ASMT-J32 3W Mini Power LED Light Source Data Sheet Description The 3W Mini Power LED Light Source is a high performance energ efficient device which can handle high thermal and high driving current. The metal slug is electricall isolated. The White Mini Power LED is available in the range of color temperature from 2700K to 10000K. The low profile package design and ultra small footprint is suitable for a wide variet of applications especiall where space and height is a constraint. The package is compatible with reflow soldering process. To facilitate eas pick & place assembl, the LEDs are packed in EIA-compliant tape and reel. Features Available in Cool White, Neutral White and Warm White Small footprint and low profile Smmetrical outline Energ efficient Direct heat transfer from metal slug to mother board Compatible with reflow soldering process High current operation Long operation life Wide viewing angle Silicone encapsulation Non-ESD sensitive (threshold > 16kV) MSL 1 products Applications Sign backlight Safet, eit and emergenc sign lightings Specialt lighting such as task lighting and reading lights Retail displa Commercial lighting Accent or marker lightings, strip or step lightings Portable lightings, biccle head lamp, torch lights Decorative lighting Architectural lighting Pathwa lighting Street lighting Pedestrian street lighting Tunnel lighting CAUTION: Customer is advised to keep the LEDs in the MBB when not in use as prolonged eposure to environment might cause the silver plated leads to tarnish, which might cause difficulties in soldering.
Package Dimensions 5.0 4.0 0.8 0.7 4.0 1.0 Ø 3.7 1.85 0.3 Anode Lead NC Lens Cathode Mark NC NC Bod NC Cathode Lead Metal Slug 0.65 0.60 Ø 1.70 Notes: 1. All dimensions in millimeters. 2. Tolerance is ±0.1 mm unless otherwise specified. 3. Terminal finish: Ag plating. 4. Corresponding NC (No Connection) leads adjacent to anode and cathode leads can be electricall short. Figure 1. ASMT-J32 package outline drawing 2
Part Numbering Sstem ASMT- J 1 3 2 2 3 4 5 6 Note: 1. Please refer to Page 8 for selection details. Packaging Option Color Bin Selection Maimum Flu Bin Selection Minimum Flu Bin Selection Dice Tpe N InGaN Color W Cool White N Neutral White Y Warm White Device Selection Guide (T J = 25 C) Luminous Flu (Im), Φ V [1,2] Electricall Part Number Color Min. Tp. Ma. Test Current (ma) Dice Technolog Isolated Metal Slug ASMT-JW32-NWY01 Cool White 113.6 140.0 168.4 350 InGaN Yes ASMT-JW32-NWYJ1 113.6 140.0 168.4 350 InGaN Yes ASMT-JN32-NWY01 Neutral White 113.6 140.0 168.4 350 InGaN Yes ASMT-JN32-NWYH1 113.6 140.0 168.4 350 InGaN Yes ASMT-JY32-NWY01 Warm White 113.6 130.0 168.4 350 InGaN Yes ASMT-JY32-NWYK1 113.6 130.0 168.4 350 InGaN Yes Notes: 1. Φ V is the total luminous flu output as measured with an integrating sphere at 25ms mono pulse condition. 2. Flu tolerance is ±10% Absolute Maimum Ratings Parameter ASMT-J32 Units DC Forward Current [1] 700 ma Peak Pulsing Current 2400 ma Power Dissipation 2730 mw LED Junction Temperature 135 C Operating Metal Slug Temperature Range at 350 ma -40 to +120 C Operating Metal Slug Temperature Range at 700 ma -40 to +105 C Storage Temperature Range -40 to + 120 C Soldering Temperature Refer to Figure 15 Reverse Voltage [2] Notes: 1. Derate linearl based on Figure 11. 2. Not designed for reverse bias operation. Not recommended 3
Optical Characteristics at 350 ma (T J = 25 C) Part Number Color Correlated Color Temperature, CCT (Kelvin) Viewing Angle, 2θ ½ [1] ( ) Luminous Efficienc (lm/w) Min. Ma. Tp. Tp. ASMT-JW32-NWY01 Cool White 4500 10000 140 125 ASMT-JW32-NWYJ1 5000 6300 140 125 ASMT-JN32-NWY01 Neutral White 3500 4500 140 125 ASMT-JN32-NWYH1 3800 4500 140 125 ASMT-JY32-NWY01 Warm White 2700 3500 140 116 ASMT-JY32-NWYK1 3050 3500 140 116 Note: 1. θ½ is the off-ais angle where the luminous intensit is ½ the peak intensit. Electrical Characteristic at 350 ma (T J = 25 C) Dice Tpe Forward Voltage, V F (Volts) Thermal Resistance, Rθ J-MS ( C/W) [1] Min. Tp Ma. Tp. InGaN 2.8 3.2 3.5 9 Note: 1. Rθ J-MS is Thermal Resistance from LED junction to metal slug. Optical and Electrical Characteristic at 700 ma (T J = 25 C) Part Number Color Luminous Flu (lm), φ V Forward Voltage, V F (Volts) ASMT-JW32-NWY01 Cool White 239.0 3.6 ASMT-JW32-NWYJ1 239.0 3.6 ASMT-JN32-NWY01 Neutral White 239.0 3.6 ASMT-JN32-NWYH1 239.0 3.6 ASMT-JY32-NWY01 Warm White 222.0 3.6 ASMT-JY32-NWYK1 222.0 3.6 Tp. Tp. 4
RELATIVE INTENSITY 1.0 0.9 0.8 0.7 0.6 WARM WHITE COOL WHITE 0.5 0.4 0.3 0.2 0.1 0.0 380 430 480 530 580 630 680 730 780 WAVELENGTH - nm Figure 2. Relative Intensit vs. Wavelength for Cool White and Warm White RELATIVE INTENSITY 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 380 430 480 530 580 630 680 730 780 WAVELENGTH - nm Figure 3. Relative Intensit vs. Wavelength for Neutral White RELATIVE LUMINOUS FLUX (NORMALIZED AT 350 ma) 2 1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 0 100 200 300 400 500 600 700 MONO PULSE CURRENT - ma Figure 4. Relative Luminous Flu vs. Mono Pulse Current FORWARD CURRENT - ma 700 650 600 550 500 450 400 350 300 250 200 150 100 50 0 0 0.5 1 1.5 2 2.5 3 3.5 4 FORWARD VOLTAGE - V Figure 5. Forward Current vs. Forward Voltage IP - PULSE CURRENT - A 3.00 2.80 2.60 2.40 2.20 2.00 1.80 1.60 1.40 1.20 1.00 0.80 0.60 0.40 0.20 0.00 0.00001 0.0001 0.001 0.01 0.1 1 10 100 t p - PULSE DURATION - sec Figure 6. Maimum pulse current vs. pulse duration Derated based on T A = 25 C, Rθ J-A = 30 C/W. D = t p T t p D = 0.05 0.10 0.25 0.50 1.00 T I F IP - PULSE CURRENT - A 3.00 2.80 2.60 2.40 2.20 2.00 1.80 1.60 1.40 1.20 1.00 0.80 D = 0.05 0.10 0.25 0.50 1 0.60 0.40 0.20 0.00 0.00001 0.0001 0.001 0.01 0.1 1 10 100 t p - PULSE DURATION - sec Figure 7. Maimum pulse current vs. pulse duration Derated based on T A = 85 C, Rθ J-A = 30 C/W. D = t p T t p T I F 5
NORMALIZED INTENSITY 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0-90 -60-30 0 30 60 90 ANGULAR DISPLACEMENT - DEGREES Figure 8. Radiation Pattern for Cool White, Warm White and Neutral White RELATIVE LIGHT OUTPUT (%) 120.0 110.0 100.0 0.10 0.05 90.0 0.00 80.0 70.0-0.05 60.0-0.10 50.0 40.0-0.15 30.0-0.20 20.0 10.0-0.25 0.0 25 50 75 100 125 150-0.30 25 50 75 100 125 150 JUNCTION TEMPERATURE, T J - C JUNCTION TEMPERATURE, T J - C FORWARD VOLTAGE SHIFT - V Figure 9. Relative Light Output vs. Junction Temperature Figure 10. Forward Voltage Shift vs. Junction Temperature MAX ALLOWABLE DC CURRENT - ma 800 700 600 500 400 300 200 100 0 Rθ J-A = 20 C/W Rθ J-A = 25 C/W Rθ J-A = 30 C/W 0 20 40 60 80 100 120 140 AMBIENT TEMPERATURE, T A - C Figure 11. Maimum Forward Current vs. Ambient Temperature. Derated based on T JMAX = 135 C, Rθ J-A = 20 C/W, 25 C/W and 30 C/W MAX ALLOWABLE DC CURRENT - ma 800 700 600 500 400 300 200 100 0 Rθ J-MS = 9 C/W 0 20 40 60 80 100 120 140 METAL SLUG TEMPERATURE, T MS - C Figure 12. Maimum Forward Current vs. Metal Slug Temperature. Derated based on T JMAX = 135 C, Rθ J-MS = 9 C/W 6
Solder Pad 0.80 0.85 ø1.90 Slug Indepdent 3.50 5.20 1.75 ø3.2 Solder Pad 1.30 Figure 13. Recommended soldering land pattern Figure 14. Recommended pick and place nozzle tip. Inner diameter = 3.2 mm 10-30 SEC. TEMPERATURE 217 C 200 C 150 C 255-260 C 3 C/SEC. MAX. 3 C/SEC. MAX. 6 C/SEC. MAX. 60-120 SEC. 100 SEC. MAX. TIME Figure 15. Recommended Reflow Soldering Profile (Acc. to J-STD-020C) Note: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN1060 Surface Mounting SMT LED Indicator Components. 7
Option Selection Details ASMT-J 1 3 2 2 3 4 5 6 3 Minimum Flu Bin Selection 4 Maimum Flu Bin Selection 5 Color Bin Selection 6 Packaging Option Flu Bin Limit [ 3, 4 ] Luminous Flu (lm) at 350 ma Bin ID Min. Ma. U 87.4 99.6 V 99.6 113.6 W 113.6 129.5 X 129.5 147.7 Y 147.7 168.4 Color Bin Selection [ 5 ] Individual reel will contain parts from one color bin selection onl. Cool White Selection Bin ID 0 Full Distribution E VM, UM, VN and UN F WM, VM, WN and VN G XM, WM, XN and WN H UN, VN, U0 and V0 J WN, VN, W0 and V0 K XN, WN, X0 and W0 L V0, U0, VP and UP M W0, V0, WP, VP and WQ N X0, W0, XP, WP and WQ P Y0 Q YA Warm White Selection Bin ID 0 Full Distribution E NM, MM, N1 and M1 F PM, NM, P1 and N1 G QM, PM, Q1 and P1 H M1, N1, M0 and N0 J P1, N1, P0 and N0 K Q1, P1, Q0 and P0 L N0, M0, NA and MA M P0, N0, PA and NA N Q0, P0, QA and PA Neutral White Selection Bin ID 0 Full Distribution E SM, RM, S1 and R1 F TM, SM, TN and S1 G S1, R1, S0 and R0 H TN, S1, T0 and S0 J S0, R0, SA and RA K T0, S0, TP and SA 8
Y-COORDINATE 0.42 0.40 0.38 0.36 0.34 0.32 0.30 0.28 10000K 4500K 5000K UM 5650K 6300K VM UN U0 WM VN 7000K XM WN V0 UP XN W0 VP X0 WP Y0 XP WQ BLACK BODY CURVE YA 0.26 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 X-COORDINATE Figure 16. Color bin Structure for Cool White Y-COORDINATE 0.48 0.46 0.44 0.42 0.40 0.38 0.36 0.34 QA 2700K 3050K 2850K MM 3500K 3250K PM NM QM N1 M1 P1 Q1 P0 M0 Q0 N0 MA NA PA BLACK BODY CURVE 0.32 0.38 0.40 0.42 0.44 0.46 0.48 0.50 X-COORDINATE Figure 17. Color bin structure for Warm White Y-COORDINATE 0.46 0.44 0.42 0.40 0.38 0.36 0.34 4100K 4500K SM TM S1 TN S0 T0 SA RA TP 3500K 3800K RM R1 R0 BLACK BODY CURVE 0.32 0.34 0.36 0.38 0.40 0.42 0.44 X-COORDINATE Figure 18. Color bin structure for Neutral White 9
Color Bin Limits Cool White Bin UM Bin UN Bin U0 Bin UP Bin VM Bin VN Bin V0 Bin VP Bin WM Bin WN Bin W0 Bin WP Bin WQ Bin XM Bin XN Bin X0 Color Limits (Chromaticit Coordinates) 0.365 0.386 0.365 0.386 0.362 0.360 0.345 0.331 0.331 0.369 0.345 0.345 0.331 0.301 0.342 0.305 0.322 0.308 0.311 0.367 0.400 0.362 0.360 0.342 0.369 0.345 0.316 0.331 0.310 0.314 0.355 0.303 0.305 0.322 0.348 0.385 0.346 0.359 0.343 0.331 0.348 0.385 0.347 0.346 0.359 0.343 0.331 0.315 0.315 0.317 0.318 0.310 0.319 0.300 0.315 0.315 0.316 0.347 0.347 0.346 0.359 0.347 0.346 0.359 0.314 0.355 0.316 0.317 0.318 0.310 0.303 0.316 0.317 Warm White Bin MM Bin M1 Bin M0 Bin MA Bin NM Bin N1 Bin N0 Bin NA Bin PM Bin P1 Bin P0 Bin PA Bin QM Bin Q1 Bin Q0 Bin QA Color Limits (Chromaticit Coordinates) 0.471 0.451 0.460 0.453 0.459 0.403 0.454 0.446 0.426 0.438 0.412 0.399 0.438 0.440 0.421 0.424 0.407 0.429 0.394 0.421 0.433 0.409 0.400 0.389 0.460 0.453 0.399 0.399 0.426 0.438 0.412 0.429 0.394 0.429 0.394 0.421 0.424 0.407 0.389 0.389 0.409 0.400 0.402 0.402 0.473 0.432 0.467 0.419 0.459 0.403 0.436 0.384 0.460 0.453 0.399 0.422 0.379 0.426 0.438 0.412 0.429 0.394 0.410 0.421 0.424 0.407 0.389 0.396 0.367 0.486 0.455 0.473 0.432 0.467 0.419 0.451 0.389 0.471 0.451 0.460 0.453 0.436 0.384 0.454 0.446 0.426 0.438 0.412 0.422 0.379 0.438 0.440 0.421 0.424 0.407 0.410 Bin XP 0.308 0.311 0.317 0.319 0.300 0.311 0.293 Tolerance: ±0.01 Bin YO 0.308 0.311 0.283 0.284 0.274 0.301 0.303 Bin YA 0.308 0.311 0.311 0.293 0.290 0.270 0.283 0.284 Tolerance: ±0.01 10
Neutral White Bin RM Color Limits (Chromaticit Coordinates) 0.421 0.433 0.406 0.402 0.423 Packaging Option [ 6 ] Selection Option 1 Tape and Reel Bin R1 0.409 0.400 0.392 0.391 0.406 Bin R0 Bin RA Bin SM Bin S1 Bin S0 0.392 0.391 0.387 0.402 0.423 0.406 0.392 0.391 0.387 0.383 0.360 0.406 0.392 0.391 0.387 0.402 0.396 0.367 0.378 0.366 0.409 0.400 0.402 0.386 0.413 0.378 Eample ASMT-JW32-NUV01 ASMT-JW32-N Cool White, InGaN, Electricall isolated Heat Sink X 3 = U Minimum Flu Bin U X 4 = V Maimum Flu Bin V X 5 = 0 Full Distribution X 6 = 1 Tape and Reel Option Bin SA 0.387 0.383 0.360 0.370 0.351 0.366 Bin TM 0.386 0.413 0.365 0.386 0.367 0.400 Bin TN 0.378 0.362 0.365 0.386 Bin T0 0.378 0.366 0.360 0.362 Bin TP 0.366 0.370 0.351 0.342 0.360 Tolerance: ±0.01 11
Tape and Reel Option 1 4.00 ±.10 2.00 ±.05 ø1.5 ±0.1 1.75 ±0.01 0.25 ±0.02 12.00 +.30.10 5.50 ±.05 5 5.25 ±.10 8.00 ±.10 8 ø1.5 ±0.25 4.15 ±.10 0.25 ±0.02 2.01 ±0.1 2.05 ±.10 Figure 19. Carrier Tape Dimensions 13.2 ±.5 16.0 ±.5 3 ±0.5 ø21.0 ±0.5 ø10 ø13.1 ±0.5 178 ±1 ø60 ±0.5 4 ±0.5 5 ±0.5 Notes: 1. Empt component pockets sealed with top cover tape. 2. 250 or 500 pieces per reel. 3. Drawing not to scale. 4. All dimensions are in millimeters. Figure 20. Reel dimensions 12
USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 21. Reeling Orientation DISCLAIMER: Avago s products and software are not specificall designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenance or direct operation of a nuclear facilit or for use in medical devices or applications. Customer is solel responsible, and waives all rights to make claims against avago or its suppliers, for all loss, damage, epense or liabilit in connection with such use. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copright 2005-2015 Avago Technologies. All rights reserved. AV02-2428EN - Februar 2, 2015