High Power Infrared Emitter (940 nm) Version 1.4 SFH 4045N

215-11-12 High Power Infrared Emitter (94 nm) Version 1.4 Features: High Power Infrared LED Short switching time small package: (WxDxH) 3 mm x 2.65 mm x 1.2mm SMT Sidelooker Applications Interrupters, Lightcurtains Sensor technology Proximity sensor Touchscreen Industrial electronics Notes Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which can be hazardous to the human eye. Products which incorporate these devices have to follow the safety precautions given in IEC 6825-1 and IEC 62471. Ordering Information Type: Radiant Intensity Ordering Code I e [mw/sr] = 7 ma, t p = 2 ms 9 ( 4) Q65111A393 Note: Measured at a solid angle of Ω =.1 sr 215-11-12 1

Maximum Ratings (T A = 25 C) Parameter Symbol Values Unit Operation and storage temperature range T op ; T stg -4... 85 C Reverse voltage V R 5 V Forward current 7 ma Surge current (t p 1 µs, D = ) SM.7 A Total power dissipation P tot 14 mw ESD withstand voltage (acc. to ANSI/ ESDA/ JEDEC JS-1 - HBM) V ESD 2 kv Thermal resistance junction - ambient 1) page 12 R thja 54 K / W Thermal resistance junction - soldering point 2) page 12 R thjs 36 K / W Characteristics (T A = 25 C) Parameter Symbol Values Unit Peak wavelength ( = 7 ma, t p = 2 ms) Centroid wavelength ( = 7 ma, t p = 2 ms) Spectral bandwidth at 5% of I max ( = 7 ma, t p = 1 ms) (typ) λ peak 95 nm (typ) λ centroid 94 nm (typ) λ 42 nm Half angle (typ) ϕ ± 9 Dimensions of active chip area (typ) L x W.2 x.2 mm x mm Rise and fall time of I e ( 1% and 9% of I e max ) ( = 7 ma, R L = 5 Ω) Forward voltage ( = 7 ma, t p = 2 ms) Forward voltage ( = 7 ma, t p = 1 µs) Reverse current (V R = 5 V) Total radiant flux ( = 7 ma, t p =2 ms) (typ) t r, t f 12 ns (typ (max)) V F 1.6 ( 2) V (typ (max)) V F 2.8 V I R not designed for reverse operation µa (typ) Φ e 4 mw 215-11-12 2

Parameter Symbol Values Unit Temperature coefficient of I e or Φ e ( = 7 ma, t p = 1 ms) Temperature coefficient of V F ( = 7 ma, t p = 1 ms) Temperature coefficient of wavelength ( = 7 ma, t p = 1 ms) Grouping (T A = 25 C) (typ) TC I -.5 % / K (typ) TC V -1.3 mv / K (typ) TC λ.3 nm / K Group Min Radiant Intensity Max Radiant Intensity Typ Radiant Intensity = 7 ma, t p = 2 ms = 7 ma, t p = 2 ms = 7 ma, t p = 25 µs I e, min [mw / sr] I e, max [mw / sr] I e, typ [mw / sr] -U 4 8 42 -V 63 125 66 -AW 1 2 15 Note: measured at a solid angle of Ω =.1 sr Only one group in one packing unit (variation lower 2:1). Relative Spectral Emission I rel = f(λ), T A = 25 C 1 I rel % 8 3) page 12 OHF4134 3) page 12 Radiant Intensity I e / I e (7 ma) = f( ), single pulse, t p = 25 µs, T A = 25 C 1 1 I e I e (7 ma) OHF3827 6 1 5 4-1 1 2 5 8 85 9 95 nm 125 λ 1-2 1 2 3 1 5 1 5 1 ma 1 215-11-12 3

Max. Permissible Forward Current, max = f(t A ), R thja = 54 K/W 8 ma 7 6 5 4 3 2 1 OHF4264 3) page 12 Forward Current = f(v F ), single pulse, t p = 1 µs, T A = 25 C 1 A -1 1 5 1-2 5 1 5-3 OHF3828 2 4 6 8 C 1 T A 1-4.5 1 1.5 2 2.5 V 3 V F Permissible Pulse Handling Capability = f(t p ), T A = 25 C, duty cycle D = parameter.8 A.7 D = t P T t P T OHF4265 Permissible Pulse Handling Capability = f(t p ), T A = 85 C, duty cycle D = parameter.8 A.7 D = t P T t P T OHF4266.6.5.4.3.2.1 D =.5.1.2.3.5.1.2.5 1.6.5.4.3.2.1 D =.5.1.2.3.5.1.2.5 1 1-5 -4-3 1 1 1-2 1-1 1 t p 1 1 s 1 2 1-5 -4-3 1 1 1-2 1-1 1 t p 1 1 s 1 2 215-11-12 4

Radiation Characteristics I rel = f(ϕ), T A = 25 C 4 3 3) page 12 2 1 OHF4388 ϕ 1. 5.8 6.6 7.4 8.2 9 1 1. Package Outline.8.6.4 2 4 6 8 1 12 Dimensions in mm. Package Chipled 215-11-12 5

Approximate Weight:.1 mg Recommended Solder Pad Dimensions in mm. Note: - metalization layer is thicker than the solder resist layer Note: - recommended solder thickness: 12-15 µm 215-11-12 6

Reflow Soldering Profile Product complies to MSL Level 3 acc. to JEDEC J-STD-2D.1 3 C T 25 2 24 C 217 C t P t L T p OHA4525 245 C 15 t S 1 5 25 C 5 1 15 2 25 s 3 t Profile Feature Profil-Charakteristik Ramp-up rate to preheat* ) 25 C to 15 C Time t S T Smin to T Smax Ramp-up rate to peak* ) T Smax to T P Liquidus temperature Time above liquidus temperature Symbol Symbol t S T L t L Minimum 6 Pb-Free (SnAgCu) Assembly Recommendation 2 3 K/s 1 12 2 3 217 Maximum 8 1 OHA4612 Unit Einheit s K/s C s Peak temperature Time within 5 C of the specified peak temperature T P - 5 K Ramp-down rate* T P to 1 C Time 25 C to T P T P t P 245 26 1 2 3 All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range 3 6 48 C s K/s s 215-11-12 7

Taping Dimensions in mm [inch]. Tape and Reel 8 mm tape with 2 pcs. on 18 mm reel W 1 D P P 2 F E W A N 13. ±.25 P 1 Label Direction of unreeling W 2 Direction of unreeling Leader: min. 4 mm * Trailer: min. 16 mm * *) Dimensions acc. to IEC 6286-3; EIA 481-D OHAY324 215-11-12 8

_< C). _< WET Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. Do not eat. Version 1.4 Tape dimensions [mm] Tape dimensions in mm W P P 1 P 2 D E F 8 +.3 / -.1 4 ±.1 2 ±.5 or 4 ±.1 2 ±.5 1.5 ±.1 1.75 ±.1 3.5 ±.5 Reel dimensions [mm] Reel dimensions in mm A W N min W 1 W 2max 18 8 6 8.4 + 2 14.4 Barcode-Product-Label (BPL) EX XAM AMP MPL LE OSRAM Opto Semiconductors ors (6P) BATCH ENO: 123456789 E234 (1T) LOT NO: 123456789 (9D) D/M: D/C: 1234 (X) PROD NO: 123456789(Q)QTY: AMD) AMD/ D C 9999 (G) GROUP: LX XXXX RoHS Compliant Pack: RXX DEMY BIN1: XX-XX-X-XXX-X ML Temp ST X XXX C X XXX X_X123_1234.1234 _123 234.1234 X XX-XX-X-X X-X-X OHA4563 Dry Packing Process and Materials OSRAM Moisture-sensitive label or print Barcode label Humidity indicator Barcode label Comparator check dot 5% 1% 15% If wet, parts still adequately dry. change desiccant If wet, examine units, if necessary bake units If wet, examine units, if necessary bake units CAUTION This bag contains MOISTURE SENSITIVE OPTO SEMICONDUCTORS LEVEL If blank, see bar code label 1. Shelf life in sealed bag: 24 months at < 4 C and < 9% relative humidity (RH). 2. After this bag is opened, devices that will be subjected to infrared reflow, vapor-phase reflow, or equivalent processing (peak package body temp. If blank, see bar code label a) Mounted within at factory conditions of 3 C/6% RH. Floor time see below b) Stored at 1% RH. 3. Devices require baking, before mounting, if: a) Humidity Indicator Card is > 1% when read at 23 C ± 5 C, or b) 2a or 2b is not met. 4. If baking is required, reference IPC/JEDEC J-STD-33 for bake procedure. Bag seal date (if blank, seal date is identical with date code). Date and time opened: Moisture Level 1 Floor time > 1 Year Moisture Level 4 Floor time 72 Hours Moisture Level 2 Floor time 1 Year Moisture Level 5 Floor time 48 Hours Moisture Level 2a Floor time 4 Weeks Moisture Level 5a Floor time 24 Hours Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours Desiccant Humidity Indicator MIL-I-8835 OSRAM OHA539 Note: Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card. Regarding dry pack you will find further information in the internet. Here you will also find the normative references like JEDEC. 215-11-12 9

_< C). _< 11 144 Bin2: Q-1-2 Bin3: ML 2 2a 22 C R 11 (9D) D/C: 144 Bin2: Q-1-2 Bin3: ML Temp ST 2 22 C R 2a Version 1.4 Transportation Packing and Materials Barcode label Barcode label CAUTION This bag contains MOISTURE SENSITIVE OPTO SEMICONDUCTORS LEVEL If blank, see bar code label 1. Shelf life in sealed bag: 24 months at < 4 C and < 9% relative humidity (RH). 2. After this bag is opened, devices that will be subjected to infrared reflow, vapor-phase reflow, or equivalent processing (peak package body temp. If blank, see bar code label a) Mounted within at factory conditions of 3 C/6% RH. Floor time see below b) Stored at 1% RH. 3. Devices require baking, before mounting, if: a) Humidity Indicator Card is > 1% when read at 23 C ± 5 C, or b) 2a or 2b is not met. 4. If baking is required, reference IPC/JEDEC J-STD-33 for bake procedure. Bag seal date (if blank, seal date is identical with date code). Date and time opened: Moisture Level 1 Floor time > 1 Year Moisture Level 4 Floor time 72 Hours Moisture Level 2 Floor time 1 Year Moisture Level 5 Floor time 48 Hours Moisture Level 2a Floor time 4 Weeks Moisture Level 5a Floor time 24 Hours Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours OSRAM Opto Semiconductors (6P) BATCH NO: 2121998 (1T) LOT NO: 123GH1234 Muster (X) PROD NO: 1 (9D) D/C: 425 (Q)QTY: 2 LSY T676 Bin1: P-1-2 Multi TOPLED Temp ST 24 C R 3 26 C RT Additional TEXT R77 DEMY PACKVAR: R18 (G) GROUP: P-1+Q-1 OSRAM Opto Semiconductors (6P) BATCH NO: 2121998 (1T) LOT NO: 123GH1234 Muster (X) PROD NO: 1 425 (Q)QTY: 2 LSY T676 Bin1: P-1-2 Multi TOPLED 24 C R 3 26 C RT Additional TEXT R77 DEMY PACKVAR: R18 (G) GROUP: P-1+Q-1 OSRAM Packing Sealing label OHA244 Dimensions of transportation box in mm Width Length Height 2 ± 5 195 ± 5 3 ± 5 215-11-12 1

Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version in the Internet. Packing Please use the recycling operators known to you. We can also help you get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components* may only be used in life-support devices** or systems with the express written approval of OSRAM OS. *) A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or system. **) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be endangered. 215-11-12 11

Glossary 1) Thermal resistance: junction -ambient, mounted on PC-board (FR4), padsize 16 mm 2 each 2) Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g. metal block) 3) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 215-11-12 12