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74AHC9; 74AHCT9 Rev. 0 9 May 008 Product data sheet. General description. Features. Ordering information The 74AHC9; 74AHCT9 is a high-speed Si-gate CMOS device and is pin compatible with Low-power Schottky TTL (LSTTL). It is specified in compliance with JEDEC standard No. 7-A. The 74AHC9; 74AHCT9 is a high-speed, dual -to-4 line decoder/demultiplexer. This device has two independent decoders, each accepting two binary weighted inputs (na0 and na) and providing four mutually exclusive active LOW outputs (ny0 to ny). Each decoder has an active LOW enable input (ne). When ne is HIGH, every output is forced HIGH. The enable input can be used as the data input for a -to-4 demultiplexer application. The 74AHC9; 74AHCT9 is identical to the HEF4556 of the HE4000B family. Balanced propagation delays All inputs have Schmitt-trigger actions Inputs accept voltages higher than V CC Input levels: For 74AHC9: CMOS level For 74AHCT9: TTL level ESD protection: HBM EIA/JESD-A4E exceeds 000 V MM EIA/JESD-A5-A exceeds 00 V CDM EIA/JESD-C0C exceeds 000 V Multiple package options Specified from 40 C to +85 C and from 40 C to +5 C Table. Ordering information Type number Package Temperature range Name Description Version 74AHC9 74AHC9D 40 C to +5 C SO6 plastic small outline package; 6 leads; SOT09- body width.9 mm 74AHC9PW 40 C to +5 C TSSOP6 plastic thin shrink small outline package; 6 leads; body width 4.4 mm SOT40-
74AHC9; 74AHCT9 Table. Type number Ordering information continued Package Temperature range Name Description Version 74AHCT9 74AHCT9D 40 C to +5 C SO6 plastic small outline package; 6 leads; body width.9 mm 74AHCT9PW 40 C to +5 C TSSOP6 plastic thin shrink small outline package; 6 leads; body width 4.4 mm 4. Functional diagram SOT09- SOT40-4 A0 A A0 A E E Y0 Y Y Y Y0 Y Y Y 4 5 6 7 0 9 4 5 0 0 DX G 0 DX G 0 0 0 4 5 6 7 0 9 4 5 X/Y EN X/Y EN 0 0 4 5 6 7 0 9 5 mna779 (a) (b) mna78 a = demultiplexer and b = decoder Fig. Logic symbol Fig. IEC logic symbol A0 A DECODER Y0 Y Y 4 5 6 Y 7 E 4 A0 A DECODER Y0 Y Y 0 Y 9 5 E mna780 Fig. Functional diagram 74AHC_AHCT9_ Product data sheet Rev. 0 9 May 008 of 4
74AHC9; 74AHCT9 5. Pinning information 5. Pinning E 6 V CC A0 5 E A 4 A0 Y0 Y 4 5 9 A Y0 Y 6 Y Y 7 0 Y GND 8 9 Y 00aad09 Fig 4. Pin configuration 5. Pin description Table. Pin description Symbol Pin Description E enable input (active LOW) A0 address input A address input Y0 4 output Y 5 output Y 6 output Y 7 output GND 8 ground (0 V) Y 9 output Y 0 output Y output Y0 output A address input A0 4 address input E 5 enable input (active LOW) V CC 6 supply voltage 74AHC_AHCT9_ Product data sheet Rev. 0 9 May 008 of 4
74AHC9; 74AHCT9 6. Functional description Table. Function table [] Control Input Output ne na0 na ny0 ny ny ny H X X H H H H L L L L H H H H L H L H H L H H H L H H H H H H L [] H = HIGH voltage level; L = LOW voltage level; X = don t care. 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 604). Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Max Unit V CC supply voltage 0.5 +7.0 V V I input voltage 0.5 +7.0 V I IK input clamping current V I < 0.5 V [] 0 - ma I OK output clamping current V O < 0.5 V or V O > V CC + 0.5 V [] 0 +0 ma I O output current V O = 0.5 V to (V CC + 0.5 V) 5 +5 ma I CC supply current - +75 ma I GND ground current 75 - ma T stg storage temperature 65 +50 C P tot total power dissipation T amb = 40 C to +5 C [] - 500 mw [] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. [] For SO6 packages: above 70 C the value of P tot derates linearly at 8 mw/k. For TSSOP6 packages: above 60 C the value of P tot derates linearly at 5.5 mw/k. 74AHC_AHCT9_ Product data sheet Rev. 0 9 May 008 4 of 4
74AHC9; 74AHCT9 8. Recommended operating conditions Table 5. Operating conditions Symbol Parameter Conditions Min Typ Max Unit 74AHC9 V CC supply voltage.0 5.0 5.5 V V I input voltage 0-5.5 V V O output voltage 0 - V CC V T amb ambient temperature 40 +5 +5 C t/ V input transition rise and fall rate V CC =.0 V to.6 V - - 00 ns/v V CC = 4.5 V to 5.5 V - - 0 ns/v 74AHCT9 V CC supply voltage 4.5 5.0 5.5 V V I input voltage 0-5.5 V V O output voltage 0 - V CC V T amb ambient temperature 40 +5 +5 C t/ V input transition rise and fall rate V CC = 4.5 V to 5.5 V - - 0 ns/v 9. Static characteristics Table 6. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions 5 C 40 C to +85 C 40 C to +5 C Unit 74AHC9 V IH HIGH-level input voltage V IL V OH V OL LOW-level input voltage HIGH-level output voltage LOW-level output voltage Min Typ Max Min Max Min Max V CC =.0 V.5 - -.5 -.5 - V V CC =.0 V. - -. -. - V V CC = 5.5 V.85 - -.85 -.85 - V V CC =.0 V - - 0.5-0.5-0.5 V V CC =.0 V - - 0.9-0.9-0.9 V V CC = 5.5 V - -.65 -.65 -.65 V V I =V IH or V IL I O = 50 µa; V CC =.0 V.9.0 -.9 -.9 - V I O = 50 µa; V CC =.0 V.9.0 -.9 -.9 - V I O = 50 µa; V CC = 4.5 V 4.4 4.5-4.4-4.4 - V I O = 4.0 ma; V CC =.0 V.58 - -.48 -.40 - V I O = 8.0 ma; V CC = 4.5 V.94 - -.80 -.70 - V V I =V IH or V IL I O =50µA; V CC =.0 V - 0 0. - 0. - 0. V I O =50µA; V CC =.0 V - 0 0. - 0. - 0. V I O =50µA; V CC = 4.5 V - 0 0. - 0. - 0. V I O = 4.0 ma; V CC =.0 V - - 0.6-0.44-0.55 V I O = 8.0 ma; V CC = 4.5 V - - 0.6-0.44-0.55 V 74AHC_AHCT9_ Product data sheet Rev. 0 9 May 008 5 of 4
74AHC9; 74AHCT9 Table 6. Static characteristics continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions 5 C 40 C to +85 C 40 C to +5 C Unit I I input leakage current V I = 5.5 V or GND; V CC = 0 V to 5.5 V - - 0. -.0 -.0 µa I CC supply current V I =V CC or GND; I O =0A; - - 4.0-40 - 80 µa V CC = 5.5 V C I input V I =V CC or GND - 0-0 - 0 pf capacitance C O output capacitance - 4 - - - - - pf 74AHCT9 V IH HIGH-level V CC = 4.5 V to 5.5 V.0 - -.0 -.0 - V input voltage V IL LOW-level V CC = 4.5 V to 5.5 V - - 0.8-0.8-0.8 V input voltage V OH HIGH-level output voltage V I =V IH or V IL ; V CC = 4.5 V I O = 50 µa 4.4 4.5-4.4-4.4 - V I O = 8.0 ma.94 - -.80 -.70 - V V OL LOW-level output voltage V I =V IH or V IL ; V CC = 4.5 V I O =50µA - 0 0. - 0. - 0. V I O = 8.0 ma - - 0.6-0.44-0.55 V I I input leakage current V I = 5.5 V or GND; V CC = 0 V to 5.5 V I CC supply current V I =V CC or GND; I O =0A; V CC = 5.5 V I CC C I C O additional supply current input capacitance output capacitance per input pin; V I =V CC. V; other pins at V CC or GND; I O =0A; V CC = 4.5 V to 5.5 V Min Typ Max Min Max Min Max - - 0. -.0 -.0 µa - - 4.0-40 - 80 µa - -.5 -.5 -.5 ma V I =V CC or GND - 0-0 - 0 pf - 4 - - - - - pf 74AHC_AHCT9_ Product data sheet Rev. 0 9 May 008 6 of 4
74AHC9; 74AHCT9 0. Dynamic characteristics Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 7. Symbol Parameter Conditions 5 C 40 C to +85 C 40 C to +5 C Unit 74AHC9 t pd propagation delay C PD power dissipation capacitance nan to nyn; see Figure 5 [] [] Typical values are measured at nominal supply voltage (V CC =. V and V CC = 5.0 V). [] t pd is the same as t PLH and t PHL. [] C PD is used to determine the dynamic power dissipation (P D in µw). P D =C PD V CC f i N+Σ(C L V CC f o ) where: f i = input frequency in MHz; f o = output frequency in MHz; C L = output load capacitance in pf; V CC = supply voltage in V; N = number of inputs switching; Σ(C L V CC f o ) = sum of the outputs. Min Typ [] Max Min Max Min Max V CC =.0 V to.6 V C L = 5 pf - 5.5.0.0.0.0 4.0 ns C L = 50 pf - 7.9 4.5.0 6.5.0 8.5 ns V CC = 4.5 V to 5.5 V C L = 5 pf -.9 7..0 8.5.0 9.0 ns C L = 50 pf - 5.6 9..0 0.5.0.5 ns ne tonyn; see Figure 6 [] V CC =.0 V to.6 V C L = 5 pf - 4.8 9..0.0.0.5 ns C L = 50 pf - 6.9.7.0 4.5.0 6.0 ns V CC = 4.5 V to 5.5 V C L = 5 pf -.4 6..0 7.5.0 8.0 ns C L = 50 pf - 4.9 8..0 9.5.0 0.5 ns f i = MHz; V I = GND to V CC [] - 6 - - - - - pf 74AHCT9; V CC = 4.5 V to 5.5 V t pd propagation nan to nyn; see Figure 5 [] delay C L = 5 pf - 4.7 7..0 8.5.0 9.0 ns C L = 50 pf - 6.5 9..0 0.5.0.5 ns ne tonyn; see Figure 6 [] C L = 5 pf -.6 6..0 7.5.0 8.0 ns C L = 50 pf - 5. 8..0 9.5.0 0.5 ns C PD power dissipation capacitance f i = MHz; V I = GND to V CC [] - - - - - - pf 74AHC_AHCT9_ Product data sheet Rev. 0 9 May 008 7 of 4
74AHC9; 74AHCT9. Waveforms V I nan input GND t PHL t PLH V OH nyn output V OL mna78 Fig 5. Measurement points are given in Table 8. V OL and V OH are typical voltage output levels that occur with the output load. Address input to output propagation delays V I ne input GND t PHL t PLH V OH nyn output V OL mna78 Fig 6. Measurement points are given in Table 8. V OL and V OH are typical voltage output levels that occur with the output load. Enable input to output propagation delays Table 8. Measurement points Type Input Output 74AHC9 0.5 V CC 0.5 V CC 74AHCT9.5 V 0.5 V CC 74AHC_AHCT9_ Product data sheet Rev. 0 9 May 008 8 of 4
74AHC9; 74AHCT9 V I 90 % negative pulse GND 0 % t f t W t r V I positive pulse GND 0 % t r 90 % t W t f V CC G VI DUT VO RT CL 00aah768 Fig 7. Test data is given in Table 9. Definitions test circuit: R T = termination resistance should be equal to output impedance Z o of the pulse generator. C L = load capacitance including jig and probe capacitance. Load circuitry for measuring switching times Table 9. Test data Type Input Load Test V I t r, t f C L 74AHC9 V CC.0 ns 5 pf, 50 pf t PLH, t PHL 74AHCT9.0 V.0 ns 5 pf, 50 pf t PLH, t PHL 74AHC_AHCT9_ Product data sheet Rev. 0 9 May 008 9 of 4
74AHC9; 74AHCT9. Package outline SO6: plastic small outline package; 6 leads; body width.9 mm SOT09- D E A X c y H E v M A Z 6 9 Q A A (A ) A pin index θ L p 8 L e b p w M detail X 0.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max..75 A A A b p c D () E () e H () E L L p Q v w y Z 0.5 0.0 0.069 0.00 0.004.45.5 0.057 0.049 0.5 0.0 0.49 0.6 0.09 0.04 0.5 0.9 0.000 0.0075 0.0 9.8 0.9 0.8 4.0.8 0.6 0.5 Note. Plastic or metal protrusions of 0.5 mm (0.006 inch) maximum per side are not included..7 0.05 6. 5.8 0.44 0.8.05 0.04.0 0.4 0.09 0.06 0.7 0.6 0.08 0.00 0.5 0.5 0. 0.0 0.0 0.004 θ 0.7 0. o 8 o 0.08 0 0.0 OUTLINE VERSION REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE SOT09-076E07 MS-0 99--7 0-0-9 Fig 8. Package outline SOT09- (SO6) 74AHC_AHCT9_ Product data sheet Rev. 0 9 May 008 0 of 4
74AHC9; 74AHCT9 TSSOP6: plastic thin shrink small outline package; 6 leads; body width 4.4 mm SOT40- D E A X c y H E v M A Z 6 9 pin index A A Q (A ) A θ 8 e b p w M L detail X L p 0.5 5 mm scale DIMENSIONS (mm are the original dimensions) A UNIT A A A b p c D () E () e H () E L L p Q v w y Z max. mm. 0.5 0.05 0.95 0.80 0.5 0.0 0.9 0. 0. 5. 4.9 4.5 4. 0.65 6.6 6. 0.75 0.50 0.4 0. 0. 0. 0. 0.40 0.06 θ o 8 o 0 Notes. Plastic or metal protrusions of 0.5 mm maximum per side are not included.. Plastic interlead protrusions of 0.5 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEITA SOT40- MO-5 EUROPEAN PROJECTION ISSUE DATE 99--7 0-0-8 Fig 9. Package outline SOT40- (TSSOP6) 74AHC_AHCT9_ Product data sheet Rev. 0 9 May 008 of 4
74AHC9; 74AHCT9. Abbreviations Table 0. Acronym CDM CMOS DUT ESD HBM LSTTL MM Abbreviations Description Charged Device Model Complementary Metal-Oxide Semiconductor Device Under Test ElectroStatic Discharge Human Body Model Low-power Schottky Transistor-Transistor Logic Machine Model 4. Revision history Table. Revision history Document ID Release date Data sheet status Change notice Supersedes 74AHC_AHCT9_ 0080509 Product data sheet - 74AHC_AHCT9_ Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Table 6: the conditions for input leakage current have been changed. 74AHC_AHCT9_ 999090 Product specification - - 74AHC_AHCT9_ Product data sheet Rev. 0 9 May 008 of 4
74AHC9; 74AHCT9 5. Legal information 5. Data sheet status Document status [][] Product status [] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [] Please consult the most recently issued document before initiating or completing a design. [] The term short data sheet is explained in section Definitions. [] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 5. Definitions Draft The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 5. Disclaimers General Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer s own risk. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 604) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 5.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 6. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com 74AHC_AHCT9_ Product data sheet Rev. 0 9 May 008 of 4
74AHC9; 74AHCT9 7. Contents General description...................... Features............................... Ordering information..................... 4 Functional diagram...................... 5 Pinning information...................... 5. Pinning............................... 5. Pin description......................... 6 Functional description................... 4 7 Limiting values.......................... 4 8 Recommended operating conditions........ 5 9 Static characteristics..................... 5 0 Dynamic characteristics.................. 7 Waveforms............................. 8 Package outline........................ 0 Abbreviations.......................... 4 Revision history........................ 5 Legal information....................... 5. Data sheet status...................... 5. Definitions............................ 5. Disclaimers........................... 5.4 Trademarks........................... 6 Contact information..................... 7 Contents.............................. 4 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section Legal information. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 9 May 008 Document identifier: 74AHC_AHCT9_
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