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Transcription:

Important notice Dear Customer, On 7 February 207 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS semiconductors with its focus on the automotive, industrial, computing, consumer and wearable application markets In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/, use http://www.nexperia.com Instead of sales.addresses@www.nxp.com or sales.addresses@www.semiconductors.philips.com, use salesaddresses@nexperia.com (email) Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on the version, as shown below: - NXP N.V. (year). All rights reserved or Koninklijke Philips Electronics N.V. (year). All rights reserved Should be replaced with: - Nexperia B.V. (year). All rights reserved. If you have any questions related to the data sheet, please contact our nearest sales office via e-mail or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and understanding, Kind regards, Team Nexperia

Rev. 02 4 January 2009 Product data sheet. Product profile. General description NPN high-voltage low V CEsat Breakthrough In Small Signal (BISS) transistor in a SOT23 (TO-236AB) small Surface-Mounted Device (SMD) plastic package. PNP complement: PBHV9040T..2 Features High voltage Low collector-emitter saturation voltage V CEsat High collector current capability I C and I CM High collector current gain (h FE ) at high I C AEC-Q0 qualified.3 Applications Electronic ballast for fluorescent lighting LED driver for LED chain module LCD backlighting High Intensity Discharge (HID) front lighting Automotive motor management Hook switch for wired telecom Switch mode power supply.4 Quick reference data Table. Quick reference data Symbol Parameter Conditions Min Typ Max Unit V CESM collector-emitter peak V BE = 0 V - - 500 V voltage V CEO collector-emitter voltage open base - - 400 V I C collector current - - 0.5 A h FE DC current gain V CE =0V; I C =50mA 00 200 -

2. Pinning information Table 2. Pinning Pin Description Simplified outline Graphic symbol base 2 emitter 3 3 3 collector 2 2 sym02 3. Ordering information Table 3. Ordering information Type number Package Name Description Version - plastic surface-mounted package; 3 leads SOT23 4. Marking Table 4. Marking codes Type number Marking code [] W4* [] * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China _2 Product data sheet Rev. 02 4 January 2009 2 of 2

5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 6034). Symbol Parameter Conditions Min Max Unit V CBO collector-base voltage open emitter - 500 V V CEO collector-emitter voltage open base - 400 V V CESM collector-emitter peak V BE = 0 V - 500 V voltage V EBO emitter-base voltage open collector - 6 V I C collector current - 0.5 A I CM peak collector current single pulse; - A t p ms I BM peak base current single pulse; - 200 ma t p ms P tot total power dissipation T amb 25 C [] - 300 mw T j junction temperature - 50 C T amb ambient temperature 55 +50 C T stg storage temperature 65 +50 C [] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. 400 006aab50 P tot (mw) 300 200 00 0 75 25 25 75 25 75 T amb ( C) Fig. FR4 PCB, standard footprint Power derating curve _2 Product data sheet Rev. 02 4 January 2009 3 of 2

6. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit R th(j-a) thermal resistance from in free air [] - - 47 K/W junction to ambient R th(j-sp) thermal resistance from junction to solder point - - 70 K/W [] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. 0 3 Z th(j-a) (K/W) 0 2 0 duty cycle = 0.75 0.5 0.33 0.2 0. 0.05 0.02 0.0 006aab5 0 0 0 5 0 4 0 3 0 2 0 0 0 2 0 3 t p (s) Fig 2. FR4 PCB, standard footprint Transient thermal impedance from junction to ambient as a function of pulse duration; typical values _2 Product data sheet Rev. 02 4 January 2009 4 of 2

7. Characteristics Table 7. Characteristics T amb =25 C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit I CBO collector-base cut-off current [] Pulse test: t p 300 µs; δ 0.02. V CB = 320 V; I E = 0 A - - 00 na V CB = 320 V; I E =0A; - - 0 µa T j = 50 C I CES collector-emitter cut-off V CE = 320 V; I C = 0 A - - 00 na current I EBO emitter-base cut-off V EB =4V; I C = 0 A - - 00 na current h FE DC current gain V CE =0V I C = 50 ma 00 200 - I C = 00 ma 80 50 - I C = 300 ma [] 0 20 - V CEsat collector-emitter I C = 00 ma; I B = 0 ma - 00 200 mv saturation voltage I C = 00 ma; I B = 20 ma - 60 90 mv I C = 300 ma; I B = 60 ma - 35 250 mv V BEsat base-emitter saturation I C = 300 ma; I B =60mA [] - 0.9. V voltage f T transition frequency V CE =0V; I C = 00 ma; - 30 - MHz f = 00 MHz C c collector capacitance V CB =20V; I E =i e =0A; - 4 - pf f=mhz C e emitter capacitance V EB = 0.5 V; I C =i c =0A; - 65 - pf f=mhz t d delay time V CC =6V; I C = 0.5 A; - 50 - ns t r rise time I Bon = 0. A; I Boff = 0. A - 6200 - ns t on turn-on time - 6250 - ns t s storage time - 800 - ns t f fall time - 2200 - ns t off turn-off time - 3000 - ns _2 Product data sheet Rev. 02 4 January 2009 5 of 2

400 006aab74.0 006aab75 h FE 300 200 () (2) I C (A) 0.8 0.6 0.4 I B (ma) = 75 05 35 40 70 (3) 00 0.2 0 0 0 0 2 0 3 0 0 2 3 4 5 V CE (V) Fig 3. V CE =0V () T amb = 00 C (2) T amb =25 C (3) T amb = 55 C DC current gain as a function of collector current; typical values Fig 4. T amb =25 C Collector current as a function of collector-emitter voltage; typical values.6 006aab76.3 006aab77 V BE (V).2 V BEsat (V) 0.9 () 0.8 () (2) (2) 0.4 (3) 0.5 (3) Fig 5. 0 0 0 0 2 0 3 0 4 V CE =0V () T amb = 55 C (2) T amb =25 C (3) T amb = 00 C Base-emitter voltage as a function of collector current; typical values Fig 6. 0. 0 0 0 2 0 3 0 4 I C /I B =5 () T amb = 55 C (2) T amb =25 C (3) T amb = 00 C Base-emitter saturation voltage as a function of collector current; typical values _2 Product data sheet Rev. 02 4 January 2009 6 of 2

0 006aab78 0 006aab79 V CEsat (V) V CEsat (V) 0 () (2) (3) 0 () (2) (3) 0 2 0 0 0 2 0 3 0 2 0 0 0 2 0 3 I C /I B =5 () T amb = 00 C (2) T amb =25 C (3) T amb = 55 C Fig 7. Collector-emitter saturation voltage as a function of collector current; typical values Fig 8. T amb =25 C () I C /I B =20 (2) I C /I B =0 (3) I C /I B =5 Collector-emitter saturation voltage as a function of collector current; typical values 0 3 006aab80 0 3 006aab8 R CEsat (Ω) R CEsat (Ω) 0 2 0 2 0 0 () (2) (3) () (2) (3) 0 0 0 0 2 0 3 I C /I B =5 () T amb = 00 C (2) T amb =25 C (3) T amb = 55 C Fig 9. Collector-emitter saturation resistance as a function of collector current; typical values Fig 0. 0 0 0 0 2 0 3 T amb =25 C () I C /I B =20 (2) I C /I B =0 (3) I C /I B =5 Collector-emitter saturation resistance as a function of collector current; typical values _2 Product data sheet Rev. 02 4 January 2009 7 of 2

8. Test information V BB V CC oscilloscope (probe) 450 Ω R B R C V o (probe) 450 Ω oscilloscope V I R2 DUT R mlb826 Fig. Test circuit for switching times 9. Package outline 8. Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q0 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. 3.0 2.8. 0.9 3 2.5 2..4.2 0.45 0.5 Dimensions in mm 2.9 0.48 0.38 0.5 0.09 04--04 Fig 2. Package outline SOT23 (TO-236AB) 0. Packing information Table 8. Packing methods The indicated -xxx are the last three digits of the 2NC ordering code. [] Type number Package Description Packing quantity 3000 0000 SOT23 4 mm pitch, 8 mm tape and reel -25-235 [] For further information and the availability of packing methods, see Section 4. _2 Product data sheet Rev. 02 4 January 2009 8 of 2

. Soldering 3.3 2.9.9 solder lands 3.7 2 solder resist solder paste 0.7 (3 ) 0.6 (3 ) occupied area Dimensions in mm 0.5 (3 ) 0.6 (3 ) sot023_fr Fig 3. Reflow soldering footprint SOT23 (TO-236AB).2 (2 ) 2.2.4 (2 ) solder lands 4.6 2.6 solder resist occupied area.4 Dimensions in mm preferred transport direction during soldering 2.8 4.5 sot023_fw Fig 4. Wave soldering footprint SOT23 (TO-236AB) _2 Product data sheet Rev. 02 4 January 2009 9 of 2

2. Revision history Table 9. Revision history Document ID Release date Data sheet status Change notice Supersedes _2 200904 Product data sheet - _ Modifications: Figure 4: amended Section 3 Legal information : updated _ 20080205 Product data sheet - - _2 Product data sheet Rev. 02 4 January 2009 0 of 2

3. Legal information 3. Data sheet status Document status [][2] Product status [3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [] Please consult the most recently issued document before initiating or completing a design. [2] The term short data sheet is explained in section Definitions. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 3.2 Definitions Draft The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 3.3 Disclaimers General Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer s own risk. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 6034) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Quick reference data The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 3.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 4. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com _2 Product data sheet Rev. 02 4 January 2009 of 2

5. Contents Product profile........................... General description.......................2 Features...............................3 Applications............................4 Quick reference data..................... 2 Pinning information...................... 2 3 Ordering information..................... 2 4 Marking................................ 2 5 Limiting values.......................... 3 6 Thermal characteristics................... 4 7 Characteristics.......................... 5 8 Test information......................... 8 8. Quality information...................... 8 9 Package outline......................... 8 0 Packing information...................... 8 Soldering.............................. 9 2 Revision history........................ 0 3 Legal information....................... 3. Data sheet status...................... 3.2 Definitions............................ 3.3 Disclaimers........................... 3.4 Trademarks........................... 4 Contact information..................... 5 Contents.............................. 2 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section Legal information. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 4 January 2009 Document identifier: _2

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