PART NO. : EOH-KTxRPB0-EG. Part Description: Super Top LED. ( STL / E5 Series)

Transcription

1 Part Description: Super Top LED ( STL / E5 Series)

2 Features InGaN and AlInGaP Technology High Flux Output Lambertian Distribution Pattern Flexible Lens Design Good Reliability Performance Pb free & RoHS Compliant Product Applications Illumination LCD Backlight Automotive Application Flashlight Architectural Lighting Medical Applications Indicator / Decoration Outline Drawings Notes: 1. The anode side of the device is denoted by a hole in the lead frame. 2. All dimensions are in millimeters. 3. All dimensions without tolerances are for reference only. Beam Pattern % 75% 50% 25% 0% 25% 50% 75% 100% I v (%) - 2 -

3 Absolute Maximum Ratings at T A = 25 C Parameter Symbol Typ. Max. Unit DC Forward Current [a] I F ma Peak Pulsed Forward Current [b,c] I peak ma Power Dissipation P D Watt Reverse Voltage (I R = 10µA) V R - >5 V LED Junction Temperature T J C Operating Temperature Range [d] T OPR ~ + 85 C Storage Temperature Range T sto ~ C Total Including Angle [e] θ 0.9V Deg Spectra Half width Δλ 25 - nm Notes: [a] The maximum forward current can be applied only at the condition that the LED junction temperature is below the maximum. A proper heat sink is required to attach LED if the forward driving current is above 150mA. [b] Please contact our sales persons for further requirements of heat sink and thermal management. [c] Duty Ratio=1/10,Pulse Width=10ms. [d] When LED is used at high temperature, the driving current should be decreased to keep LED from damage. [e] Viewing angle 0.9V is the including angle at which 90% of total luminous flux is captured. Electrical and Optical Characteristics at T A = 25 C Part Number Driving Current I F (ma) Total Flux Φv(lm) Viewing Angle 2θ 1/2 Chromaticity Forward Voltage V F (v) I R V R = 5V Thermal Resistance θjs( C /W) Min. Typ. Typ. Typ. Typ. Max. Max. Typ. EOH-KTWRPB0-EG (0.31,0.32) EOH-KTMRPB0-EG (0.41,0.39) Note: 1. θjs means thermal resistance between LED junction to heat slug of LED

4 Intensity Distribution Table Part Number 0K Total Flux Bin 0L EOH-KTWRPB0-EG EOH-KTMRPB0-EG Note: 1. Bin with Less Distribution. Total Luminous Flux Bin Rank Total Flux Φv F =350mA Min. Max K L Note: 1. Measurement Uncertainty of the Total flux: ±15%. Forward Voltage Bin Rank Color White Warm White Forward Voltage V F F =350mA min max A B C D Note: 1. Measurement Uncertainty of the Voltage: ±0.05V

5 Cool White Chromaticity Coordinates Specifications for Bin Grading WA WB X Y WC WD X Y WE WF X Y WG WH X Y WJ WK X Y WL WM X Y WN WP X Y WQ WR X Y WS WT X Y K 5000K K WR CIE_y K 8300K WA WB 7000K WD WE WF 6350K WG WH WJ WK WL WM WN WP WQ WS WT WC CIE_x Note: 1. Measurement Uncertainty of the Chromatic Coordinates: ±

6 Warm White Chromaticity Coordinates Specifications for Bin Grading MA MB X Y MC MD X Y ME MF X Y MG MH X Y MJ MK X Y ML MM X Y MN MP X Y MQ MR X Y MS MT X Y MU MV X Y MW X Y CIE_y K MA MB 3820K 4150K MG MD MH ME MM MJ 3050K 3375K 3500K MR MN MK MV MS MP ML MW MT MQ 2950K MU 2650K MC MF CIE_x Note: 1. Measurement Uncertainty of the Chromatic Coordinates: ±

7 Typical Electrical / Optical Characteristics Curves ( 25 Ambient Temperature Unless Otherwise Noted ) 350 I F (ma) (%) V R (V) Fig.1 Forward Current vs. Forward Voltage Fig.3 Reverse Current vs. Reverse Voltage 0 V F (v) I R (μa) Relative Luminous Intersity Fig.2 Luminous Intensity vs. Forward Current 0 I F (ma) I F (ma) R θja =40 C/W (with heat sink) T A ( ) Fig.4 Allowable Forward Current vs. Ambient Temperature T A ( ) Fig.4 Fig.5 Luminous Intensity at at I F IF=350mA vs. Ambient vs. Ambient Temperature Temperature Relative Luminous Intensity (%) 100 W M 50 0 (nm) Note: 1. The data shown above are typical curves. Every LED component may have some variations of characteristics. 2. The maximum driving current should be limited in proper value (see fig. 4), and the proper heat sink should be added in whole system

8 Reliability Test EOI s Super TOP LEDs are checked by reliability test based on MIL standards. 1. Test Conditions, Acceptable Criteria & Results: Classification Test Item Standard Test Method Test Conditions Duration Units Tested Acc/Rej Criteria Number of Damaged Life Test Operating Life Test MIL-STD-750D (OLT) Method T A =25 C,I F =350mA 1000 hrs / 1 0/10 High Temperature Storage (HTS) Low Temperature Storage (LTS) MIL-STD-750D Method MIL-STD-750D Method T A =100 C 1000 hrs / 1 0/10 T A =-40 C 1000 hrs / 1 0/10 Environment Test Temp. & Humidity MIL-STD-750D with Bias (THB) Method 103B Thermal Shock Test (TST) MIL-STD-750D Method T A =85 C,RH=85% I F =100mA -40 C 100 C 2min 2min 500 hrs / 1 0/ cycles 10 0 / 1 0/10 Temperature Cycle Test (TCT) MIL-STD-750D Method C~25 C~100 C~25 C 30min~5min~30min~5min 100cycle 10 0 / 1 0/10 Mechanical Solderability MIL-STD-750D Method ±5,5 sec 1 time 10 0 / 1 0/10 Test Resistance to Soldering Heat MIL-STD-750D Method ±5,5 sec 1 time 10 0 / 1 0/10 2. Reliability Criteria: Item Symbol Test Conditions Min. Criteria for Judgment Max. Forward Voltage V F I F =350 ma - ULS 1.1 * Reverse Current I R V R =5 V - ULS 2.0 * Light Output Φv I F =350 ma ITV 0.5 ** * ULS: Upper Limit of Specification. ** ITV: Initial Test Value

9 Taping Dimension Feeder direction 1. Polarity referring onto the cathode mark/line is reversed on the UR/HR(N-side up chips). 2. The carrier tape and components loading specifications meet the EIA 481-1a Standard pieces per reel is standard loading quantity. Reel Dimension Unit:mm - 9 -

10 Label and Shipment Package Label H *5 Inner Box H Label L W Outer Box Customer P.O.No Part No. Bin Q'ty(PCS) Corrugated paper box(3 layers) L : 359mm W : 50mm H : 374mm PCS/INNER BOX:1Reel(500pcs) Corrugated paper box(5 layers) L : 395mm W : 270mm H : 380mm PCS/OUTER BOX :5 Reel(2500pcs) Total - Precaution of Application 1. Circuit layout Due to the forward voltage of LED will vary with temperature and its driving current, the currentlimited protective circuit should be considered in the LED circuit design. When LEDs are arrayed as parallel circuit, different inherent resistance of LED will cause unbalance current. The unbalanced driving current which exists in every parallel circuit may make LED to be driven at different power. Therefore, the LED driven at higher power may be damaged by over driving current, and the LED driven at lower power may be dimmer than the others. To solve this situation, a suitable resistor is recommended to put in series with each LED circuit. The resistor will limit and balance the driving current which flows through every parallel circuits

11 2. Electric Static Discharge (ESD) Protection All kinds of LED materials, such as GaP, AlGaAs, AllnGaP, GaN, or InGaN chips, are STATIC SENSITIVE device. ESD protection or surge voltages shall be considered and taken care in the initial design stage, and whole production process. The following protection is recommended: (1) A wrist band or an anti-electrostatic glove shall be used when handling the LEDs (2) All devices, equipment and machinery must be properly grounded If LED is damaged by ESD or surge voltage, damaged LED may show some unusual characteristics. It may appear leakage current, and LED does not emit at low current. And when using microscope to inspect damaged LED chip at low driving current, it may have some black dots within the emitting area. 3. Dry Pack Super Top LED is a MOISTURE SENSITIVE device. Please keep LED from absorbing moisture at any time during transportation or storage. Every reel is packaged in the aluminum moisture barrier anti-static bag (Specific bag material will depend upon customer s requirement or option), and the bag is well sealed before shipment. Silica gel material, which can absorb moisture, is also packed together with LED in package bag. And humidity indicator card act as an indicator, which informs users the condition of humidity within SMD package bag by change of color. The package is the following:

12 4. Pick and Place In order to keep high power LED with good reliability, and good optical performance, soft silicone encapsulant is used to form a lens of high power led. The following items should be paid attention in assembly process: (1) It should be avoided to load stress on the resin during pick and place process, especially at high temperature. (2) Avoid rubbing or scraping the resin by any object, and avoid leaving fingerprints on the lens. (3) Electric-static may cause damage to the component. Please confirm that the equipment is grounding well. (4) Silicone material is easily contaminated by particles. However a small amount of particles on the LEDs will not affect the brightness of the LEDs, and also the lifetime. Therefore, a small amount of particles on the surface of lens of LEDs can be ignored. 5. Storage It s recommended to store the products in the following conditions: (1) Shelf life in sealed bag: 12 months at T A <40 and Hum.<30%RH. (Base on aluminum laminated moisture barrier bag.) (2) After the package bag is opened and kept in the following environment, the LED products should be used completely as soon as possible: Humidity (Hum.): 60%RH Max. Temperature (T A ): 5 ~ 30 (41 ~ 86 ) Assembly duration: within 72 hours, after bag is opened. If the some of LED are not used, they need to be kept at Hum. 10%RH in zip-locked sealed bags. And if the duration exceeds 72 hours, re-baking process is required to keep LED from moisture. Please avoid rapid transitions in ambient temperature, especially in high humidity environment where condensation can occur

13 (3) Moisture sensitivity level Level Time (hours) Floor Life Standard Accelerated Equivalent Condition Time (hours) Conditions Time (hours) Conditions % RH 96+2/ % RH /-0 60 / 60% RH Level Soak Requirements Floor Life Standard Accelerated Equivalent Time (hours) Condition Time (hours) Conditions Time (hours) Conditions 1 Unlimited 30 /60% RH 168+5/-0 85 /85% RH 2 1 years 30 /60% RH 168+5/-0 85 /85% RH 2a 4 weeks 30 /60% RH 606+5/-0 30 /60% RH 120+1/-0 60 /60% RH hours 30 /60% RH 192+5/-0 30 /60% RH 40+1/-0 60 /60% RH 4 72 hours 30 /60% RH 96+2/-0 30 /60% RH /-0 60 /60% RH 5 48 hours 30 /60% RH 72+2/-0 30 /60% RH /-0 60 /60% RH 5a 24 hours 30 /60% RH 48+2/-0 30 /60% RH /-0 60 /60% RH 6 Time on Label (TOL) 30 /60% RH TOL 30 /60% RH Note: The standard soak time includes a default value of 24 hours for semiconductor manufacture s exposure time (MET) between bake and bag and includes the maximum time allowed out of the bag at the distributor s facility. 6. Baking It s recommended to bake LED device before soldering. The conditions are as followings: (1) 60±3 (48~72hrs) and Hum. <1%RH for taped reel type (2) 105±3 (2~3hrs) for bulk type

14 7. Cleaning An alcohol-based solvent such as isopropyl alcohol (IPA) is recommended to clean the LED bulbs, after soldering process, if cleaning is necessary. Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur. It is not recommended to use unspecified chemical liquids as cleaning material for cleaning the LED. It s also not recommended to use ultrasonic power to clean the LED device. The chemical and ultrasonic power could harm the LED devices. 8. Manual Soldering and Rework When manual soldering and rework is necessary in production process, the following conditions are recommended: (1) Soldering material: SN60 (60% tin and 40% lead) solder or solder with silver content is recommended. (2) Temperature of the iron : lower than 300 (3) Soldering time: maximum 3 seconds (3) Operation cautions: - Please avoid overheating of LED component in any process. Overheating may damage the LED package. - Please don t place any stress on the lens of LED, especially at high temperature

15 9. Reflow Soldering To prevent LED from cracking in reflow process, it s better to bake LED components before reflow soldering. After the package sealing bag is opened, please use the LED device as soon as possible to keep LED from moisture. It s banned to load any stress on the resin during soldering. Please never take next process until the component is cooled down to room temperature after reflow. And, the manual soldering process is not recommended for quality consideration. To ensure the performance of LED device, it is recommended to set up a reflow profile at lower temperature. Some commercial eutectic solder, such as Sn-Bi solder, can be used to mount LED in reflow process at lower temperature. Melting temperature of Sn-Bi eutectic solder : 145~150 The recommended reflow soldering profile (measure point is near the bottom of the LED package) is following: Recommended SnPb reflow soldering profile: Recommended Pb free reflow soldering profile: 10sec MAX. 10sec MAX. 235 MAX. 260 MAX. TEMPERATURE 4 /sec MAX. 100~140 60sec Max. 6 /sec MAX. 4 /sec MAX. Above 200,60sec MAX. TEMPERATURE 150~180 4 /sec MAX. 3 /sec MAX. 6 /sec MAX. Above sec MAX. 60~120sec 60~120sec MAX. TIME TIME

16 10. Application (1) The strong light from LEDs may injure human eyes. Precautions should be taken to prevent looking directly at the LEDs with unaided eyes. (2) The Super Top LED package has very low thermal resistance between the junction of LED and ambient. However, the applied current should still be limited to protect LED from overheating and overstress damage, when the package is used without additional second-level heat sink or spreader. The recommended driving current should be limited below 150mA, if the single emitter is used in application. (4) In order to get maximum light output during the duration of LED s long life, designer should consider how to make excellent thermal dissipation when making the whole system design. It s recommended to avoid intense heat generation and to operate within the maximum ratings given in this approval sheets. (4) Every piece of LED will be sorted and LEDs with the same binning grade will be taped into the same reel or put into the same bag. It is recommended to use the same bin-grade LED to assembly the unit module. This will ensure the LED unit module with good uniformity of brightness, hue, and so on

17 Terms and Condition 1. EOI warrants all sold LEDs which conform to the specifications approved by the customers. 2. Any LED supplied by EOI is found not conform to the specifications that both parties agreed upon, customer should claim within 90days of receipt. EOI will repair or replace the LEDs at EOI s option. 3. EOI will not hold any responsibility for the failed LEDs, which are caused by mishandling or misusing the LEDs exceeding the operating conditions that EOI suggested. 4. EOI s LED products are designed and manufactured for general electronic equipment (such as household appliances, communication equipment, office equipment, electronic instrumentation and so on). If customer s application requires exceptional quality or reliability, which might concern human safety, it is recommended to consult with EOI in advance. 5. All the information published is considered to be reliable. However, EOI does not assume any liability arising out of the application or use of any product described herein. EOI s liability for defective LED lamps shall only be limited to replacement, in no event shall EOI be liable for consequential damages or loss. 6. EOI and customer shall both confirm the specifications herein, and all quality related matters will base on the specifications both parties agreed upon. 7. Any modification of the design or manufacturing process taken place, which will affect the characteristics, performance or reliability of LED, customer s approval will be required. 8. This specification approval sheet is an agreement of shipment specification. Please sign it back and keep the copies in two parties. If customers don t sign it back, it is regarded as completely agree with the terms and conditions and also approve of this approval sheet. Headquarters Excellence Opto. Inc. 5F, No. 1, Creation Road II, Hsinchu Science Park, Hsinchu, Taiwan 30077, R.O.C. Tel : Fax: Service@eoi.com.tw U.S. Office Excellence Opto. Inc West 2nd Street, Pomona, CA 91766, U.S.A. Tel: Fax: Sales@eoius.com China Factory Lianxinfeng Opto. Co., Ltd. (LXF) 1663 Bldg. No. 15, Tongfuyu Industrial Park, Longhua, Shenzhen, P.R.C. Tel : Fax: