2G HTS Wire for Demanding Applications and Continuous Improvement Plans

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superior performance. powerful technology. 2G HTS Wire for Demanding Applications and Continuous Improvement Plans DW Hazelton Tuesday, September 17, 2013 EUCAS-2013, Genova, Italy SuperPower Inc. is a subsidiary of Furukawa Electric Co. Ltd.

Acknowledgements We would like to acknowledge the contributions of the team at SuperPower as well as collaborators from around the world. In particular we would like to acknowledge the input from Toru Fukushima, Paul Brownsey, Honghai Song*, Yifei Zhang, Justin Waterman, Trudy Lehner, Hisaki Sakamoto, Ross McClure and Allan Knoll. The work presented here is supported in part from funding from the US DOE Smart Grid Program and ARPA-E. *currently at MSU-FRIB 2

Engineering progress drives 2G HTS adoption Feature Approach Assessment Robust wire design Mechanical strength In-field performance Critical current (Ic) under magnetic field Alternative constructs Higher operating currents Special application requirements Hastelloy based substrate supporting structure Flux pinning with engineered nanostructure Consistent & uniform process Cable constructs Bonded conductor designs Alternative materials Tensile strength Peel strength Splicing stress Enhanced Ic at low (4.2-40K) temp. and under perpendicular field components (2-15T) Higher operating currents Stronger conductors with application specific properties 3

HTS applications have a wide range of demanding performance characteristics Energy Defense Transportation Industrial Medical Science/ Research Cable FCL Generators Transformers, incl. FCL Storage SMES Flywheels Motors Cables Directed energy weapons Maglev Motors Rail engines Induction heaters Motors Generators Magnetic separation Bearings Current leads MRI NMR HF magnets Space exploration SQUIDS High energy physics Electronics Cell tower base station filters Courtesy of Waukesha Courtesy of SuperPower and Furukawa Courtesy of Oswald 4

Wire performance critical to practical applications I c (B, T, ) Temperature, magnetic field and field orientation dependence of I c Minimum I c at operating condition Mechanical properties (electromechanical performance) Workability for fabrication into various devices Irreversible stress or strain limits under various stress condition, in terms of I c Uniformity along length (I c and other attributes) Thermal properties (thermal expansion coefficient and thermal conductivity) Quench stability (NZPV and MQE) Insulation (material and method) Splice Resistance (resistivity) Mechanical strength (tensile and bending) Standards for 2G HTS wire property testing are under development 5

SuperPower s ReBCO superconductor with artificial pinning structure provides a solution for demanding applications Hastelloy C276 substrate high strength high resistance non-magnetic Buffer layers with IBAD-MgO Diffusion barrier to metal substrate Ideal lattice matching from substrate through ReBCO MOCVD grown ReBCO layer with BZO nanorods Flux pinning sites for high in-field I c Silver and copper stabilization 6

Tensile strength predominately determined by substrate 20 µm Cu 40 µm Cu 100 µm Cu Tensile stress-strain relationship of as-polished Hastelloy substrate (room temperature) Tensile stress-strain relationship of SCS4050 wires with different Cu stabilizer thickness (room temperature) 7

Tensile strength - effect of stress on I c Normalized I c vs. room temperature tensile stress for a 12mm wide wire with 100 m Cu stabilizer 8

Delamination strength studied with peel test P 90 peel test P T-peel test Cu Ag REBCO Buffer Hastelloy Ag Cu Cohesive Adhesive Mixed mode Peeling Load (N) Displacement (mm) Relationship between peel strength and processing conditions established 9

Successful winding techniques demonstrated to mitigate delamination issue Decoupling of former from winding has been demonstrated to be beneficial Eliminates radial tensile stress on the 2G HTS windings PET release layer incorporated at former:windings interface Lower thermal expansion formers (Ti, controlled expansion glassepoxy) Alternative insulations/epoxy systems have been successfully demonstrated PET shrink tube - NHMFL Electrodeposited polyimide - Riken Alternative epoxy system with filler - KIT Use of cowound stainless steel as insulation with partial epoxy application on coil sides Mitigates radial tensile stress on the 2G HTS Improves overall coil strength Negative impact on coil current density 1 0

Stainless steel insulation, partial epoxy application on coil sides shows resistance to delamination Very thin layer of epoxy (transparent) after epoxy is cured Mechanical fix turn-turn and layer-layer Provides thermal link between optional cooling plates and windings Seals the coil Voltage (V) 1.00E-02 8.00E-03 6.00E-03 4.00E-03 2.00E-03 Five thermal cycles (77K), no degradation found TC#1 TC#2 TC#3 TC#4 TC#5 0.00E+00-2.00E-03 0 10 20 30 40 50 Current (A) 11

In-field critical current operating conditions vary by application Lift Factor defined as I c (B,T) / I c (self field, 77K) Ic (B//c, T) / Ic (self field, 77 K) 10.00 1.00 0.10 0.01 4.2 K 14 K 22 K 33 K 45 K 50 K 65 K 77 K Cables, FCLs, transformers Motors, generators 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 Applied Field B (T) HF magnets, SMES 12

In-field performance: Advantage of 2G HTS wire with flux pinning Advanced MOCVD growth technology: Formation of dense & uniform nanorods Engineered growth properties Potential migration to new compositions Enhanced Artificial Pinning Effect Improved in-field critical current SuperPower s AP wire recipe BZO nanorod Nanorods with BaZrO Pinned flux Superconductive current flow 13

Increased Zr doping in ReBCO layer for improvement in critical current in the field Increased Zr doping Chen, et. al. ASC2012, Portland, Oregon, Oct. 2012 14

Lift factor performance tied to film composition and growth conditions 30K, 3T 774A 807A 373A 795A 442A 1037A Composition X Precursor composition / Flow rate / Concentration / Chamber pressure, etc. etc. 15

I c (B,T, Φ) characterization is critical to understanding the impacts of processing on operational performance M3 909 3 Lift Factor vs. H//ab, T 65 K 50K 40 K 30K 20K M3 909 3 Lift Factor vs. H//c, T 65 K 50K 40 K 30K 20K Lift Factor [ Ic(H,T)/Ic(sf, T) ] //ab 7 6 5 4 3 2 1 0 0.0 2.0 4.0 6.0 8.0 10.0 Applied Field (Tesla) Lift Factor [ Ic(H,T)/Ic(sf, T) ] //ab 7 6 5 4 3 2 1 0 0.0 2.0 4.0 6.0 8.0 10.0 Applied Field (Tesla) Measurements made at the University of Houston Lift factor, I c (B,T)/I c (sf, 77K), particularly a full matrix of I c (B,T, Φ) is in high demand. Frequently sought by coil/magnet design engineer, for various applications. Used to calculate local I op / Ic ratio inside coil body, and design quench protection. 16

IcBT measurement system being built for routine production sampling Target operating conditions Temperature: 30K 77K Field: 0-2T (65K) Higher field operation at 4K Field //c and //ab (rotatable 0-225 deg) Sample length in field min 25 mm Maximum sample current 800-1200A Full width samples to 4mm wide Maximum coil current 400A 2G HTS background coils Enables testing of production material in Schenectady (77K- 30K, 0-2T) to evaluate consistency of lift factor. 1 7

Low temperature high field data being collected at multiple sources Internally at FEC s Nikko facility in Japan (4 mm tape up to 17T) Collaborators / customers facilities NHMFL (full tape, to 15T, YatesStar) Tohoku University (through FEC, bridge samples, to 15T) BNL (8T+) Other international high field test sites Customer facility (to 17T) This data will be correlated with processing conditions to better understand processing windows to result in more consistent uniform product. 18

I c uniformity along length (TapeStar) Position (cm) (on a 12 mm wide wire) Magnetic, non-contact measurement High spacial resolution, high speed, reel-to-reel Monitoring I c at multiple production points after MOCVD Capability of quantitative 2D uniformity inspection 19

I c uniformity along length (four-probe transport measurement) Ic (A, 77K, s.f.) and n-value Position (m) (on a 4 mm wide wire) 20

Engineering new wire innovations to address customer requests and meet application requirements Additional wire insulation methods Today: Kapton /Polyimide wrapped Other options under development: thinner profile, better coverage Additional wire architectures under development Higher current carrying capability Multi-layer combinations Cable on Round Core (CORC) Plus others Custom attributes FCL normal state resistance feature Courtesy: Advanced Conductor Technologies 21

Demanding requirements for ROEBEL cable for ac applications ROEBEL cable is a known approach to produce low ac loss, high current conductor/cable Conductor exposed to severe mechanical cutting at sharp angles ROEBEL cable made by KIT with SuperPower 2G HTS Wire No failure, no delamination Only 3% loss in current from conductor to ROEBEL cable Cable engineering current density = 11,300 A/cm 2 22

Capability for bonded conductors being developed [higher amperage, specialty applications (FCL) ] Bonded conductors offer the ability to achieve higher operating currents LV windings of FCL transformer HEP applications High current bus applications Bonded conductors offer higher strength FCL transformer fault currents High field HEP applications with high force loadings Bonded conductors offer the ability to tailor application specific operating requirements, i.e. normal state resistance for a FCL transformer 23

Reliable splices low resistance and high strength Splicing / terminations required in most applications Splice properties are important conductor performance and have influences on dielectrics and cryogenics as well Low resistance and high electromechanical strength are basic requirements Bridge joints between pancakes, R tot = 10-7 Ω Contact resistivity at REBCO/Ag interface has an effect on splice resistance Splices fabricated via soldering at a temperature below 250 C Soldering temperature, pressure, duration time are important parameters I c retained across splices with no degradation through soldering Splice resistance R 20 n for the lap joint geometry with a 10cm overlap length Splicing per customer request and each splice inspected 24

Splice I c and resistance vs. bending diameter I c (d) / I c ( ) or R (d) / R ( ) Ratio Bending Diameter (mm) Lap joint (HTS-HTS) of SCS4050 tapes with 40 µm Cu stabilizer R( ) = 6 ~ 20 n with 10 cm overlap length Bent at room temperature and I c measured at 77K 25

Summary SuperPower 2G HTS conductor offers a flexible architecture to address the broad range of demanding applications requirements. SuperPower is engaging major resources in improving its manufacturing capabilities to deliver a consistent, reliable, high quality 2G HTS product Improved consistency of lift factor Improved piece length Improved current density Improved uniformity Alternative conductor configurations are being developed to address customer demand 26