DATA SHEET. PMBFJ174 to 177 P-channel silicon field-effect transistors DISCRETE SEMICONDUCTORS

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DISCRETE SEMICONDUCTORS DT SHEET PMBFJ174 to 177 P-channel silicon field-effect transistors File under Discrete Semiconductors, SC07 pril 1995

DESCRIPTION Silicon symmetrical p-channel junction FETs in plastic microminiature SOT23 envelopes.they are intended for application with analogue switches, choppers, commutators etc. using SMD technology. special feature is the interchangeability of the drain and source connections. PINNING 1 = drain 2 = source 3 = gate handbook, halfpage 3 1 2 Top view g MM386 d s Note 1. Drain and source are interchangeable. Marking codes: Fig.1 Simplified outline and symbol, SOT23. 174 : p6x 175 : p6w 176 : p6s 177 : p6y QUICK REFERENCE DT Drain-source voltage ± V DS max. 30 V Gate-source voltage V GSO max. 30 V Gate current I G max. 50 m Total power dissipation up to T amb =25 C P tot max. 300 mw Drain current V DS = 15 V; V GS =0 I DSS > < PMBFJ174 175 176 177 Drain-source ON-resistance V DS = 0,1 V; V GS =0 R DS on < 85 125 250 300 Ω 20 135 7 70 2 35 1,5 20 m m pril 1995 2

RTINGS Limiting values in accordance with the bsolute Maximum System (IEC 134) Drain-source voltage ± V DS max. 30 V Gate-source voltage V GSO max. 30 V Gate-drain voltage V GDO max. 30 V Gate current (d.c.) I G max. 50 m Total power dissipation up to T amb =25 C (1) P tot max. 300 mw Storage temperature range T stg 65 to + 150 C Junction temperature T j max. 150 C THERML RESISTNCE From junction to ambient in free air R th j-a = 430 K/W STTIC CHRCTERISTICS T j =25 C unless otherwise specified PMBFJ174 175 176 177 Gate cut-off current V GS = 20 V; V DS =0 I GSS < 1 1 1 1 n Drain cut-off current V DS = 15 V; V GS = 10 V I DSX < 1 1 1 1 n Drain current V DS = 15 V; V GS =0 I DSS > 20 7 2 1,5 m < 135 70 35 20 m Gate-source breakdown voltage I G =1µ; V DS =0 V (BR)GSS > 30 30 30 30 V Gate-source cut-off voltage I D = 10 n; V DS = 15 V V GS off > 5 3 1 0,8 V < 10 6 4 2,25 V Drain-source ON-resistance V DS = 0,1 V; V GS =0 R DS on < 85 125 250 300 Ω Note 1. Mounted on a ceramic substrate of 8 mm 10 mm 0,7 mm. pril 1995 3

DYNMIC CHRCTERISTICS T j =25 C unless otherwise specified Input capacitance, f = 1 MHz V GS = 10 V; V DS =0 V C is typ. 8 pf V GS =V DS =0 C is typ. 30 pf Feedback capacitance, f = 1 MHz V GS = 10 V; V DS =0 V C rs typ. 4 pf Switching times (see Fig.2 + 3) PMBFJ174 175 176 177 Delay time t d typ. 2 5 15 20 ns Rise time t r typ. 5 10 20 25 ns Turn-on time t on typ. 7 15 35 45 ns Storage temperature t s typ. 5 10 15 20 ns Fall time t f typ. 10 20 20 25 ns Turn-off time t off typ. 15 30 35 45 ns Test conditions: V DD 10 6 6 6 V V GS off 12 8 6 3 V R L 560 1200 2000 2900 Ω V GS on 0 0 0 0 V handbook, halfpage V DD V GSoff 90% 50 Ω V out INPUT 10% R L 10% 10% V in D.U.T OUTPUT 90% 90% 50 Ω t f t r MBK292 t s t d MBK293 Rise time input voltage < 1 ns Fig.2 Switching times test circuit Fig.3 Input and output waveforms t d + t r =t on t s + t f =t off pril 1995 4

PCKGE OUTLINE Plastic surface mounted package; 3 leads SOT23 D B E X H E v M 3 Q 1 1 2 c e1 bp w M B Lp e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT 1 max. 1.1 mm 0.1 0.9 b p c D E e e 1 H E L p Q v w 0.48 0.38 0.15 0.09 3.0 2.8 1.4 1.2 1.9 0.95 2.5 2.1 0.45 0.15 0.55 0.45 0.2 0.1 OUTLINE VERSION REFERENCES IEC JEDEC EIJ EUROPEN PROJECTION ISSUE DTE SOT23 97-02-28 pril 1995 5

DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. Short-form specification The data in this specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values Limiting values given are in accordance with the bsolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. pplication information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT PPLICTIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. pril 1995 6