IPC-A-610E COMMON INSPECTION ERRORS TRAINING CERTIFICATION TEST (DVD-71C) v.1

Similar documents
THROUGH-HOLE REWORK (DVD-41C) v.1

LEAD FREE SURFACE MOUNT ASSEMBLY TRAINING CERTIFICATION TEST (DVD-68C)

LEAD FREE CONVERSION IN ELECTRONICS ASSEMBLY TRAINING CERTIFICATION TEST (DVD-99C)

LEAD FREE SURFACE MOUNT REWORK TRAINING CERTIFICATION TEST (DVD-67C)

BALL GRID ARRAY REWORK TRAINING CERTIFICATION TEST (DVD-96C) v.2

HAND SOLDERING WITH LOW RESIDUE FLUXES (DVD-36C)

RAY S ESD PREVENTION SECRETS TRAINING CERTIFICATION TEST (DVD-75C) v.1

ESD CONTROL FOR MATERIAL HANDLERS TRAINING CERTIFICATION TEST (DVD-77C) v.3

SPECIFICATION FOR APPROVAL INDEX

Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards

TEA10402V15A0 Engineering Specification

Name Date Time to Complete

PRODUCT DATA SHEET. Eagle Eye Outdoor LED Module 5700K. RoHS Compliant. CUSTOMER :. DATE : REV : Rev. 2.0.

SMD Switch SI-C3436A General specification. Soldering conditions Reflow Soldering condition. Standard Reel Dimensions (mm) Packing specification

CLCC Solder Joint Life Prediction under Complex Temperature Cycling Loading

PRODUCT DATA SHEET. Eagle Eye Outdoor LED Module 3000K. RoHS Compliant. CUSTOMER :. DATE : REV : Rev. 1.0.

Lead Free Wave Soldering Project Update. Denis Barbini Webinar October 4, 2007

Product Series Specification Document

Thermal Characterization of Packaged RFIC, Modeled vs. Measured Junction to Ambient Thermal Resistance

CL-L102-C7D. 1. Scope of Application. These specifications apply to LED package, model CL-L102-C7D. 2. Part code

FORMULATION OF A NEW LIQUID FLUX FOR HIGH TEMPERATURE SOLDERING

A Quality Test Plan for Pb-Free Products. By Keith M. Sellers Managing Scientist NTS Baltimore

University of Maryland Department of Physics. Spring 2009 Final Exam 20. May (175 points) Post grades on web? (Initial, please) Yes No

Current Balance. Introduction

Specification of V-PORT XXXX-X-V05 Series

WHITE PAPER REPORT :

PRODUCT SPECIFICATION

Reference Only. Spec. No. JENF243G 0004G-01 P 1 / 12. Ferrite Bead Inductor BL02/BL03 Series

Unit 22: Sampling Distributions

Product Data Sheet PD-0053-A

A Method of Determining the Equivalent Thermal Conductivity of a Conductive Printed Wiring Board (PWB) Layer with a Quasi-Random Circular Hole Pattern

A model for circuits part 2: Potential difference

Chip tantalum capacitors (Fail-safe open structure type)

Optimizing Pb-Free SMT Process Parameters

Chip tantalum capacitors (Fail-safe open structure type)

הכינוס הלאומי ה- 13 של האיגוד הישראלי לאיכות בנובמבר 2015, תל אביב NPI בתעשיית האלקטרוניקה דב פרי יו"ר האיגוד הישראלי לאיכות

WIP201610P Series Engineering Specification

Electric Field Mapping

Experiment VIII Equipotentials and Fields

IMPORTANT Read these directions carefully:

Low Inductance Ceramic Capacitor (LICC)

Phys1220 Lab Electrical potential and field lines

Interpreting IPC-A-600 Requirements for Annular Rings and Laminate Cracks

S P E C I F I C A T I O N S GW5BTC65K00

TECHNICAL INFORMATION

APPROVAL SHEET ILJIN SEMICONDUCTOR CO., LTD. CUSTOMER : MODEL NO. : ISCL-T21RGBB ISSUED DATE : [ISCL-T21RGBB] [ CUSTOMER APPROVAL ]

Cyclic Bend Fatigue Reliability Investigation for Sn-Ag-Cu Solder Joints

Lead (Pb)-free Thick Film, Rectangular Commodity Chip Resistors

DEM F TMH-PW-N 2,4 TFT

APPROVAL SHEET (Preliminary)

APPROVAL SHEET. (Preliminary) ILJIN SEMICONDUCTOR CO., LTD White LED CUSTOMER : DEVICE NAME : MODEL NO. : ISCL-T11WC-90S ISSUED DATE :

WTSC144.xxx Wire Bonding Temperature Silicon Vertical Capacitor

S P E C I F I C A T I O N S GW6DMD**NFC

Electric Field Mapping

*Contents in this sheet are subject to change without prior notice.

STAT:2020 Probability and Statistics for Engineers Exam 2 Mock-up. 100 possible points

RS INDUSTRY LIMITED. RS Chip Array ESD Suppressor APPROVAL SHEET. Customer Information. Part No. : Model No. : COMPANY PURCHASE R&D

RADIOIODINE COLLECTION FILTER EFFICIENCY TESTING PROGRAM at F&J SPECIALTY PRODUCTS, INC. by FRANK M. GAVILA. Atlantic City, New Jersey June 2002

Technical Notes. Introduction. PCB (printed circuit board) Design. Issue 1 January 2010

Holt Integrated Circuits Device Reliability Report

The Increasing Importance of the Thermal Management for Modern Electronic Packages B. Psota 1, I. Szendiuch 1

The Digital Multimeter (DMM)

Ultraviolet LEDS as a Source of Emission for Resist Exposure on Printed Circuit Boards

NPN/PNP low V CEsat Breakthrough in Small Signal (BISS) transistor pair in a SOT457 (SC-74) Surface Mounted Device (SMD) plastic package.

MLCC with FLEXITERM. General Specifications GENERAL DESCRIPTION APPLICATIONS PRODUCT ADVANTAGES HOW TO ORDER

WW25R ±1%, ±5%, 2W Metal plate low ohm power chip resistors Size 2512 (6432)

WW25Q ±1%, ±5%, 1W Metal plate low ohm power chip resistors Size 2512 (6432)

POE INTERNATIONAL CORPORATION. SPECIFICATION OF MULTI-LAYER RADIAL-LEADED TYPE CAPACITOR Ver: 8 Page: 1

INPAQ. Specification. WIP252012S L Series. Product Name. Power Inductor. Size EIAJ Global RF/Component Solutions

Physics 102 Exam 2 Fall 2012

WW12C, WW08C, WW06C, WW04C, WW02C. Low ohm chip resistors ( power ) Size 1206, 0805, 0603, 0402, 0201

Surface mount technology - Environmental and endurance test methods for surface mount solder joint: Part 104: Monotonic bending strength test

MULTILAYER CERAMIC CAPACITORS

Lead (Pb)-free Thick Film, Rectangular Commodity Chip Resistors

Designing Information Devices and Systems I Fall 2017 Midterm 2. Exam Location: 150 Wheeler, Last Name: Nguyen - ZZZ

RS INDUSTRY LIMITED. RS Chip Single ESD Suppressor APPROVAL SHEET. Customer Information. Part No. : Model No. : COMPANY PURCHASE R&D

SPECIFICATION FOR LCD MODULE MODULE NO: AMC2004A-SPI REVISION NO: 00. Customer s Approval:

WHA900 U N M AT C H E D C O N T R O L T H E S E C R E T I S T H E S E N S O R

Product Data Sheet PD-0036-B. 3M PC Boardmount Plug and Receptacle, 2 mm 95X Series

CASTLE Unit 2-READING 1

8-Aug-10 PHYS Electric Field Mapping. Objective To map the equipotential lines and construct electric field line between two charged objects.

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

Impact of BGA Warpage on Quality. Mike Varnau

Electric Fields and Potentials

TE Connectivity Capacitive Products

A Guide to Board Layout for Best Thermal Resistance for Exposed Packages

IPC-1752 Supplier Training. Rev. 9, 10/12/09

ic-wg BLCC WGC PACKAGE SPECIFICATION

WIP201610P L Series Engineering Specification

MLCC with FLEXITERM. General Specifications GENERAL DESCRIPTION APPLICATIONS PRODUCT ADVANTAGES HOW TO ORDER C 104 K A Z 2 A

4. Phases 1 and 2: 85/85 and Thermal Shock

WIP252012P L Series Engineering Specification

PH213 Chapter 24 Solutions

No. STSE-CB7070A <Cat.No > SPECIFICATIONS FOR NICHIA BLUE LED MODEL : NSPB300B NICHIA CORPORATION -0-

Shenandoah University. (PowerPoint) LESSON PLAN *

Experimenting with 7.5 Million Pastings: A Situation. Joe Voelkel CQAS, RIT 46 th Annual FTC

Electric Field Mapping

Louisiana State University Physics 2102, Exam 1, February 5, 2009.

No. STLD-CW0164B <Cat. No SPECIFICATIONS FOR NICHIA WHITE LED MODEL NSPW500BS NICHIA CORPORATION

Laboratory 14: Ratio of Charge to Mass for the Electron

Transcription:

This test consists of twenty multiple-choice questions. All questions are from the video: IPC-A-610E Common Inspection Errors DVD-71C). Use the supplied Answer Sheet and circle the letter or word corresponding to your selection for each test item. If more than one answer appears to be correct, pick the answer that seems to be the most complete response. Should you wish to change an answer, erase your choice completely. When you are finished, check to make sure you have answered all of the questions. Turn in the test materials to the instructor. The passing grade for this test is 70% (14 correct answers), or better. Good luck! 1

ANSWER SHEET Name: Date: 1 A B C D 2 A B C D 3 A B C D 4 A B C D 5 A B C D 6 A B C D 7 A B C D 8 A B C D 9 A B C D 10 A B C D 11 Yes No 12 Yes No 13 Yes No 14 A B C D 15 Yes No 16 A B C D 17 A B C D 18 Yes No 19 Yes No 20 A B C D 2

1. Without an internationally recognized consensus workmanship standard, such as the IPC-A-610 a. each company would use its own standard b. the industry would lack a common inspection language c. there would be inconsistent product reliability 2. Over inspection can a. cost your company time and money b. make you more efficient c. make your products more reliable 3. Class 1, 2 and 3 inspection criteria is determined by a. a QA professional b. the inspector c. the customer 4. The inspector s job is to use the IPC-A-610 to judge if the solder connections are a. target or acceptable b. process indicators c. defects 5. Evaluate the acceptability of this solder joint a. target b. acceptable c. process indicator d. defect 3

6. Evaluate the acceptability of this solder joint for Class 2 and 3. a. target b. acceptable c. process indicator d. defect 7. When a Class 1 product is judged by Class 3 standards, it a. makes the product more desireable b. can cost your company unnecessary time and money c. creates a Class 3 product 8. Identify the side of the board for this through hole assembly. a. solder source side b. solder destination side c. secondary side d. bottom of the board 4

9. Minimum electrical clearance is based upon a. the thickness of the solder mask that covers a conductor b. how much voltage exists between conductors c. the clinching of component leads 10. The criteria for electrical conductor spacing may be found in a. Appendix A of the IPC-A-610 b. IPC-2221 Generic Standard on Printed Circuit Board Design c. the approved customer documentation for the assembly 11. Is this solder joint defective for Class 2 and 3? 12. Is this solder joint acceptable for Class 2 and 3? 5

13. Is this amount of solder depression acceptable for Class 2 and 3? 14. A minimum of 50% vertical fill may be allowed for Class 2 when a. there is a thermal heat sink plane surrounding the plated through hole b. products are designed for aerospace applications c. lead free solder is used 15. Can a circuit board assembly containing this part clearance be shipped for Class 2 and 3? 16. The minimum side joint length for a gull wing lead with a short foot length is a. 100% of the foot length b. 75% of the foot length c. 50% of the foot length d. 25% of the foot length 6

17. Solder should not touch the body of gull wing components except for a. fine pitch QFPs b. BGAs c. plastic SOICs and SOTs d. QFNs 18. Is this an example of a Bottom Termination Component (BTC)? 19. Would you evaluate this as a defective condition for Class 2 and 3? 20. Billboarding occurs when a chip component a. rotates onto the side of the termination edge during assembly b. stands on one termination end c. is soldered to traces instead of lands d. has defective terminations 7