MC475B Quad Type D FlipFlop The MC475B quad ype D flipflop is coruced wih MOS Pchannel and Nchannel enhancemen mode devices in a single monolihic srucure. Each of he four flipflops is posiiveedge riggered by a common clock inpu (C). An acivelow rese inpu (R) asynchronously reses all flipflops. Each flipflop has independen Daa (D) inpus and complemenary oupus (Q and Q). These devices may be used as shif regiser elemens or as ype T flipflops for couner and oggle applicaio. Feaures Complemenary Oupus Saic Operaion All Inpus and Oupus Buffered Diode Proecion on All Inpus Supply Volage Range = 3.0 Vdc o 8 Vdc Oupu Compaible wih Two LowPower TTL Loads or One LowPower Schoky TTL Load Funcional Equivalen o TTL 7475 PbFree Packages are Available* MAXIMUM RATINGS olages Referenced o V SS ) Parameer Symbol Value Uni DC Supply Volage Range V DD 0.5 o +8.0 V Inpu or Oupu Volage Range (DC or Traien) Inpu or Oupu Curren (DC or Traien) per Pin V in, V ou 0.5 o V DD + 0.5 I in, I ou ±0 ma Power Dissipaion per Package (Noe ) P D 500 mw Ambien Temperaure Range T A 55 o +25 C Sorage Temperaure Range 65 o +50 C Lead Temperaure (8Second Soldering) 260 C Sresses exceeding Maximum Raings may damage he device. Maximum Raings are sress raings only. Funcional operaion above he Recommended Operaing Condiio is no implied. Exended exposure o sresses above he Recommended Operaing Condiio may affec device reliabiliy.. Temperaure Deraing: Plasic P and D/DW Packages: 7.0 mw/ C From 65 C To 25 C This device conai proecion circuiry o guard agai damage due o high saic volages or elecric fields. However, precauio mus be aken o avoid applicaio of any volage higher han maximum raed volages o his highimpedance circui. For proper operaion, V in and V ou should be corained o he range V SS in or V ou ) V DD. Unused inpus mus always be ied o an appropriae logic volage level (e.g., eiher V SS or V DD ). Unused oupus mus be lef open. V ORDERING INFORMATION Device Package Shipping MC475BCP PDIP6 25 Unis/Rail MC475BCPG MC475BD SOIC6 48 Unis/Rail MC475BDG MC475BDR2 SOIC6 2500/Tape & Reel MC475BDR2G MC475BFEL PDIP6 P SUFFIX CASE 648 6 SOIC6 D SUFFIX CASE 75B SOEIAJ6 F SUFFIX CASE 966 A = Assembly Locaion WL, L = Wafer Lo YY, Y = Year WW, W = Work Week G = PbFree Package PDIP6 (PbFree) SOIC6 (PbFree) SOIC6 (PbFree) SOEIAJ6 6 6 MARKING DIAGRAMS MC475BCP AWLYYWWG 475BG AWLYWW MC475B ALYWG 25 Unis/Rail 48 Unis/Rail 2500/Tape & Reel 2000/Tape & Reel MC475BFELG SOEIAJ6 (PbFree) 2000/Tape & Reel *For addiional informaion on our PbFree sraegy and soldering deails, please download he ON Semiconducor Soldering and Mouning Techniques Reference Manual, SOLDERRM/D. For informaion on ape and reel specificaio, including par orienaion and ape sizes, please refer o our Tape and Reel Packaging Specificaio Brochure, BRD80/D.
MC475B TRUTH TABLE Inpus R D0 D Q Q V SS 2 3 4 5 6 7 8 6 5 4 3 2 0 Figure. Pin Assignmen 9 Oupus Clock Daa Rese Q Q V DD D3 D2 0 0 0 X Q Q X X 0 0 X = Don Care C No Change 9 4 5 2 3 CLOCK RESET D0 D D2 D3 Q Q V DD = PIN 6 V SS = PIN 8 Figure 2. Block Diagram 2 3 7 6 0 5 4 Figure 3. Timing Diagram Figure 4. Funcional Block Diagram 2
MC475B ELECTRICAL CHARACTERISTICS olages Referenced o V SS ) Î 55 C 25 C ÎÎ 25 C V DD ÎÎ TypÎ Characerisic Symbol Vdc ÎÎ Min Max Min (Noe 2) Max Min Î Max Uni Oupu Volage 0 Level V Î V in = V DD or 0 Î OL 0 0.05 Vdc 0 0.05Î 0 Î 0.05 0.05 5 0.05Î 0 Î 0.05 0.05 Level Î V in = 0 or V DD Î V OH 4.95 Î 4.95 Î 4.95 Vdc 0 9.95 9.95 0 9.95 5 4.95 Î 4.95 5 Î 4.95 Î Inpu Volage 0 Level Î V IL ÎÎ Vdc Î O = 4.5 or 0.5 Vdc).5 2.25.5.5 O = 9.0 or.0 Vdc) 0 3.0Î 4.50Î 3.0 3.0 Î O = 3.5 or.5 Vdc) 5 4.0Î 6.75Î 4.0 4.0 Level Î O = 0.5 or 4.5 Vdc) Î V IH ÎÎ Vdc Î O =.0 or 9.0 Vdc) O =.5 or 3.5 Vdc) 0 3.5 7.0 3.5 Î 7.0 2.75 3.5 5.50Î 7.0 5 8.25 Oupu Drive Curren I Î OH = 2.5 Vdc) Source Î OH madc 3.0 Î 2.4 4.2Î.7 Î OH = 4.6 Vdc) 0.64 0.5 0.88 0.36 OH = 9.5 Vdc) 0.6.3 2.25 0.9 Î OH = 3.5 Vdc) 5 4.2 3.4 8.8Î 2.4 Î OL = 0.4 Vdc) Sink OL = 0.5 Vdc) Î I OL 0.64 Î 0.5 0.88Î 0.36 madc 0.6.3 2.25 0.9 Î OL =.5 Vdc) 5 4.2 Î 3.4 8.8Î 2.4 Î Inpu Curren Î I in 5 ± 0.Î ±0.0000Î ± 0. ±.0 Adc Î Inpu Capaciance Î C in Î in = 0) Î Î 7.5 pf Quiescen Curren I Î (Per Package) Î DD 0.005 50 Adc 0 0Î 0.00Î 300 5 20Î 0.05Î 20 600 Î Toal Supply Curren (Noe 3, 4) Î I T ÎÎ I T = (.7 A/kHz) f + I DD Adc (Dynamic plus Quiescen, 0 I Î Per Package) 5 ÎÎ T = (3.4 A/kHz) f + I DD I T = ( A/kHz) f + I DD (C Î L = 50 pf on all oupus, all buffers swiching) 2. Daa labelled Typ is no o be used for design purposes bu is inended as an indicaion of he IC s poenial performance. 3. The formulas given are for he ypical characerisics only a 25 C. 4. To calculae oal supply curren a loads oher han 50 pf: I T (C L ) = I T (50 pf) + (C L 50) Vfk where: I T is in A (per package), C L in pf, V = DD V SS ) in vols, f in khz is inpu frequency, and k = 0.004. 3
MC475B SWITCHING CHARACTERISTICS (Noe 5) (C L = 50 pf, T A = 25 C) Î All Types V DD Î Typ Characerisic Symbol Vdc Min (Noe 6) Max Uni Oupu Rise and Fall Time TLH, THL Î TLH, THL = (.35 /pf) C L + 32 Î Î Î 00 200 TLH, THL = (0.6 /pf) C L + 20 0 50 00 TLH, THL = (0.4 /pf) C L + 20 Î Î 5 Î 40 80 Propagaion Delay Time Clock o Q, Q Î PLH, PHL Î PLH, PHL = (0.9 /pf) C L + 75 220 400 PLH, PHL = (0.36 /pf) C L + 72 Î Î 0 Î 90 60 PLH, PHL = (0.26 /pf) C L + 57 5 70 20 Î Î Propagaion Delay Time Rese o Q, Q PHL = (0.9 /pf) C L + 280 Î PHL, PLH PHL = (0.36 /pf) C L + 2 PHL = (0.26 /pf) C L Î Î Î 0 325 Î 30 500 200 + 87 5 00 50 Clock Pulse Widh Î WH Î 250 Î 0 0 00 Î 45 5 75 35 Rese Pulse Widh WL Î 200 00 0 80 Î 40 5 60 30 Clock Pulse Frequency f cl Î 0 4.5 Î 2.0 mhz 5 4 6.5 Clock Pulse Rise and Fall Time TLH, THL Î 0 Î 5 s 5 4.0 Daa Seup Time su 20 60 Î 0 50 Î 25 5 40 20 Daa Hold Time h Î 0 80 40 40 Î 20 5 30 5 Rese Removal Time rem 250 25 Î 5 80 40 5. The formulas given are for he ypical characerisics only a 25 C. 6. Daa labelled Typ is no o be used for design purposes bu is inended as an indicaion of he IC s poenial performance. 0 00 50 4
MC475B PACKAGE DIMENSIONS PDIP6 CASE 64808 ISSUE T A 6 9 8 B NOTES:. DIMENSIONING AND TOLERANCING PER ANSI Y4.5M, 982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. H G F D 6 PL S C K 0.25 (0.00) M T SEATING T PLANE A M J L M INCHES MILLIMETERS DIM MIN MAX MIN MAX A 0.740 0.770 8.80 9.55 B 0.250 0.270 6.35 6.85 C 0.45 0.75 3.69 4.44 D 0.05 0.02 0.39 0.53 F 0.040 0.70.02.77 G 0.00 BSC 2.54 BSC H 0.050 BSC.27 BSC J 0.008 0.05 0.2 0.38 K 0.0 0.30 2.80 3.30 L 0.295 0.305 7.50 7.74 M 0 0 0 0 S 0.020 0.040 0.5.0 SOIC6 CASE 75B05 ISSUE J A 6 9 8 B P 8 PL 0.25 (0.00) M B S NOTES:. DIMENSIONING AND TOLERANCING PER ANSI Y4.5M, 982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.5 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.27 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. T SEATING PLANE G K C D 6 PL 0.25 (0.00) M T B S A S M R X 45 J F MILLIMETERS INCHES DIM MIN MAX MIN MAX A 9.80 0.00 0.386 0.393 B 3.80 4.00 0.50 0.57 C.35.75 0.054 0.068 D 0.35 0.49 0.04 0.09 F 0.40.25 0.06 0.049 G.27 BSC 0.050 BSC J 0.9 0.25 0.008 0.009 K 0.0 0.25 0.004 0.009 M 0 7 0 7 P 5.80 6.20 0.229 0.244 R 0.25 0.50 0.00 0.09 5
MC475B PACKAGE DIMENSIONS SOEIAJ6 CASE 9660 ISSUE A e 6 9 Z b D A H E A 0.3 (0.005) M 0.0 (0.004) 8 E VIEW P M L E Q L DETAIL P c NOTES: М. DIMENSIONING AND TOLERANCING PER ANSI Y4.5M, 982. М 2. CONTROLLING DIMENSION: MILLIMETER. М 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.5 (0.006) PER SIDE. М 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. М 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.08). MILLIMETERS INCHES DIM MIN MAX MIN MAX A 2.05 0.08 A 0.05 0.20 0.002 0.008 b 0.35 0.50 0.04 0.020 c 0.0 0.20 0.007 0.0 D 9.90 0.50 0.390 0.43 E 5.45 0.20 0.25 e.27 BSC 0.050 BSC H E 7.40 8.20 0.29 0.323 L 0.50 0.85 0.020 0.033 L E.0.50 0.043 0.059 M 0 0 0 0 Q 0.70 0.90 0.028 0.035 Z 0.78 0.03 hp://oemi.com 6