Silicon PIN Diode Series diode for mobile communication in low loss transmitreceiver switches Band switch for TVtuners Very low forward resistance (typ..65 Ω @ 5 ma) Low capacitance (typ..5 pf @ V) Fast switching applications Pbfree (RoHS compliant) package ) Qualified according AEC Q BAR65L BAR65V BAR653W Type Package Configuration L S (nh) Marking BAR65L* BAR65V BAR653W * Preliminary Data TSLP SC79 SOD33 single, leadless single single.4.6.8 NN N M/blue Maximum Ratings at T A = 5 C, unless otherwise specified Parameter Symbol Value Unit Diode reverse voltage V R 3 V Forward current I F ma Total power dissipation BAR65L, T S 8 C BAR65V, T S 8 C BAR653W, T S 3 C P tot 5 5 5 mw Junction temperature T j 5 C Operating temperature range T op 55... 5 Storage temperature T stg 55... 5 Pbcontaining package may be available upon special request 749
Thermal Resistance Parameter Symbol Value Unit Junction soldering point ) BAR65L BAR65V BAR653W R thjs K/W 9 3 45 Electrical Characteristics at T A = 5 C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. DC Characteristics Reverse current I R na V R = V Forward voltage I F = ma V F.93 V For calculation of R thja please refer to Application Note Thermal Resistance 749
Electrical Characteristics at T A = 5 C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. AC Characteristics Diode capacitance V R = V, f = MHz V R = 3 V, f = MHz V R = V, f = MHz....8 GHz Reverse parallel resistance V R = V, f = MHz V R = V, f = GHz V R = V, f =.8 GHz Forward resistance I F = ma, f = MHz I F = 5 ma, f = MHz I F = ma, f = MHz Charge carrier life time I F = ma, I R = 6 ma, measured at I R = 3 ma, R L = Ω C T R P r f pf.45.4.5.9.8 kω 7 5 Ω.65.95.56.9 τ rr 8 ns Iregion width W I 3.5 µm Insertion loss ) I F = ma, f =.8 GHz I F = 5 ma, f =.8 GHz I F = ma, f =.8 GHz Isolation ) V R = V, f =.9 GHz V R = V, f =.8 GHz V R = V, f =.45 GHz BAR65L in series configuration, Z = 5Ω I L I SO db.8.6.5 7 5 3 749
Diode capacitance C T = ƒ (V R ) f = Parameter Reverse parallel resistance R P = ƒ(v R ) f = Parameter.5 F 4 KOhm MHz.4 MHz....8 GHz 3 CT.35 Rp GHz.3.8 GHz.5..5. 4 6 8 4 6 V VR 4 6 8 4 6 V VR Forward resistance r f = ƒ (I F ) f = MHz Forward current I F = ƒ (V F ) T A = Parameter A Ohm rf IF 3 4 4 C 5 C 85 C 5 C 5 ma I F 6..4.6.8 V. V F 4 749
Forward current I F = ƒ (T S ) BAR65L Forward current I F = ƒ (T S ) BAR65V ma ma 9 9 8 8 IF 7 IF 7 6 6 5 5 4 4 3 3 5 3 45 6 75 9 5 C 5 T S 5 3 45 6 75 9 5 C 5 T S Forward current I F = ƒ (T S ) BAR653W ma 9 8 IF 7 6 5 4 3 5 3 45 6 75 9 5 C 5 T S 5 749
Permissible Puls Load R thjs = ƒ (t p ) BAR65L Permissible Pulse Load I Fmax / I FDC = ƒ (t p ) BAR65L RthJS K/W.5...5...5 D = IFmax/IFDC D =.5...5...5 6 5 4 3 s t p 6 5 4 3 s t p Permissible Puls Load R thjs = ƒ (t p ) BAR65V 3 Permissible Pulse Load I Fmax / I FDC = ƒ (t p ) BAR65V RthJS D =,5,,,5,,,5 6 5 4 3 s IFmax/IFDC D =,5,,,5,,,5 6 5 4 3 s T S T S 6 749
Permissible Puls Load R thjs = ƒ (t p ) BAR653W 3 Permissible Pulse Load I Fmax / I FDC = ƒ (t p ) BAR653W ma IF.5...5...5 D = IFmax/IFDC ma D =.5...5...5 7 6 5 4 3 C t p 6 5 4 3 C t p Insertion loss I L = S = ƒ(f) I F = Parameter BAR65L in series configuration, Z = 5Ω db Isolation I SO = S = ƒ(f) V R = Parameter BAR65L in series configuration Z = 5Ω db. S.5 S..5 ma 5 ma ma. ma 5 V V V.3.35 5.4.5.5 GHz 3 f 3.5.5 GHz 3 f 7 749
Package SC79 BAR65... Package Outline.8 ±..6 ±. MAX.. M A +.5.3.3 MAX.. ±. A.3 ±.5.55 ±.4. ±.5 Foot Print.35.35.35 Marking Layout (Example) 5, June Date code BAR63V Type code Laser Standard Packing Reel ø8 mm = 3. Pieces/Reel Reel ø8 mm = 8. Pieces/Reel ( mm Pitch) Reel ø33 mm =. Pieces/Reel Standard 4 Reel with mm Pitch..33.96 8.4.93.66 8 749
Date Code for discrete packages with one digit (SCD8, SC79, SC75 ) ) CESCode Month 3 4 5 6 7 8 9 3 4 a p A P a p A P a p A P b q B Q b q B Q b q B Q 3 c r C R c r C R c r C R 4 d s D S d s D S d s D S 5 e t E T e t E T e t E T 6 f u F U f u F U f u F U 7 g v G V g v G V g v G V 8 h x H X h x H X h x H X 9 j y J Y j y J Y j y J Y k z K Z k z K Z k z K Z l L 4 l L 4 l L 4 n 3 N 5 n 3 N 5 n 3 N 5 ) New Marking Layout for SC75, implemented at October 5.. 9 749
Package SOD33 BAR65... Package Outline +..5. ±.5.9 +...5 ±..3 +..5.45 ±.5 +...7.3 A +.5..5 M A +..5.6 Foot Print.8.7.8.6 Marking Layout (Example) BAR633W Type code Laser Standard Packing Reel ø8 mm = 3. Pieces/Reel Reel ø33 mm =. Pieces/Reel 4. 8.9.65.35 749
Package TSLP BAR65... Package Outline Top view +..4 Bottom view.5 MAX..6 ±.5.65±.5 ±.5 ).5 ±.35 ) Dimension applies to plated terminal Foot Print For board assembly information please refer to Infineon website "Packages".6.45.35.75.75.375.3.95.35 Copper Solder mask Stencil apertures Marking Layout (Example) BAS6L Type code Laser Standard Packing Reel ø8 mm = 5. Pieces/Reel Reel ø33 mm = 5. Pieces/Reel (optional) 4.5.6 8 ).5 ±.35.76 749
Edition 6 Published by Infineon Technologies AG 876 München, Germany Infineon Technologies AG 7. All Rights Reserved. Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics ( Beschaffenheitsgarantie ). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of noninfringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in lifesupport devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that lifesupport device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 749