TOSHIBA Field Effect Transistor Silicon N Channel MOS Type SSM6N37FU

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TOSHIBA Field Effect Transistor Silicon N Channel MOS Type SSM6N7FU High Speed Switching Applications Analog Switch Applications Unit: mm.v drive Low ON-resistance R DS(ON) =.6 Ω (max) (@V GS =. V) R DS(ON) =. Ω (max) (@V GS =.8 V) R DS(ON) =. Ω (max) (@V GS =. V) R DS(ON) =. Ω (max) (@V GS =. V) Absolute Maximum Ratings (Ta = C) (Q, Q Common) Characteristics Symbol Rating Unit Drain-Source voltage V DSS V Gate-Source voltage V GSS ± V Drain current DC I D Pulse I DP Power dissipation P D (Note) mw Channel temperature T ch C JEDEC Storage temperature range T stg to C JEITA TOSHIBA -JC Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in Weight: 6.8 mg(typ.) temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ( Handling Precautions / Derating Concept and Methods ) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). ma Note : Total rating Mounted on FR board (. mm. mm.6 mm, Cu Pad:.mm 6). mm.8 mm Marking(top view) 6 Equivalent Circuit (top view) 6 SU Q Q Start of commercial production - --

Electrical Characteristics (Ta = C) (Q, Q Common) Characteristics Symbol Test Condition Min Typ. Max Unit Drain-source breakdown voltage V (BR) DSS I D = ma, V GS = V V (BR) DSX I D = ma, V GS = - V V Drain cut-off current I DSS V DS = V, V GS = V μa Gate leakage current I GSS V GS = ± V, V DS = V ± μa Gate threshold voltage V th V DS = V, I D = ma.. V Forward transfer admittance Y fs V DS = V, I D = ma (Note)..8 S I D = ma, V GS =. V (Note).6. R DS (ON) I D = ma, V GS =. V (Note).6. I D = ma, V GS =.8 V (Note).66. Ω I D = ma, V GS =. V (Note).7.6 Input capacitance C iss Output capacitance C oss V DS = V, V GS = V, f = MHz. Reverse transfer capacitance C rss. Switching time Turn-on time t on V DD = V, I D = ma 8 Turn-off time t off V GS = to. V, R G = Ω 6 pf ns Drain-Source forward voltage V DSF I D = - ma, V GS = V (Note) -.9 -. V Note: Switching Time Test Circuit (a) Test Circuit. V IN V μs RG OUT V DD V DD = V R G = Ω Duty % V IN : t r, t f < ns Common source Ta = C (b) V IN (c) V OUT. V 9% % V V DD 9% % V DS (ON) t r t f t on t off Precaution Let V th be the voltage applied between gate and source that causes the drain current (I D ) to be low (ma for the SSM6N7FU). Then, for normal switching operation, V GS(on) must be higher than V th, and V GS(off) must be lower than V th. This relationship can be expressed as: V GS(off) < V th < V GS(on). Take this into consideration when using the device. Handling Precaution When handling individual devices that are not yet mounted on a circuit board, make sure that the environment is protected against electrostatic discharge. Operators should wear antistatic clothing, and containers and other objects that come into direct contact with devices should be made of antistatic materials. Thermal resistance R th (ch-a) and power dissipation P D vary depending on board material, board area, board thickness and pad area. When using this device, please take heat dissipation into consideration --

(Q, Q Common) Drain current ID (ma) Ta = C. V I D V DS V...6. V VGS =. V.8 V. V.8. Drain current ID (ma) I D V GS Ta = C C. C VDS = V.... Gate-source voltage V GS (V) 6 R DS (ON) V GS ID =ma C Ta = C C 6 8 6. V.8 V.V R DS (ON) I D VGS =.V Ta = C Gate-source voltage V GS (V) R DS (ON) Ta ID = m A / VGS =. V m A /.8 V m A /. V m A /. V Gate threshold voltage Vth (V).. V th Ta VDS = V ID = ma --

Forward transfer admittance Yfs (ms) Y fs I D VDS = V Ta = C Drain reverse current IDR (ma). C Ta = C I DR V DS C VGS = V D S... G I DR Capacitance C (pf) C V DS Ciss Coss Ta = C Crss f = MHz VGS = V. Switching time t (ns) toff tf ton tr t I D VDD = V VGS = to. V Ta = C RG = Ω P D T a Mounted on FR board. (. mm. mm.6 mm, Cu Pad:. mm 6) Power dissipation PD (mw) 8 6 --

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