reference IPC/JEDEC J-STD-033 for bake procedure. Bag seal date (if blank, seal date is identical with date code). Date and time opened: Moisture Level 1 Floor time > 1 Year Moisture Level 4 Floor time 72 Hours Moisture Level 2 Floor time 1 Year Moisture Level 5 Floor time 48 Hours Moisture Level 2a Floor time 4 Weeks Moisture Level 5a Floor time 24 Hours Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours Desiccant Humidity Indicator MIL-I-8835 OSRAM OHA00539 Note: Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card. Regarding dry pack you will find further information in the internet. Here you will also find the normative references like JEDEC. 2018-08-10 7
_< C). _< 11 0 0144 Bin2: Q-1-20 Bin3: ML 2 220 C R 2a 11 0 (9D) D/C: 0144 Bin2: Q-1-20 Bin3: ML Temp ST 2 220 C R 2a Transportation Packing and Materials Barcode label Barcode label CAUTION LEVEL This bag contains MOISTURE SENSITIVE OPTO SEMICONDUCTORS 1. Shelf life in sealed bag: 24 months at < 40 C and < 90% relative humidity (RH). 2. After this bag is opened, devices that will be subjected to infrared reflow, vapor-phase reflow, or equivalent processing (peak package body temp. If blank, see bar code label a) Mounted within at factory conditions of 30 C/60% RH. Floor time see below b) Stored at 10% RH. 3. Devices require baking, before mounting, if: a) Humidity Indicator Card is > 10% when read at 23 C ± 5 C, or b) 2a or 2b is not met. 4. If baking is required, reference IPC/JEDEC J-STD-033 for bake procedure. Bag seal date (if blank, seal date is identical with date code). Date and time opened: Moisture Level 1 Floor time > 1 Year Moisture Level 4 Floor time 72 Hours Moisture Level 2 Floor time 1 Year Moisture Level 5 Floor time 48 Hours Moisture Level 2a Floor time 4 Weeks Moisture Level 5a Floor time 24 Hours Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours If blank, see bar code label OSRAM Opto Semiconductors (6P) BATCH NO: (1T) LOT NO: 210021998 123GH1234 Muster (X) PROD NO: 1 (9D) D/C: 0 425 (Q)QTY: 2000 LSY T676 Multi TOPLED Bin1: P-1-20 Temp ST 240 C R 3 260 C RT Additional TEXT R077 PACKVAR: (G) GROUP: R18 DEMY P-1+Q-1 OSRAM Opto Semiconductors (6P) BATCH NO: (1T) LOT NO: 210021998 123GH1234 Muster (X) PROD NO: 1 0 425 (Q)QTY: 2000 LSY T676 Multi TOPLED Bin1: P-1-20 240 C R 3 260 C RT Additional TEXT R077 PACKVAR: (G) GROUP: R18 DEMY P-1+Q-1 OSRAM Packing Sealing label OHA02044 Dimensions of transportation box in mm Width Length Height 200 ± 5 195 ± 5 30 ± 5 2018-08-10 8
Disclaimer OSRAM OS assumes no liability whatsoever for any use of this document or its content by recipient including, but not limited to, for any design in activities based on this preliminary draft version. OSRAM OS may e.g. decide at its sole discretion to stop developing and/or finalising the underlying design at any time. Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization.If printed or downloaded, please find the latest version in the Internet. Packing Please use the recycling operators known to you. We can also help you get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components* may only be used in life-support devices** or systems with the express written approval of OSRAM OS. *) A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or system. **) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be endangered. 2018-08-10 9
Glossary 1) Soldering temperature: 2 mm from bottom edge of case 2) Standard operating conditions: Standard operating conditions refer to pulses of 9 ms width at 60 Hz rate with 1 A operating current at T A = 25 C. 3) Typical Values: Due to the special conditions of the manufacturing processes of VCSEL Array, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 2018-08-10 10
Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com All Rights Reserved. 2018-08-10 11