I FSM P tot 500 mw. 150 C Storage temperature T stg

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Silicon Schottky Diode Medium current rectifier Schottky diode Low forward voltage at m High reverse voltage Pbfree (RoHS compliant) package ) Qualified according EC Q BS5V ESD (Electrostatic discharge) sensitive device, observe handling precaution! Type Package Configuration Marking BS5V SC79 single y Maximum Ratings at T = 5 C, unless otherwise specified Parameter Symbol Value Unit Diode reverse voltage V R 45 V Forward current I F 75 m verage rectified forward current (5/6Hz, sinus) I FV 5 m Nonrepetitive peak surge forward current t = µs I FSM Total power dissipation T S C P tot 5 mw Junction temperature T j 5 C Storage temperature T stg 65... 5 Thermal Resistance Parameter Symbol Value Unit Junction soldering point ) R thjs 6 K/W Pbcontaining package may be available upon special request For calculation of R thj please refer to pplication Note Thermal Resistance 749

Electrical Characteristics at T = 5 C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. DC Characteristics Reverse current I R µ V R = 45 V V R = 5 V, T = 7 C V R = V V R = V, T = 85 C 3 8 Forward voltage V F mv I F = m 335 4 I F = m 43 53 I F = m 4 5 6 C Characteristics Diode capacitance V R = V, f = MHz C T 5 pf 749

Reverse current I R = ƒ (T ) V R = Parameter Reverse current I R = ƒ(v R ) T = Parameter 3 3 5 C 4 4 85 C 5 5 IR 6 IR 6 5 C VR=V 7 VR=5V 7 8 8 4 C 9 9 5 3 3 5 7 9 C 3 T 3 4 V 55 V R Forward Voltage V F = ƒ (T ) I F = Parameter Forward current I F = ƒ (V F ) T = Parameter 58 V 5 IF=m VF 46 4 IF=m IF 38 34 3 IF=m 4 C 5 C 85 C 5 C 6 8 5 3 3 5 7 9 C 3 T 3...3.4.5.6 V.8 V F 3 749

Permissible Reverse voltage V R = ƒ (T ) t p = Parameter Duty cycle <. Forward current I F = ƒ (T S ) 5 V 4 35 tp=3µs tp=ms DC m 8 6 VR 3 IF 5 5 4 3 5 5 4 6 8 C 6 5 3 45 6 75 9 5 C 5 T T S Permissible Puls Load R thjs = ƒ (t p ) Permissible Pulse Load I Fmax / I FDC = ƒ (t p ) K/W RthJS IFmax/IFDC.5...5...5 D = D =.5...5...5 6 5 4 3 s t p 6 5 4 3 s t p 4 749

Package SC79 BS5... Package Outline.8 ±..6 ±. MX.. M +.5.3.3 MX.. ±. Cathode marking.3 ±.5.55 ±.4. ±.5 Foot Print.35.35.35 Marking Layout (Example) 5, June Date code BR63V Type code Cathode marking Laser marking Standard Packing Reel ø8 mm = 3. Pieces/Reel Reel ø8 mm = 8. Pieces/Reel ( mm Pitch) Reel ø33 mm =. Pieces/Reel Standard 4 Reel with mm Pitch..33.96 8 Cathode marking.4.93 Cathode marking.66 5 749

Date Code marking for discrete packages with one digit (SCD8, SC79, SC75 ) ) CESCode Month 3 4 5 6 7 8 9 3 4 a p P a p P a p P b q B Q b q B Q b q B Q 3 c r C R c r C R c r C R 4 d s D S d s D S d s D S 5 e t E T e t E T e t E T 6 f u F U f u F U f u F U 7 g v G V g v G V g v G V 8 h x H X h x H X h x H X 9 j y J Y j y J Y j y J Y k z K Z k z K Z k z K Z l L 4 l L 4 l L 4 n 3 N 5 n 3 N 5 n 3 N 5 ) New Marking Layout for SC75, implemented at October 5.. 6 749

Edition 6 Published by Infineon Technologies G 876 München, Germany Infineon Technologies G 7. ll Rights Reserved. ttention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics ( Beschaffenheitsgarantie ). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of noninfringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in lifesupport devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that lifesupport device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 7 749