WALSIN TECHNOLOGY CORPORATION

Transcription

1 Comparison report MB dimension change for 1206B 1KV MLCC Prepared by: CT Chuang Manager Field Application Engineering R&D Business Division Issue date: , 2012

2 1. Preface: In order to minimize the arcing risk in high voltage application especially under AC loading and follow the main stream of MB definition for HV MLCC (High Voltage MLCC), WTC decide to change the MB definition of 1206/X7R 1KV as below: Before Change MB: 0.6 ± 0.2mm (0.4~0.8mm). After Change MB: 0.5 ± 0.25mm (0.25~0.75mm). 2. Sample list: 1206, X7R, 1.8nF, 2KV with Original MB definition (Original) 1206, X7R, 1.8nF, 2KV with New MB definition (Modify) 1206B183K202 (1206 X7R 1.8nF / 2KV) was selected to make comparison due to it s High Voltage and High Capacitance. 3. Test items and results: 3.1 Capacitance, Dissipation Factor, and Insulation Resistance: Sample size: 12pcs/lot a. Capacitance and Dissipation Factor: To be measured at 1KHz, 1Vrms with HP-4278A meter. b. Insulation Resistance: To be charged at 500Vdc for 60 seconds in open air. Test item Cap.(nF) DF(%) IR(GΩ) Cap.(nF) DF(%) IR(GΩ) Req. 1.62~ GΩ 1.62~ GΩ Avg Std Max Min Dielectric strength Sample size:12pcs/lot a. Test voltage: 1KV~3KV: 1.2 times of UR b. RAMP = 0 c. Dwell duration: 15 seconds.

3 Test Voltage 2.4KVdc 2.4KVdc Req. No breakdown or flashover No breakdown or flashover Result 12/12 pass 12/12 pass 3.3 Temperature Characteristic of Capacitance Sample size: 5pcs/lot Test Conditions: Measuring capacitance change from -55 ~ 125 compared to the initial capacitance at 25. Requirement: C/C within ±15% for X7R. C/C(%) oringinal modify Temperature Characteristic of Capacitance Resistance to substrate flexure: Sample size: 12pcs/lot The middle part of substrate shall be pressurized by means of the pressurizing rod at a rate of about 1mm per second until the deflection becomes 1mm and then the pressure shall be maintained for 5±1 seconds.

4 (a) Supporting Condition of Substrate (Unit : Testing substrate B ±2( 1 ) Capacitor (b) Testing Condition ±5( 2 ) (Unit: mm) Tes ting substrate B Support(ø5) 45±2 45±2 Testing stand Discrepancy between center of supports and center of substrate. Pressurizing rod Pres surizing rod R230 Suppor Testing stand Suppor t Discrepancy between center of testing substrate A and center of pressurizing rod. Requirement: No remarkable damage and C/C within ±12.5% for 1mm. Part and process 1206, X7R, 1.8nF, 2KV, T=1.60mm (modify) 1206, X7R, 1.8nF, 2KV, T=1.60mm (original) Deflection (mm) Expression :Accumulated Failed/ Sample Size /12 0/12 0/12 0/12 0/12 0/12 0/12 3/12 5/12 7/12 0/12 0/12 0/12 0/12 0/12 0/12 0/12 2/12 4/12 8/ Resistance to soldering heat (RSH): Sample size: 40pcs/lot a. Preheating at 120 to 150 for 1 minute, then immerse the capacitor into a 260±5 eutectic solder bath for 10±1 sec. b. Sample should be measured after keeping at room temperature for 48±4 hrs. Req GΩ GΩ Avg Std Max Min

5 3.6 Damp heat (Humidity Load): Sample size: 20pcs/lot a. Test temperature: 40±2 b. Related humidity: 90~95% c. Test time: /-0 hrs. d. Apply Voltage: 500V e. Sample should be measured after keeping at room temperature for 48±4 hrs. Requirements: a. C/C within ±12.5%. b. DF. < 3% c. IR > 500MΩ or 25Ω-F whichever is smaller. Req GΩ GΩ Avg Std Max Min Temperature Cycle: Sample size: 20pcs/lot a. Specimens are subjected to five cycles of rapid temperature change according to below temperature and time. b. Sample should be performed 150 for 1hr and then set for 48±4 hrs at room temp. c. Sample should be measured after keeping at room temperature for 48±4 hrs. Step Temp( ) Time (min.) 1 Min. operating temp. +0/-3 30±3 2 Room temp. 2~3 3 Max. operating temp +3/-0 30±3 4 Room temp 2~3

6 Req GΩ GΩ Avg Std Max Min Endurance (Temperature load): Sample size: 40pcs/lot a. Test temperature: 125±3 b. Apply voltage: voltage 2000V -> apply 2400V c. Test time: /-0 hrs d. Sample shall be measured after keeping at room temperature for 48±4 hrs. Requirements: a. C/C within ±12.5%. b. DF. < 3% c. IR > 1GΩ or 50Ω-F whichever is smaller. Req GΩ GΩ Avg Std Max Min BDV (Break-Down Voltage): for reference Sample size: 40pcs/lot a. Test temperature: 25±3 b. Apply voltage: voltage 6000V max. c. Ramp: 600V/sec d. Testing frequency: DC & 60Hz AC were applied for comparison Result: Much less arcing were observed at MLCC with new MB definition

7 Test item BDV at DC BDV at 60Hz BDV at DC BDV at 60Hz Remark (V) (Vrms) (V) (Vrms) IR(GΩ) Avg Std /40 arcing at /40 arcing Max DC at DC Min Conclusions: Based on the above testing results, the electrical and mechanical performance of MLCC with different MB definition meet all quality requirements and MLCC with new MB definition perform much better arcing resistance (refer to test item 3.9).