Subject: Ionic Analysis of PrintedCircuit Boards, Printed board Assemblies and Materials, Ion Chromatography Method

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Method: 2.3.28 Subject: Ionic Analysis of PrintedCircuit Boards, Printed board Assemblies and Materials, Ion Chromatography Method Date: 09-1905/04 Revision: AC Originating Task Group: Ionic Conductivity/Ion Chromatography Task Group 5-32a 1 Scope This test procedure is designed to measure the level of extractable ionic anionic (including weak organic acid anions) and cationic contamination on from the surface of circuit printed boards, and circuitprinted board assemblies and other pertinent assembly materials by ion chromatography. 2 Applicable Documents IDEMA M13-99 Measurement of Extractable/Leachable Anion Contamination Levels on Drive Components by Ion Chromatography (IC) IPC-TP-1043 Cleaning and Cleanliness Test Program, Phase III, Water Soluble Fluxes, Part 1: B-24, lnteractions of Water Soluble Fluxes with Metal/Substrates (Check these out) IPC-TP-1044 Cleaning and Cleanliness Test Program, Phase III, Water Soluble Fluxes, Part 2: B-36, Comparison to Phase 1 Rosin Benchmark (Check these out) IPC-TR-583 An In-Depth Look at Ionic Cleanliness Testing IPC-5701 Users Guide for Cleanliness of Unpopulated Printed Boards IPC-WP-008 Setting Up Ion Chromatography Capability 3 Test Specimen 3.1 Printed Circuit Board (PCB), and/or Printed Board Circuit Assembly (PBA) and pertinent materials(pca) for extraction 4 Apparatus and Material 4.1 Ion Chromatograph capable of accurately measuring ion concentrations down to 50 ppb 0.5 or better ion detectionparts per million (ppm). The equipment and chemistry should be set up and standardized per the manufacturer s

instructions. The separation column and Eluent composition should be chosen to provide baseline resolution between the ions of interest. 4.2 Hot Water Bath capable of maintaining 80 C ± 5 2 C [176 F ± 3.69 F]. 4.3 Use a clean heat sealable bag, i.e. KAPAK 500 series or equivalent, with less than 250 ppb extractable contaminants.clean extraction vessels (i.e. clean bags, glass vials, etc). 4.4 Clean labware (Ionic free). 4.4 5 Cleanroom vinyl gloves. (<3 ppm of Cl). 4.5 6 Deionized water with a resistivity of at least 1818.0 megohm-centimeter. 4.6 7 HPLC or ASC grade chemicals for eluent and regenerant preparation. 4.7 8 NIST National standard - traceable calibration standards (e.g. NIST traceablesee 6.1). 4.8 2-Propanol (IPA), Electronic grade or better. HPLC grade or equivalent 2- propanol (IPA). 5 Procedure 5.1 Extraction 5.1.1 Use clean gloves and /or tongs when handling the samples to be tested. Place each sample in a clean extraction vesselbag. 5.1.2 Prepare a 75/25 v/v IPA/H20 solution for the extraction. 5.1.3 Add a known volume of the extraction solution to the extraction bag vessel covering the PCB/PCAmaterial being tested (approximately ½ ml/cm2 of surface area).(suggested: Add minimum volume to cover the extracted area of interest). 5.1.4 Add the same volume of extraction solution to an empty bag vessel of the same lot for use as a blank. Subject the sample blank to the exact same test conditions as the samples. 5.1.5 Heat seal all sample and blankplace extraction bags vessels and place in an 80 C [176 F] water bath for one hour (-0 min.,+5 min.). (It s recommended that vessels be closed so as to minimize volume loss or cross contamination from water bath. 5.1.6 Allow the solution within the bag to cool to ambient temperature before opening after the extraction process is complete.

5.1.7 Remove the test samples from the vessel once extraction solution has cooled to ambient using gloved hands or cleaned tongs. Be sure to minimize contacting the extraction solvent. 5.1.8 Record the surface area of PCB (length x width x 2) or PBCA. As a general rule for assemblies, the surface area is estimated as: (length x width x 2) + 10%. Great caution should be taken in interpretation and comparison of these results as assembly surface areas will oftencan deviate by more than 10% of its unpopulated state. 5.2 Standard and Sample AnalysisAnalytical Procedure 5.2.1 Analysis of the extract solution should be donecompleted as soon as possible after extraction to minimize degradation of the sample. Inject the sample extracts into the Ion Chromatograph (IC) and determine the sample ion concentrationscalculate against known ion standards (a three to five level calibration is recommended). 5.2.2 Start the chromatogram and confirm stable baseline. Values from the IC are typically reported in ppm. Formatted: Highlight 5.2.3 Analyze samples for ionic content using best laboratory practices. 5.3 Results are to be expressed as μg of ion per unit area (i.e. square centimeters or square inches) based on the extraction volume and the calculated sample surface area. μg/cm 2 = [ppm from IC (μg/ml)] x [final volume (ml)] / [surface area (cm 2 )] Note: ppm value is actually specimen value minus blank value. μg/in 2 = [ppm from IC (μg/ml)] x [final volume (ml)] / [surface area (in 2 )] Note: ppm value is actually specimen value minus blank value. or Formatted: Centered

6 Notes 6.1 Ions which may be included for evaluation are as follows: Anions: Bromide Chloride Fluoride Nitrate Nitrite Phosphate Sulfate Cations: Ammonium Calcium Lithium Magnesium Potassium Sodium Weak Organic Acids: Acetate Adipate Formate Glutamate Malate Methane Sulfonate Succinate Phthalate Other ions of interest may be present. 6.2 Alternate extraction techniques (change in time, temperature, or extraction solution) may be used when as agreed upon between user and vendorsupplier (AABUS). 6.2.1 Examples of alternate extraction times include the following: Ten-minute extraction (IDEMA specification for metal parts) Twenty-four hour extraction for solder paste per J-STD-004 6.2.2 Examples of alternate extraction temperatures include the following: Ambient temperature (22 C ± 3 C [72 F ± 5 F])

6.2.3 Examples of alternate extraction solutions include the following: 10/90 v/v IPA/H2O Deionized water 6.3 Ion Chromatography may be a destructive test for printed circuit board assemblies due to the high temperature liquid extraction and lack of electrostatic discharge (ESD) protection. Moisture sensitive devices (MSD s) may also be damaged as a result of exposure to extraction solvent. Caution should be taken when testing production assemblies samples that are intended to be a deliverable production assemblies.