74VHC244 74VHCT244 Octal Buffer Line Driver with TRI-STATE Outputs

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1 244 T244 Octal Buffer Line Driver with TRI-STATE Outputs General Description The HC HCT244 is an advanced high speed CMOS octal bus buffer fabricated with silicon gate C2MOS technology It achieves high speed operation similar to equivalent Bipolar Schottky TTL while maintaining the CMOS low power dissipation The HC HCT244 is a non-inverting TRI-STATE buffer having two active-low output enables These devices are designed to be used as TRI-STATE memory address drivers clock drivers and bus oriented tramitter receivers An input protection circuit eures that 0 7 can be applied to the input pi without regard to the supply voltage This device can be used to interface 5 to 3 systems and two supply systems such as battery back up This circuit prevents device destruction due to mismatched supply and input voltages Features High noise immunity HC NIH e NIL e 28% CC (min) HCT IH e 2 0 IL e 0 8 Power down protection HC inputs only HCT inputs and outputs Low noise HC OLP e 0 6 (typ) HCT OLP e 0 7 (typ) Low power dissipation I CC e 4 ma (max) T A e 25 C Balanced propagation delays tplh j t PHL Pin and function compatible with 74HC HCT244 October 1995 NOTE ADD EXTERNAL PULL UP RESISTOR TO HCT OUTPUTS TO DRIE CMOS INPUTS Commercial Package Number Package Description 244M M20B 20-Lead Molded JEDEC SOIC 244SJ M20D 20-Lead Molded EIAJ SOIC 244MSC MSC20 20-Lead Molded EIAJ Type 1 SSOP 244MTC MTC20 20-Lead Molded JEDEC Type 1 TSSOP 244N N20A 20-Lead Molded DIP T244M M20B 20-Lead Molded JEDEC SOIC T244SJ M20D 20-Lead Molded EIAJ SOIC T244MTC MTC20 20-Lead Molded JEDEC Type 1 TSSOP T244N N20A 20-Lead Molded DIP Note Surface mount packages are also available on Tape and Reel Specify by appending the suffix letter X to the ordering code EIAJ Type 1 SSOP available on Tape and Reel only order MSCX Logic IEEE IEC Connection Diagram Pin Assignment for DIP SSOP TSSOP and SOIC Truth Tables Inputs Outputs (Pi ) OE 1 I n L L L L H H H X Z Inputs Outputs OE 2 I n (Pi ) L L L L H H H X Z 244 T244 Octal Buffer Line Driver with TRI-STATE Outputs TL F TL F H e HIGH oltage Level L e LOW oltage Level I e Immaterial Ze High Impedance Pin Names OE 1 OE 2 I 0 I 7 O 0 O 7 Description TRI-STATE Output Enable Inputs Inputs TRI-STATE Outputs TRI-STATE is a registered trademark of National Semiconductor Corporation C1995 National Semiconductor Corporation TL F RRD-B30M125 Printed in U S A

2 Absolute Maximum Ratings (Note 1) Supply oltage ( CC ) DC Input oltage ( IN ) DC Output oltage ( OUT ) HC HCT Input Diode Current (I IK ) Output Diode Current (I OK ) HC HCT DC Output Current (I OUT ) DC CC GND Current (I CC ) Storage Temperature (T STG ) Lead Temperature (T L ) (Soldering 10 seconds) OUT l CC only if output is in H or Z state b0 5 to a7 0 b0 5 to a7 0 b0 5 to CC a 0 5 b0 5 to 7 0 b20 ma g20 ma b20 ma g25 ma g75 ma b65 Ctoa150 C 260 C DC Characteristics for HC Family Devices CC () Note 1 Absolute Maximum Ratings are values beyond which the device may be damaged or have its useful life impaired The databook specificatio should be met without exception to eure that the system design is reliable over its power supply temperature and output input loading variables National does not recommend operation outside databook specificatio Recommended Operating Conditio Supply oltage ( CC ) HC HCT Input oltage ( IN ) Output oltage ( OUT ) Operating Temperature (T OPR ) HCT Input Rise and Fall Time (t r t f ) CC e 3 3 g0 3 (HC Only) CC e 5 0 g0 5 T T A e 25 C A eb40 C to a85 C Min Typ Max Min Max Units 2 0 to to 5 5 0to a5 5 0to CC b40 Ctoa85 C 0 E E 20 Conditio IH High Level Input oltage CC 0 7 CC IL Low Level Input oltage CC 0 3 CC OH High Level Output oltage IN e IH I OH eb50 ma or IL I OH eb4ma I OH eb8ma OL Low Level Output oltage IN e IH I OL e 50 ma or IL I OL e 4mA I OL e 8mA 2

3 DC Characteristics for HC Family Devices (Continued) I OZ TRI-STATE Output Off-State Current CC () T A e 25 C Min Typ Max Min Max T A eb40 C Units Conditio to a85 C 5 5 g0 25 g2 5 ma IN e IH or IL OUT e CC or GND I IN Input Leakage Current g0 1 g1 0 ma IN e 5 5 or GND I CC Quiescent Supply Current ma IN e CC or GND DC Characteristics for HC Family Devices CC () T A e 25 C Units Conditio Typ Limits OLP OL IHD ILD guaranteed by design Quiet Output Maximum Dynamic OL Quiet Output Minimum Dynamic OL Minimum High Level Dynamic Input oltage Maximum High Level Dynamic Input oltage b0 6 b

4 DC Characteristics for HCT Family Devices CC () T T A e 25 C A eb40 C to a85 C Min Typ Max Min Max IH High Level Input oltage IL Low Level Input oltage OH High Level Output oltage OL Low Level Output oltage Units Conditio IN e IH I OH eb50 ma or IL IOH eb8ma IN e IH I OL e 50 ma or IL IOL e 8mA I OZ TRI-STATE IN e IH or IL Output Off-State 5 5 g0 25 g2 5 ma OUT e CC or GND Current I IN Input IN e 5 5 or GND Leakage g0 1 g1 0 ma Current I CC Quiescent IN e CC or GND Supply ma Current I CCT Maximum ma IN e 3 4 Other I CC Input Inputs e CC or GND I OPD Output OUT e 5 5 Leakage (Power Down State) 0 0 a0 5 a5 0 ma DC Characteristics for HCT Family Devices CC () T T A e 25 C Units Conditio Typ Limits OLP Quiet Output Maximum Dynamic OL OL Quiet Output Minimum Dynamic OL b0 7 b1 0 IHD Minimum High Level Dynamic Input oltage 2 0 ILD Maximum High Level Dynamic Input oltage 0 8 guaranteed by design 4

5 AC Electrical Characteristics for HC Family Devices CC () T T A e 25 C A eb40 C to a85 C Min Typ Max Min Max Units Conditio t PLH Propagation Delay Time C 3 3 g0 3 L e 15 pf t PHL CL e 50 pf 5 0 g C L e 15 pf t PZL TRI-STATE Output Enable R 3 3 g0 3 L e 1kX C L e15 pf t PZH Time CL e 50 pf 5 0 g C L e 15 pf t PLZ TRI-STATE 3 3 g R L e 1kX C L e50 pf t PHZ Output 5 0 g Disable Time t OSLH Output to Output Skew 3 3 g (Note 1) t OSHL 5 0 g CL e 50 pf C IN Input Capacitance pf CC e Open C OUT Output Capacitance 6 pf CC e 5 0 C PD Power Dissipation Capacitance 19 pf (Note 2) Note 1 guaranteed by design t OSLH e lt PLHmax b t PLHminl t OSHL e lt PHLmax b t PHLminl Note 2 C PD is defined as the value of the internal equivalent capacitance which is calculated from the operating current coumption without load Average operating current can be obtained by the equation I CC (OPR ) e C PD CC f IN a I CC 8 (per bit) 5

6 AC Electrical Characteristics for HCT Family Devices CC () T T T T A e 25 C A eb40 C to a85 C Min Typ Max Min Max Units Conditio t PLH Propagation Delay Time 5 0 g C L e 15 pf t PHL CL e 50 pf t PZL TRI-STATE Output Enable Time 5 0 g R L e 1kX C L e15 pf t PZH CL e 50 pf t PLZ TRI-STATE 5 0 g0 5 R L e 1kX C L e50 pf t PHZ Output Disable Time t OSLH Output to Output Skew 5 0 g0 5 (Note 1) t OSHL C IN Input Capacitance pf CC e Open C OUT Output Capacitance 9 pf CC e 5 0 C PD Power Dissipation Capacitance 18 pf (Note 2) Note 1 guaranteed by design t OSLH e lt PLHmax b t PLHminl t OSHL e lt PHLmax b t PHLminl Note 2 C PD is defined as the value of the internal equivalent capacitance which is calculated from the operating current coumption without load Average operating current can be obtained by the equation I CC (OPR ) e C PD CC f IN a I CC 8 (per bit) 6

7 Ordering Information The device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows TL F

8 Physical Dimeio inches (millimeters) 20-Lead Small Outline Integrated Circuit JEDEC SOIC (M) Order Number 244M 244MX T244M or T244MX NS Package Number M20B 20-Lead Small Outline Integrated Circuit-EIAJ SOIC (SJ) Order Number 244SJ 244SJX T244SJ or T244SJX NS Package Number M20D 8

9 Physical Dimeio millimeters 20-Lead Plastic EIAJ SSOP Type I (MSC) Order Number 244MSCX NS Package Number MSC20 20-Lead Plastic JEDEC TSSOP Type I (MTC) Order Number 244MTC 244MTCX T244MTC or T244MTCX NS Package Number MTC20 9

10 244 T244 Octal Buffer Line Driver with TRI-STATE Outputs Physical Dimeio (millimeters) (Continued) LIFE SUPPORT POLIC 20-Lead Molded DIP Order Number 244N or T244N NS Package Number N20A NATIONAL S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEICES OR SSTEMS WITHOUT THE EXPRESS WRITTEN APPROAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION As used herein 1 Life support devices or systems are devices or 2 A critical component is any component of a life systems which (a) are intended for surgical implant support device or system whose failure to perform can into the body or (b) support or sustain life and whose be reasonably expected to cause the failure of the life failure to perform when properly used in accordance support device or system or to affect its safety or with itructio for use provided in the labeling can effectiveness be reasonably expected to result in a significant injury to the user National Semiconductor National Semiconductor National Semiconductor National Semiconductor Corporation Europe Hong Kong Ltd Japan Ltd 1111 West Bardin Road Fax (a49) th Floor Straight Block Tel Arlington TX cnjwge tevm2 c com Ocean Centre 5 Canton Rd Fax Tel 1(800) Deutsch Tel (a49) Tsimshatsui Kowloon Fax 1(800) English Tel (a49) Hong Kong Fran ais Tel (a49) Tel (852) Italiano Tel (a49) Fax (852) National does not assume any respoibility for use of any circuitry described no circuit patent licees are implied and National reserves the right at any time without notice to change said circuitry and specificatio

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