< HVIGBT MODULE > CMH1200DC-34S HIGH POWER SWITCHING USE SiC Hybrid HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Module

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< HVIGBT MODULE > I C 2A V CES 7V 2-element in a Pack Insulated Type CSTBT SiC Schottky-Barrier Diode AlSiC Baseplate APPLICATION Traction drives, High Reliability Converters / Inverters, DC choppers OUTLINE DRAWING & CIRCUIT DIAGRAM Dimensions in mm

< HVIGBT MODULE > MAXIMUM RATINGS Symbol Item Conditions Ratings Unit V CES Collector-emitter voltage V GE = V 7 V V GES Gate-emitter voltage V CE = V, T j = 25 C ±2 V I C DC, T c = C 2 A Collector current I CRM Pulse (Note ) 24 A I E DC 2 A Emitter current (Note 2) I ERM Pulse (Note ) 24 A I 2 t Surge current load integral T j = 25 C, V R = V, t p = ms ka 2 s P tot Maximum power dissipation (Note 3) T c = 25 C, IGBT part 675 W V iso Isolation voltage RMS, sinusoidal, f = 6Hz, t = min. 4 V T jop Operating junction temperature 5 ~ +5 C T stg Storage temperature 5 ~ +5 C t psc Short circuit pulse width V CC = 2 V, V CE V CES, V GE = 5V, T j = 5 C µs ELECTRICAL CHARACTERISTICS Symbol Item Conditions Limits Min Typ Max Unit T j = 25 C 36 I CES Collector cutoff current V CE = V CES, V GE = V T j = 25 C 5 ma T j = 5 C 8 V GE(th) Gate-emitter threshold voltage V CE = V, I C = 2mA, T j = 25 C 6. V I GES Gate leakage current V GE = V GES, V CE = V, T j = 25 C.5.5 µa C ies Input capacitance 26 nf V CE = V, V GE = V, f = khz C oes Output capacitance 8. nf T j = 25 C C res Reverse transfer capacitance.6 nf Q G Total gate charge V CC = 85V, I C = 2A, V GE = 5V 2. µc V CEsat Collector-emitter saturation voltage T j = 25 C.95 I C = 2 A (Note 4) T j = 25 C 2.25 V GE = 5 V T j = 5 C 2.3 V T j = 25 C.5 t d(on) Turn-on delay time T j = 25 C.5 µs T j = 5 C.5 t r Turn-on rise time E on(%) Turn-on switching energy (Note 6) E on Turn-on switching energy (Note 5) t d(off) t f Turn-off delay time Turn-off fall time E off(%) Turn-off switching energy (Note 6) E off Turn-off switching energy (Note 5) V CC = 85 V I C = 2 A V GE = ±5 V R G(on) =.3 Ω L s = nh Inductive load V CC = 85 V I C = 2 A V GE = ±5 V R G(off) = 3.3 Ω L s = nh Inductive load T j = 25 C.4 T j = 25 C.5 T j = 5 C.5 T j = 25 C T j = 25 C 35 T j = 5 C 4 T j = 25 C 3 T j = 25 C 55 T j = 5 C 6 T j = 25 C.2 T j = 25 C.3 T j = 5 C.32 T j = 25 C.2 T j = 25 C.5 T j = 5 C.7 T j = 25 C 2 T j = 25 C 28 T j = 5 C 3 T j = 25 C 26 T j = 25 C 36 T j = 5 C 4 µs mj mj µs µs mj mj 2

< HVIGBT MODULE > THERMAL CHARACTERISTICS Symbol Item Conditions Limits Min Typ Max Unit V EC Emitter-collector voltage (Note 2) T j = 25 C.6 I E = 2A (Note 4) T j = 25 C 2.2 V GE = V T j = 5 C 2.3 V Q C Total capacitive charge (Note 2,7) T j = 25 C 5. V CC = 85V, I E = 2 A T j = 25 C 8.5 R G(on) =.3ΩL s = nh T j = 5 C 9. µc R th(j-c)q Junction to Case, IGBT part, /2 module 8.5 K/kW Thermal resistance R th(j-c)d Junction to Case, FWDi part, /2 module 36. K/kW R th(c-s) Contact thermal resistance Case to heat sink, /2 module grease = W/m k, D (c-s) = m 6. K/kW MECHANICAL CHARACTERISTICS Symbol Item Conditions Limits Min Typ Max Unit M t Main terminals screw 7. 2. N m M s Mounting torque Mounting screw 3. 6. N m M t Auxiliary terminals screw. 3. N m m Mass.8 kg CTI Comparative tracking index 6 d a Clearance 9.5 mm d s Creepage distance 5. mm L P CE Parasitic stray inductance /2 module 3. nh R CC +EE Internal lead resistance T c = 25 C, /2 module.28 mω Note. Pulse width and repetition rate should be such that junction temperature (Tj) does not exceed Tjopmax rating. 2. The symbols represent characteristics of the anti-parallel, emitter to collector free-wheel diode (FWDi). 3. Junction temperature (Tj) should not exceed Tjmax rating. 4. Pulse width and repetition rate should be such as to cause negligible temperature rise. 5. Definition of all items is according to IEC 6747, unless otherwise specified. 6. Eon(%) / Eoff(%) / Erec(%) are the integral of.vce x.ic x dt. 7. Capacitive charge during anti-paralleled FWDi s turn-off operation. 3

Emitter Current [A] < HVIGBT MODULE > PERFORMANCE CURVES OUTPUT CHARACTERISTICS (TYPICAL) TRANSFER CHARACTERISTICS (TYPICAL) 25 T j = 25 C 25 V CE = V 2 V GE = 7V V GE = 5V V GE = V 2 5 V GE = 3V 5 T j = 25ºC / 5ºC V GE = 9V T j = 25ºC 5 5 2 3 4 5 6 5 5 Collector - Emitter Voltage [V] Gate - Emitter Voltage [V] COLLECTOR-EMITTER SATURATION VOLTAGE FREE-WHEEL DIODE FORWARD 25 V GE = 5V T j = 25ºC 25 2 2 T j = 25ºC 5 T j = 5ºC 5 T j = 25ºC T j = 5ºC T j = 25ºC 5 5 2 3 4 2 3 4 Collector-Emitter Saturation Voltage [V] Emitter-Collector Voltage [V] 4

Switching Energies [J] Switching Energies [J] Capacitance [nf] Gate-Emitter Voltage [V] < HVIGBT MODULE > PERFORMANCE CURVES CAPACITANCE CHARACTERISTICS (TYPICAL) GATE CHARGE CHARACTERISTICS (TYPICAL) 2 C ies 5 VCE = 85V, IC = 2A T j = 25ºC 5 C oes -5 VGE = V, T j = 25ºC f = khz C res -.. Collector-Emitter Voltage [V] -5 5 5 Gate Charge [µc] HALF-BRIDGE SWITCHING ENERGY.2 HALF-BRIDGE SWITCHING ENERGY.2 VCC = 85V, VGE = ±5V VCC = 85V, VGE = ±5V. RG(on) =.3Ω, R G(off) = 3.3Ω T j = 25ºC, Inductive load. RG(on) =.3Ω, R G(off) = 3.3Ω T j = 5ºC, Inductive load E off E off.8.8.6.6.4 E on.4 E on.2.2. 5 5 2 25. 5 5 2 25 5

Switching Times [µs] Switching Times [µs] Switching Energies [J] Switching Energies [J] < HVIGBT MODULE > PERFORMANCE CURVES HALF-BRIDGE SWITCHING ENERGY HALF-BRIDGE SWITCHING ENERGY 2. VCC = 85V, IC = 2A 2. VCC = 85V, IC = 2A VGE =±5V, T j = 25ºC Inductive load VGE = ±5V, T j = 5ºC Inductive load.5.5 E on E on.. E off E off.5.5. 5 5 2. 5 5 2 Gate Resistance [Ω] Gate Resistance [Ω] HALF-BRIDGE SWITCHING TIME HALF-BRIDGE SWITCHING TIME VCC = 85V, VGE = ±5V R G(on) =.3Ω, R G(off) = 3.3Ω T j = 25ºC, Inductive load VCC = 85V, VGE = ±5V R G(on) =.3Ω, R G(off) = 3.3Ω T j = 5ºC, Inductive load t d(off) t d(off) t d(on) t d(on) t f t f.. t r t r.. 6

Normalized Transient Thermal impedance < HVIGBT MODULE > PERFORMANCE CURVES REVERSE BIAS SAFE OPERATING AREA (RBSOA) 3 25 VCC 2V, VGE =±5V T j = 5ºC, RG(off) 3.3Ω 2 5 5 5 5 2 Collector-Emitter Voltage [V] TRANSIENT THERMAL IMPEDANCE CHARACTERISTICS.2.8.6.4 R th(j-c)q = 8.5K/kW R th(j-c)d = 36.K/kW Z th( jc ) n t ( t ) R exp i i i 2 3 4 Ri [K/kW].96.893.444.3967 ti [sec]..58.62.352.2... Time [s] 7

< HVIGBT MODULE > Keep safety first in your circuit designs! Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of non-flammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials These materials are intended as a reference to assist our customers in the selection of the Mitsubishi semiconductor product best suited to the customer s application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Mitsubishi Electric Corporation or a third party. Mitsubishi Electric Corporation assumes no responsibility for any damage, or infringement of any third-party s rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Mitsubishi Electric Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Mitsubishi Electric Corporation assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Mitsubishi Electric Corporation by various means, including the Mitsubishi Semiconductor home page (http://www. MitsubishiElectric.com/). When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Mitsubishi Electric Corporation assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. Mitsubishi Electric Corporation semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. The prior written approval of Mitsubishi Electric Corporation is necessary to reprint or reproduce in whole or in part these materials. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or re-export contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor for further details on these materials or the products contained therein. 28 MITSUBISHI ELECTRIC CORPORATION. ALL RIGHTS RESERVED. 8