Class 1 NP 1/16/25/5/ V FEAURES Ultra stable class 1 dielectric Four standard sizes High capacitance per unit volume Supplied in tape on reel For high frequency applications Ni-barrier with % tin terminations GENERAL SPECIFICAIONS NOE: Electrical characteristics values - temperature at 2 ± 1 C, pressure at 86 to 16 Kpa and humidity at 63 to 67 % unless otherwise stated Rated Voltage U R (DC): 1 V; 16 V; 25 V; 5 V; V Capacitance Range: 1. pf to.39 µf olerance on Capacitance: C 1 pf = ± 1 %; ± 2 %; ± 5 %; ± 1 % C < 1 pf = ±.1 pf; ±.5 pf; ±.25 pf APPLICAIONS Consumer electronics elecommunications Data processing olerance on Capacitance (cont): Q 3 pf = Q Q < 3 pf = Q 4 + 2C emperature Coefficient: ± 3 ppm/ C Insulation Resistance after 12 seconds at U R (DC): 1 GΩ minimum or 5 ΩF minimum, Climatic Category (IEC 68): 55/125/56 DIMENSIONS in inches [millimeters] SIZE CODE L MAX. MB 42.4 ±.2 [1. ±.5].2 ±.2 [.5 ±.5].22 [.55].1 +.2/-.4 [.25 +.5/-.1] 63.63 ±.4 [1.6 ±.1].3 ±.3 [.8 ±.7].35 [.87].15 ±.6 [.4 ±.15] MB L MB 85 126.8 ±.6 [2. ±.15].125 ±.6 [3.2 ±.15].5 ±.4 [1.25 ±.1].63 ±.6 [1.6 ±.15].63 ±.8 [1.6 ±.2].53 [1.35].69 [1.8].2 ±.8 [.5 ±.2].25 ±.8 [.6 ±.2] ORDERING INFORMAION VJ42 A 11 J X Q C 1BC SIZE CODE DIELECRIC CAPACIANCE OLERANCE ERMINAION VOLAGE PACKAGING ECHNOLOGY 42 63 85 126 A = COG (NP) two significant digits followed by the number of zeros: 11 = 12 = 152 = 13 = B = ±.1 pf C = ±.25 pf D = ±.5 pf F = ± 1 % G = ± 2 % J = ± 5 % K = ± 1 % X = Ni Barrier Q = 1 V J = 16 V X = 25 V A = 5 V B = V C = 7 inches reel/paper P = 13 inches reel/paper = 7 inches reel/blister R = 13 inches reel/blister www.vishay.com For technical questions contact MLCC@vishay.com Document Number 2851 2 Revision 18-Sep-3
Class 1 NP 1/16/25/5/ V SELECION CHAR FOR 1/16/25/5 AND V DIELECRIC NPO EIA CAP SIZE 42 63 85 126 CODE VDC 1 V 16 V 25 V 5 V V 1 V 16 V 25 V 5 V V 1 V 16 V 25 V 5 V V 1 V 16 V 25 V 5 V V R5.5 pf N N N N S S S S S A A A A A 1R 1. N N N N S S S S S A A A A A 1R2 1.2 N N N N S S S S S A A A A A 1R5 1.5 N N N N S S S S S A A A A A B B B B B 1R8 1.8 N N N N S S S S S A A A A A B B B B B 2R2 2.2 N N N N S S S S S A A A A A B B B B B 2R7 2.7 N N N N S S S S S A A A A A B B B B B 3R3 3.3 N N N N S S S S S A A A A A B B B B B 3R9 3.9 N N N N S S S S S A A A A A B B B B B 4R7 4.7 N N N N S S S S S A A A A A B B B B B 5R6 5.6 N N N N S S S S S A A A A A B B B B B 6R8 6.8 N N N N S S S S S A A A A A B B B B B 8R2 8.2 N N N N S S S S S A A A A A B B B B B 1 pf N N N N S S S S S A A A A A B B B B B 12 12 N N N N S S S S S A A A A A B B B B B 15 N N N N S S S S S A A A A A B B B B B 18 18 N N N N S S S S S A A A A A B B B B B 22 22 N N N N S S S S S A A A A A B B B B B 27 27 N N N N S S S S S A A A A A B B B B B 33 33 N N N N S S S S S A A A A A B B B B B 39 39 N N N N S S S S S A A A A A B B B B B 47 47 N N N N S S S S S A A A A A B B B B B 56 56 N N N N S S S S S A A A A A B B B B B 68 68 N N N N S S S S S A A A A A B B B B B 82 82 N N N N S S S S S A A A A A B B B B B 11 pf N N N N S S S S S A A A A A B B B B B 121 12 N N N N S S S S S A A A A A B B B B B 151 N N N N S S S S S A A A A A B B B B B 181 18 N N N S S S S S A A A A A B B B B B 221 22 N N N S S S S S A A A A A B B B B B 271 27 N N S S S S S A A A A A B B B B B 331 33 N N S S S S S A A A A A B B B B B 391 39 N N S S S S S B B B B B B B B B B 471 47 N N S S S S S B B B B B B B B B B 561 56 S S S S S B B B B B B B B B B 681 68 S S S S B B B B B B B B B B 821 82 S S S S B B B B B B B B B B 12 pf S S S S B B B B B B B B B B 122 12 S S B B B B B B B B B B 152 S S B B B B B B B B B B 182 18 S S B B B B B B B B B B 222 22 S S B B B B B B B B B B 272 27 S S D D D D D B B B B B 332 3 S S D D D D D B B B B B 392 39 D D D D D B B B B B 472 47 D D D B B B B B 562 56 D D B B B B B 682 68 D D C C C C C 822 82 D D C C C C C 13.1 µf D D D D D D 123.12 D D D D 153.15 D D 183.18 D D 223.22 D D 273.27 D D 333.33 D D 393.39 G G 473.47 563.56 683.68 823.82 14.1 µf Document Number 2851 For technical questions contact MLCC@vishay.com www.vishay.com Revision 18-Sep-3 3
Class 1 NP 1/16/25/5/ V PACKAGING QUANIIES HICKNESS CLASSIFICAION AMOUN PER REEL 18 mm; 7 inch 42 63 85 126 A =.6 ±.1 - - Paper 4 Kp/Reel - B =.8 ±.1 - - Paper 4 Kp/Reel Paper 4 Kp/Reel C =.95 ±.1 - - - Plastic 3 Kp/Reel D = 1.25 ±.1 - - Plastic 3 Kp/Reel Plastic 3 Kp/Reel G = 1.6 ±.2 - - - Plastic 2 Kp/Reel S =.8 ±.7 - Paper 4 Kp/Reel - - N =.5 ±.5 Paper 1 Kp/Reel - - - K = 2. ±.2 - - - - M = 2.5 ±.3 - - - - PACKAGING QUANIIES HICKNESS CLASSIFICAION AMOUN PER REEL 33 mm; 13 inch 42 63 85 126 A =.6 ±.1 - - Paper 15 Kp/Reel - B =.8 ±.1 - - Paper 15 Kp/Reel Paper 15 Kp/Reel C =.95 ±.1 - - - Plastic 1 Kp/Reel D = 1.25 ±.1 - - Plastic 1 Kp/Reel Plastic 1 Kp/Reel G = 1.6 ±.2 - - - - S =.8 ±.7 - Paper 15 Kp/Reel - - N =.5 ±.5 Paper 5 Kp/Reel - - - K = 2. ±.2 - - - - M = 2.5 ±.3 - - - - COVER APE (POLYESER - ANISAIC) PROPERIES OF COVER APE PARAMEER IDH 5.5 ±.1 mm Breaking force 1.7 N Elongation at break 63 % Surface resistance < 1 1 Ω /sq. Softening point 71 ± 5 C hickness 62 µm CARRIER APE (POLYCARBONAE) PROPERIES OF CARRIER APE PARAMEER IDH 8.1 ±.2 mm hickness 19 to 28 µm ensile strength at break > 6 N /mm 2 Elongation at break to % Surface resistance > 1 12 Ω /sq. PAPER APE SPECIFICAIONS D P P 2 B A P 1 E F DIMENSIONS OF PAPER APE in millimeters PRODUC SIZE CODE SYMBOL 42 63 85 126 SIZE OL. SIZE OL. SIZE OL. SIZE OL. A.62 ±.5 1.2 ±.5 1.5 ±.1 2. ±.15 B 1.12 ±.5 1.82 ±.5 2.3 ±.1 3.5 ±.15 8. ±.1 8. ±.1 8. ±.1 8. ±.1 E 1.75 ±.1 1.75 ±.1 1.75 ±.1 1.75 ±.1 F 3.5 ±.5 3.5 ±.5 3.5 ±.5 3.5 ±.5 D 1.55 ±.5 1.55 ±.5 1.55 ±.5 1.55 ±.5 P 4. ±.1 4. ±.1 4. ±.1 4. ±.1 P 1 2. ±.5 4. ±.1 4. ±.1 4. ±.1 P 2 2. ±.5 2. ±.5 2. ±.5 2. ±.5 www.vishay.com For technical questions contact MLCC@vishay.com Document Number 2851 4 Revision 18-Sep-3
Class 1 NP 1/16/25/5/ V BLISER APE SPECIFICAIONS P D P 2 B A D 1 direction of unreeling P 1 E F DIMENSIONS OF BLISER APE in millimeters DIMENSION PRODUC 85 126 OLERANCE A < 1.55 < 2. - B < 2.45 < 3.6-8. 8. ±.2 E 1.75 1.75 ±.1 F 3.5 3.5 ±.5 D 1.5 1.5 +.1/ - D 1 1. 1. ±.1 P 4. 4. ±.5 P 1 4. 4. ±.1 P 2 2. 2. ±.5 REEL SPECIFICAIONS A D C B REEL DIMENSIONS AND APE IDH in millimeters 18 mm; 7 inch 33 mm; 13 inch A 13. ± 1. 13. ±.5 B 9. ± 1. 9. ±.5 C 178. ± 1. 33. ± 1. D 6.5 ± 1.. ± 1. MEHOD OF MOUNING AND DIMENSIONS OF SOLDER LANDS For normal use the capacitors may be mounted on printed-circuit boards or ceramic substrates by applying wave soldering and reflow soldering. An improper combination of soldering, substrate and chip size can lead to a damaging of the component. he risk increases with the chip size and with temperature fluctuations (> C) herefore, it is advised to use the smallest possible size and follow the dimensional recommendations given. Document Number 2851 For technical questions contact MLCC@vishay.com www.vishay.com Revision 18-Sep-3 5
Class 1 NP 1/16/25/5/ V SOLDERING GRAPHS IR REFLO IH SnAgCu SOLDERING IR REFLO IH SnPb SOLDER Max temperature Max temperature > 215 C: 2 ~ 4 seconds 2 Sn-Ag-Cu solder paste 2 Min temperature Min temperature Sn-Pb Eutectic solder paste 5 5 6 ~ 12 seconds 6 ~ 12 seconds 3 ~ 6 sec 6 ~ 12 seconds time 3 ~ 6 seconds 3 ~ 6 seconds 3 ~ 6 seconds time AVE SOLDERING REFLO SOLDERING 1 s 235 C to 26 C second wave 26 C 245 C 215 C 1 s 1 s 2 first wave 5 K/s 2 18 C 4 s 2 K/s 2 K/s 13 C C to 13 C forced cooling 2 K/s 5 2 K/s 5 5 2 t (s) 5 2 t (s) RECOMMENDED DIMENSIONS OF SOLDER LANDS in millimeters solder land / solder paste pattern C E B A F D G preferred direction during wave soldering solder resist pattern occupied area tracks www.vishay.com For technical questions contact MLCC@vishay.com Document Number 2851 6 Revision 18-Sep-3
Class 1 NP 1/16/25/5/ V REFLO SOLDERING SIZE FOOPRIN DIMENSIONS in mm CODE A B C D E F G 42 1.5.5.5.5.1 1.75.95 PROCESSING REMARKS PLACEMEN ACCURACY ±.15 63 2.3.7.8.8.2 2.55 1.4 ±.25 IR or hot plate soldering 85 2.8 1..9 1.3.4 3.8 1.85 ±.25 126 4. 2.2.9 1.6 1.6 4.25 2.25 ±.25 AVE SOLDERING SIZE CODE FOOPRIN DIMENSIONS in mm A B C D E F G PROPOSED NUMBER AND DIMENSIONS OF DUMMY RACKS PLACEMEN ACCURACY 63 2.4 1..7.8.2 3.1 1.9 1 x (.2 x.8) ±.1 85 3.2 1.4.9 1.3.36 4.1 2.5 1 x (.3 x 1.3) ±.15 126 4.8 2.3 1.25 1.7 1.25 5.9 3.2 3 x (.25 x 1.7) ±.25 ES CONDIIONS IN SAIC SOLDER BAH SOLDERABILIY PARAMEER 95 % covered with smooth and bright solder coating RESISANCE O LEACHING 1 % of the metallization of the edges of the head face may be missing (inner electrodes are not visible) DESCRIPION CECC requirement: 235 ± 5 C for 2 ±.5 seconds IEC requirement: 215 ± 3 C for 3 ±.3 seconds 26 ± 5 C for 3 ± 1 second ESS AND REQUIREMENS ES PROCEDURES AND REQUIREMENS ES PROCEDURE REQUIREMENS Visual and mechanical Capacitance C pf, 1. ±.2 V rms ; f = 1 MHz ± 1 % C > pf, 1. ±.2 V rms ; f = 1 khz ± 1 % dimensions in accordance with specification shall not exceed the limits given in the detailed specification Q value C pf, 1. ±.2 V rms ; f = 1 MHz ± 1 % C > pf, 1. ±.2 V rms ; f = 1 khz ± 1 % 3 pf: Q < 3 pf: Q 4 + 2C Dielectric strength Insulation resistance emperature coefficient % of rated voltage for 1 to 5 seconds, charge and discharge current less than 5 ma at U R (DC) for maximum 12 seconds with no electrical load: 55 to 125 C at amb = 25 C or flash-over during test 1 GΩ minimum or 5ΩF minimum, ± 3 ppm/ C the middle part of the substrate shall be pressurized by C/C: ± 5. maximum or ±.5 pf maximum, means of the pressurizing rod at a rate of about 1 mm Bending test per second until the deflection becomes 1 mm and then the pressure shall be maintained for 5 ± 1 second measurement after 24 ± 2 hours at room temperature this capacitance change means the change of capacitance under specified flexure of substrate from the capacitance measured before the test Solderability 23 ± 5 C for 2 ±.5 seconds; Solder: SN63A 95 % minimum coverage of entire metallized area Document Number 2851 For technical questions contact MLCC@vishay.com www.vishay.com Revision 18-Sep-3 7
Class 1 NP 1/16/25/5/ V ES PROCEDURES AND REQUIREMENS ES PROCEDURE REQUIREMENS Resistance to soldering heat emperature cycle Humidity test (damp heat steady state) Humidity load (damp heat) Adhesive strength of termination Vibration resistance High temperature load (endurance) 26 ± 5 C for 1 ± 1 second; Solder: SN63A; Preheating: 12 to C for 1 minute before immerse the capacitor in a eutectic solder. 55 to 125 C; 5 cycles in the following sequence: 55 C 3/+ for 3 ± 3 minutes; Room temperature for 2 to 3 minutes; 125 C + 3/ for 3 ± 3 minutes; Room temperature for 2 to 3 minutes 4 ± 2 C; 9 to 95 % RH for 5 + 24/ hours U R applied; 4 ± 2 C; 9 to 95 % RH for 5 + 24/ hours U R applied; Pressurizing force 5 N ( 63) and 1 N (> 63) est time 1 ± 1 second Frequency: 1 to 55 Hz/minute; otal amplitude: 1.5 mm est time: 6 hours (2 hours each in 3 mutually perpendicular directions) est temperature: 125 ± 3 C; 2 % of rated voltage for + 24/ hours; C/C: ± 2.5 % maximum or ±.25 pf maximum, DF, R ins and dielectric strength to meet initial requirements C/C: ± 2.5 % maximum or ±.25 pf maximum, DF, R ins and dielectric strength to meet initial requirements no visual damage C/C: ± 5. % maximum or ±.5 pf maximum, Q: 3 pf Q 35 1 pf C < 3 pf, Q 275 + 2.5C < 1 pf, Q 2 + 1C R ins : 1 GΩ minimum or 5 ΩF minimum, no visual damage C/C: 7.5 % maximum or ±.75 pf maximum, Q: 3 pf, Q 2 C < 3 pf, Q + 1/3C R ins : 5 MΩ minimum or 25 ΩF minimum, or removal of the terminations Capacitance change and DF: to meet initial requirements no visual damage C/C: ± 3 % maximum or.3 pf maximum, Q: 3 pf, Q 35 1 pf C < 3 pf, Q 275 + 2.5C C < 1 pf, Q 2 + 1C R ins : 1 GΩ minimum or 5 ΩF minimum, www.vishay.com For technical questions contact MLCC@vishay.com Document Number 2851 8 Revision 18-Sep-3