Alex Samarian School of Physics, University of Sydney, NSW 2006, Australia

Similar documents
Dynamic Phenomena in Complex Plasmas

PRINCIPLES OF PLASMA DISCHARGES AND MATERIALS PROCESSING

A DUSTY PLASMA PRIMER

Chapter 6. Summary and Conclusions

LECTURE 5 SUMMARY OF KEY IDEAS

Development of the Magnetized Dusty Plasma Experiment (MDPX)

Waves and Instabilities in Dusty Plasmas

MEASUREMENT OF THE ION DRAG FORCE IN A COMPLEX DC- PLASMA USING THE PK-4 EXPERIMENT

TMT4320 Nanomaterials November 10 th, Thin films by physical/chemical methods (From chapter 24 and 25)

Table of Content. Mechanical Removing Techniques. Ultrasonic Machining (USM) Sputtering and Focused Ion Beam Milling (FIB)

Repetition: Practical Aspects

MODERN PHYSICS OF PLASMAS (19 lectures)

ECE 989 Advanced Topics in Plasma Spring 2019

Keywords. 1=magnetron sputtering, 2= rotatable cathodes, 3=substrate temperature, 4=anode. Abstract

Plasma Deposition (Overview) Lecture 1

DEPOSITION OF THIN TiO 2 FILMS BY DC MAGNETRON SPUTTERING METHOD

Etching Issues - Anisotropy. Dry Etching. Dry Etching Overview. Etching Issues - Selectivity

6.5 Optical-Coating-Deposition Technologies

Modern Methods in Heterogeneous Catalysis Research: Preparation of Model Systems by Physical Methods

UNIT 3. By: Ajay Kumar Gautam Asst. Prof. Dev Bhoomi Institute of Technology & Engineering, Dehradun

Searching for non-newtonian forces with optically levitated microspheres!

Contents. Bibliografische Informationen digitalisiert durch

CVD: General considerations.

Hiden Analytical Ltd

Report on Visit to Ruhr University Bochum by International Training Program From October 1st to November 29th 2010

Theory of Gas Discharge

Chapter 7 Plasma Basic

FINITE COULOMB CRYSTAL FORMATION

Nanotechnology Fabrication Methods.

ARGON RF PLASMA TREATMENT OF PET FILMS FOR SILICON FILMS ADHESION IMPROVEMENT

E SC 412 Nanotechnology: Materials, Infrastructure, and Safety Wook Jun Nam

Plasma Chemistry Study in an Inductively Coupled Dielectric Etcher

Analysis of Particle Contamination in Plasma Reactor by 2-Sized Particle Growth Model

Mian Abbas, Jim Spann, Andre LeClair NASA Marshall Space Flight Center, Huntsville, AL

The effect of the chamber wall on fluorocarbonassisted atomic layer etching of SiO 2 using cyclic Ar/C 4 F 8 plasma

purposes is highly encouraged.

Effect of Gas Flow Rate and Gas Composition in Ar/CH 4 Inductively Coupled Plasmas

MODELING AND SIMULATION OF LOW TEMPERATURE PLASMA DISCHARGES

ELECTROHYDRODYNAMICS IN DUSTY AND DIRTY PLASMAS

DESIGN CONSIDERATIONS FOR A LABORATORY DUSTY PLASMA WITH MAGNETIZED DUST PARTICLES

Laser matter interaction

Theory of dust voids in plasmas

Dust collected in MAST and in Tore Supra. Nanoparticle growth in laboratory plasmas

Lecture 6 Plasmas. Chapters 10 &16 Wolf and Tauber. ECE611 / CHE611 Electronic Materials Processing Fall John Labram 1/68

Introduction to Theoretical and Applied Plasma Chemistry

Voids in Dusty Plasma of a Stratified DC Glow Discharge in Noble Gases

Formation, growth and behavior of dust particles in a sputtering discharge

FINAL REPORT. DOE Grant DE-FG03-87ER13727

INTRODUCTION TO THE HYBRID PLASMA EQUIPMENT MODEL

3.155J/6.152J Microelectronic Processing Technology Fall Term, 2004

Chapter 1 Introduction

Secondary Ion Mass Spectrometry (SIMS)

Characteristics and classification of plasmas

Sensors Plasma Diagnostics

Sputter Ion Pump (Ion Pump) By Biswajit

FINE PATTERN ETCHING OF SILICON USING SR-ASSISTED IONIZATION OF CF4 GAS

PIC-MCC simulations for complex plasmas

PHYSICAL VAPOR DEPOSITION OF THIN FILMS

Nanostructure. Materials Growth Characterization Fabrication. More see Waser, chapter 2

Lecture 6: Individual nanoparticles, nanocrystals and quantum dots

Introduction to Thin Film Processing

Introduction to Plasma

CHAPTER 6: Etching. Chapter 6 1

Thin Film Deposition. Reading Assignments: Plummer, Chap 9.1~9.4

Application Note GA-301E. MBMS for Preformed Ions. Extrel CMS, 575 Epsilon Drive, Pittsburgh, PA I. SAMPLING A CHEMICAL SOUP

Research Article Propagation Characteristics of Oblique Incident Terahertz Wave in Nonuniform Dusty Plasma

6. Interstellar Medium. Emission nebulae are diffuse patches of emission surrounding hot O and

PHOTOELECTRON SPECTROSCOPY IN AIR (PESA)

Secondary ion mass spectrometry (SIMS)

Comparison of hollow cathode and Penning discharges for metastable He production

1 EX/P4-8. Hydrogen Concentration of Co-deposited Carbon Films Produced in the Vicinity of Local Island Divertor in Large Helical Device

Reduced MHD. Nick Murphy. Harvard-Smithsonian Center for Astrophysics. Astronomy 253: Plasma Astrophysics. February 19, 2014

Hiden EQP Applications

K. Takechi a) and M. A. Lieberman Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, California 94720

Ericson Lopez Quito Astronomical Observatory ( Ecuador) and STScI. MARLAM, September 27th, 2013

12. SHOCK WAVE PROPAGATION THROUGH NON- EQUILIBRIUM CLUSTER PLASMA

Effect of Spiral Microwave Antenna Configuration on the Production of Nano-crystalline Film by Chemical Sputtering in ECR Plasma

Chapter 7. Plasma Basics

Simulations of dusty plasmas using a special-purpose computer system for gravitational N-body problems

Wafer holders. Mo- or Ta- made holders Bonding: In (Ga), or In-free (clamped) Quick and easy transfer

A review of plasma thruster work at the Australian National University

LECTURE NOTES. Ay/Ge 132 ATOMIC AND MOLECULAR PROCESSES IN ASTRONOMY AND PLANETARY SCIENCE. Geoffrey A. Blake. Fall term 2016 Caltech

Chapter 5: Nanoparticle Production from Cathode Sputtering. in High-Pressure Microhollow Cathode and Arc Discharges

Atomic layer deposition of titanium nitride

Dynamization evolution of Dry Etch Tools in Semiconductor Device Fabrication Gordon Cameron Intel Corp (November 2005)

Figure 1.1: Ionization and Recombination

Electrical Discharges Characterization of Planar Sputtering System

M. Audronis 1 and F. Zimone 2 1. Nova Fabrica Ltd. 1. Angstrom Sciences Inc.

Chapter 10. Nanometrology. Oxford University Press All rights reserved.

Film Deposition Part 1

Copyright 1996, by the author(s). All rights reserved.

PHYSICS (PHYS) Physics (PHYS) 1. PHYS 5880 Astrophysics Laboratory

Solutions for Assignment-8

Extrel Application Note

MODELING PLASMA PROCESSING DISCHARGES

1. INTRODUCTION 2. EXPERIMENTAL SET-UP CHARACTERIZATION OF A TUBULAR PLASMA REACTOR WITH EXTERNAL ANNULAR ELECTRODES

Graphene Fundamentals and Emergent Applications

MICROCHIP MANUFACTURING by S. Wolf

A novel sputtering technique: Inductively Coupled Impulse Sputtering (ICIS)

Plasma etching. Bibliography

Transcription:

Alex Samarian School of Physics, University of Sydney, NSW 2006, Australia

What is Dusty (Complex) Plasma? Laboratory Dusty Plasma Why Study Complex (Dusty) Plasma? Worldwide Research Activities Complex Plasma Laboratory at University of Sydney Materials Fabrication

Complex (dusty) plasma Dusty plasmas occur naturally Planetary rings Comets Interstellar gas Noctilucent clouds (upper atmosphere) Combustion products (fossil fuel MHD generators, solid fuel rocket exhausts) Dust generated during plasma processing operations which use reactive gases Electrode and wall erosion

Complex (dusty) plasma Plasma contains nano- or microsized particles In discharge plasma, particles become negatively charged due to impact of more mobile electrons Presence of dusts changes plasma properties Charged particles can form arrays: plasma crystal is an experimental realisation of strongly coupled plasma Plasma Crystal Γ = 2 Qd πε dkt 4 0 d exp d λ D >> 1

FC6 Features of Complex Plasma Micro-particles can be visualized individually Plasma time scales are slowed down (e.g. the dust plasma frequency is about 10 Hz) - plasma studies in slow motion Damping is small (neutral gas pressure is typically less than 1 mbar) - studies of fast processes Micro-particles are easily manipulated (e.g. by laser light pressure) - manipulation experiments

Slide 5 FC6 Unlike classic plasma where we consider the charge to be constant on each particulates, in complex plasma system, the charge on dust particles varies with time and position. And this open a completely new and fasicinating field in physics Felix Cheung, 29/08/2002

Laboratory dusty plasma Ions v i Sheath Boundary E F E, F th F g, F i Radius = a Charge = Z d e where Zd ~ f(r,t) >> 1 T rf powered electrode

Laboratory dusty plasma Actual View Experimental chamber and image of test dust particles levitated above the electrode. The test grains are generated in the discharge (power up to 200W, pressure up to 1 torr) by electrode sputtering.

Laboratory dusty plasma Planar-2 ρ =199±4µm Planar-3 ρ =242±2µm Planar-4 ρ =289±3µm Planar-6 (1,5) ρ =406±4µm Planar-7 (1,6) ρ =418±4µm Planar-8 (1,7) ρ =451±3µm Planar-9 (2,7) ρ =454±4µm Planar-10 (3,7) ρ =495±2µm Planar-11 (3,8) ρ =487±1µm

Why study complex plasmas? Such plasmas are of astrophysical interest (planetary rings, comets, intergalactic space) Need to control the dust produced during plasma processing Basic physics of interaction of plasmas with solids New phenomena - particles become charged and can form plasma crystals which can serve as model systems for the solid state phenomena New wave modes in dusty plasmas Instabilities in plasma crystals Opportunities for production of novel materials in nano- and micro- particle form (non-equilibrium plasma chemistry) Micro-diagnostic probes Environmental interest - noctilucent clouds

Worldwide research activities Plasma crystals Charging of dust Instabilities Japan, USA, Germany, France, UK, Russia, Holland Complex plasma in microgravity condition 1996 - first parabolic flight (Max Plank Institute, Germany, ESA) 1997 - first experiment on board of space station Mir (IVTAN, RAS) 1999 - IMF program (Germany & Russia, later joined by 8 other countries) 2001 - PKE-1 experiments started on board of ISS (ESA, NASA) 2002 - Materials research on PKE installation (leaded by French team) Control dusts during plasma processing (IBM, Sony) Dusts near wall region of plasma reactors (France, ITERA) Complex plasma in the Universe (NASA)

Complex Plasma in Sydney 1. Sergey Vladimirov 2. Brian James 3. Felix Cheung 4. Neil Cramer 5. William Tsang 6. Alex Samarian 2 3 1 6 5 4

Complex Plasma Laboratory Dynamical phenomena Dust Oscillation Dust Vortices Dust Cluster Rotation Charging of Dust particles Phase Transition Diffusion Dust as novel diagnostic tool

CPL Publications 2001 Self-excited vertical oscillations in an rf-discharge dusty plasma Physical Review E, 64, 025402(Rapid Communication) (2001). Plasma Kinetics around a Dust Grain in an Ion Flow Physical Review E, Vol. 63, No. 1, Pp. 017401/1-4 (2001) Sheath measurement in rf-discharge plasma with dust grains Physics Letters A, 287, 125 (2001) Dynamics of the Charging and Motion of a Macroparticle in a Plasma Flow Physical Review E, Vol. 63, No. 4, Pp. 045401( Rapid Communication )/1-3 (2001) Positively charged particles in dusty plasmas Physical Review E, 64, 056407 (2001) Theory of Collision-dominated Dust Voids in Plasmas Physical Review E, Vol. 63, No. 5, Pp. 056609/1-11 (2001) Behaviour of Dust Grain in the Double Layer of an Electric Probe in a Gas- Discharge Plasma Physics Reports, 27, 340 (2001) Interaction of a Rodlike Charged Macroparticle with a Flowing Plasma Physical Review E, Vol. 64, No. 2, Pp. 026403/1-7 (2001) Self-excited motion of Dust Particles in a Inhomogeneous Plasma Physics Letters A, 289, 240 (2001) Oscillations in a Chain of Rod-shaped Colloidal Particles in a Plasma Physical Review E, Vol. 64, No. 3, Pp. 035402(Rapid Communication)/1-4 (2001) 2002 Rotation of Coulomb clusters in magnetised dusty plasma Physica Scripta, T98, 143 (2002) Diffusion and Dynamics of Macro-particles in a Complex Plasma Physics of Plasmas, Vol. 9, No. 3, Pp. 835-840 (2002) Stability of Particle Arrangements in a Complex Plasma Physical Review E, Vol. 65, No. 4, Pp. 046416/1-4 (2002) Criteria of Phase Transitions in a Complex Plasma Physical Review Letters, Vol. 88, No. 24, Pp. 245002/1-4 (2001) Formation of vertical and horizontal dust vortexes in an RF-discharge plasma Physica Scripta, T98, 123 (2002) Comment on "Dependence of the Dust-Particle Charge on Its Size in a Glow- Discharge Plasma" Physical Review Letters, Vol. 89, No. 22, P. 229501 (2002) Optical diagnostics of plasma and particle in an atmospheric pressure dusty plasma Physica Scripta, 66, 82 (2002) Vibrational Modes in Plasma Crystals due to Nonlinear temperature Distribution in Gas Discharge Plasmas 2003 Rotation of Coulomb crystals in magnetized inductively coupled complex plasma IEEE Transaction Plasma Science 31, Issue 1 (2003) The rotation of planar-2 to planar-12 dust clusters in an axial magnetic field New Journal of Physics, Focus Issue on Complex Plasma (2003)

Materials fabrication Grow particles Nano to microsize Unifom size Particles can be coated - examples metal coating using auxiliary magnetron sputtering source a -C:H coating of SiO 2 particles Alumina coating of fluorescent particles to protect particle against degradation and aging and to improve adhesion

Growth of particles Reactive species are generated by dissociation/ionisation of gases in discharge (e.g. in fluorocarbon plasmas used for semiconductor processing) gas phase polymerisation produces molecules which are precursors for high molecular weight compounds (~ 100,000 amu) these act as nuclei for few hundred nanometer size amorphous particles (ex situ TEM) which grow finally to micrometre-sized particles Using capacitively-coupled reactor gas phase products studied using FTIR Particle growth monitored by laser scattering Concentration of gas phase products correlated with particle production

Growth of particles Argon/methane and argon/acetylene capacitivelycoupled rf plasmas. Gas phase products studied using FTIR; Particle growth monitors by laser scattering and laser absorption Strong evidence that C 2 H x is precursor for particle growth Particle growth occurs spontaneously in argon/acetylene plasma Occurs in argon/methane transiently when acetylene added

Materials Fabrication Uniform Ion Flow Wake Ion Cone Wafer Wafer

Please visit our Complex Plasma Laboratory website at: http://www.physics.usyd.edu.au/plasma/complex/index.html

Dust in plasma processing Particles produced during etching processes Dust charges and levitates in sheath above silicon wafer When plasma extinguished, dust falls on wafer Ways devised to remove suspended dust As feature size decreases, and inductively-coupled devices become more common, deposition of nanometre sized particles during processing is new problem Efficiency of silicon solar cells improved if nanometre-sized dust particles formed in silane discharge are imbedded in deposited silicon film Back

FC4 Examples of Complex Plasma Nebulae Comet Tails Planet Rings In nature, in the universe

Slide 20 FC4 Unlike classic plasma where we consider the charge to be constant on each particulates, in complex plasma system, the charge on dust particles varies with time and position. And this open a completely new and fasicinating field in physics Felix Cheung, 29/08/2002

FC5 Examples of Complex Plasma In our world, in the laboratory wafer MHD Generator Microelectronics Solid Propellant European TOR

Slide 21 FC5 Unlike classic plasma where we consider the charge to be constant on each particulates, in complex plasma system, the charge on dust particles varies with time and position. And this open a completely new and fasicinating field in physics Felix Cheung, 29/08/2002

PLASMA CRYSTALS IN SPACE: EXPERIMENTS IN WEIGHTLESS CONDITIONS IN THE SPACE STATIONS

Charge Mechanism for Dust Back

Dusty Plasma Experiments