Silicon PIN Diode Optimized for low current antenna switches in hand held applications Very low forward resistance (typ..5 Ω @ I F = ma) Low capacitance at zero volt reverse bias at frequencies above GHz (typ..8 pf) Very low signal distortion Pbfree (RoHS compliant) package ) Qualified according AEC Q BAR88LRH BAR88V Type Package Configuration L S (nh) Marking BAR88LRH BAR88V TSLP7 SC79 single, leadless single Pbcontaining package may be available upon special request.4.6 U8 U Maximum Ratings at T A = 5 C, unless otherwise specified Parameter Symbol Value Unit Diode reverse voltage V R 8 V Forward current I F ma Total power dissipation BAR88LRH T s 33 C BAR88V, T s 3 C P tot 5 5 mw Junction temperature T j 5 C Operating temperature range T op 55... 5 Storage temperature T stg 55... 5 35
Thermal Resistance Parameter Symbol Value Unit Junction soldering point ) BAR88LRH BAR88V R thjs K/W 65 5 Electrical Characteristics at T A = 5 C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. DC Characteristics Breakdown voltage V (BR) 8 V I (BR) = 5 µa Reverse current V R = 6 V I R 5 na Forward voltage I F = ma I F = ma For calculation of R thja please refer to Application Note Thermal Resistance V F V.75.95.9. 35
Electrical Characteristics at T A = 5 C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. AC Characteristics Diode capacitance V R = V, f = MHz V R = V, f = MHz V R = V, f = GHz V R = V, f =.8 GHz Reverse parallel resistance V R = V, f = MHz V R = V, f = GHz V R = V, f =.8 GHz Forward resistance I F = ma, f = MHz I F = 5 ma, f = MHz I F = ma, f = MHz Charge carrier life time I F = ma, I R = 6 ma, measured at I R = 3 ma, R L = Ω C T R P r f pf.3.4.8.5.4 kω 65.5.5 Ω.5.5.8.6 τ rr 5 ns Iregion width W I 3 µm Insertion loss ) I F = ma, f =.8 GHz I F = 5 ma, f =.8 GHz I F = ma, f =.8 GHz Isolation ) V R = V, f =.9 GHz V R = V, f =.8 GHz V R = V, f =.45 GHz BAR88LRH in series configuration, Z = 5Ω I L I SO db..7.6 5 9 3 35
Diode capacitance C T = ƒ (V R ) f = Parameter Reverse parallel resistance R P = ƒ(v R ) f = Parameter.5 pf 4 KOhm 3 CT.4.35 MHz MHz GHz.8 GHz Rp MHz.3 GHz.5..5.8 GHz. 4 6 8 4 6 V V R 4 6 8 4 6 V V R Forward resistance r f = ƒ (I F ) f = MHz Forward current I F = ƒ (V F ) T A = Parameter Ohm A rf IF 3 4 4 C +5 C +85 C +5 C 5 6 7 8 ma I F 9..4.6.8 V. VF 4 35
Forward current I F = ƒ (T S ) BAR88LRH Forward current I F = ƒ (T S ) BAR88V ma ma 9 9 8 8 IF 7 IF 7 6 6 5 5 4 4 3 3 5 3 45 6 75 9 5 C 5 T S 5 3 45 6 75 9 5 C 5 T S Permissible Puls Load R thjs = ƒ (t p ) BAR88LRH Permissible Pulse Load I Fmax / I FDC = ƒ (t p ), BAR88LRH K/W RthJS.5...5...5 D = IFmax/IFDC D =.5...5...5 6 5 4 3 C t p 6 5 4 3 C t p 5 35
Permissible Puls Load R thjs = ƒ (t p ) BAR88V 3 Permissible Pulse Load I Fmax / I FDC = ƒ (t p ) BAR88V K/W RthJS.5...5...5 D = IFmax/IFDC D =.5...5...5 6 5 4 3 C t p 6 5 4 3 C t p Insertion loss I L = S = ƒ(f) I F = Parameter BAR88LRH in series configuration, Z = 5Ω db Isolation I SO = S = ƒ(f) V R = Paramter BAR88LRH in series configuration, Z = 5Ω db. S.5 S..5 ma 5 ma ma.5 ma. ma 5 V V V.3.35 5.4 3 4 GHz 6 f 3 3 4 GHz 6 f 6 35
Package SC79 BAR88... Package Outline.8 ±..6 ±. MAX.. M A +.5.3.3 MAX.. ±. A Cathode marking.3 ±.5.55 ±.4. ±.5 Foot Print.35.35.35 Marking Layout (Example) 5, June Date code BAR63V Type code Cathode marking Laser marking Standard Packing Reel ø8 mm = 3. Pieces/Reel Reel ø8 mm = 8. Pieces/Reel ( mm Pitch) Reel ø33 mm =. Pieces/Reel Standard 4 Reel with mm Pitch..33.96 8 Cathode marking.4.93 Cathode marking.66 7 35
Date Code marking for discrete packages with one digit (SCD8, SC79, SC75 ) ) CESCode Month 3 4 5 6 7 8 9 3 4 a p A P a p A P a p A P b q B Q b q B Q b q B Q 3 c r C R c r C R c r C R 4 d s D S d s D S d s D S 5 e t E T e t E T e t E T 6 f u F U f u F U f u F U 7 g v G V g v G V g v G V 8 h x H X h x H X h x H X 9 j y J Y j y J Y j y J Y k z K Z k z K Z k z K Z l L 4 l L 4 l L 4 n 3 N 5 n 3 N 5 n 3 N 5 ) New Marking Layout for SC75, implemented at October 5.. 8 35
Package TSLP7 BAR88... Package Outline Top view +..39.3 Bottom view.5 MAX..6 ±.5 Cathode marking.65 ±.5 ) Dimension applies to plated terminal ).5 ±.35 ).5 ±.35 ±.5 Foot Print For board assembly information please refer to Infineon website "Packages".6.35.45.3.75.95.35.75.375 Copper Solder mask Stencil apertures Marking Layout (Example) BAR9LRH Type code Cathode marking Laser marking Standard Packing Reel ø8 mm = 5. Pieces/Reel Reel ø33 mm = 5. Pieces/Reel (optional) 4.5.6 8 Cathode marking.76 9 35
Edition 96 Published by Infineon Technologies AG 876 Munich, Germany 9 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of noninfringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office ( <www.infineon.com>). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in lifesupport devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that lifesupport device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 35