ELEC 3908, Physical Electronics, Lecture 19. BJT Base Resistance and Small Signal Modelling

Similar documents
ELEC 3908, Physical Electronics, Lecture 13. Diode Small Signal Modeling

ELEC 3908, Physical Electronics, Lecture 18. The Early Effect, Breakdown and Self-Heating

ELEC 3908, Physical Electronics, Lecture 17. Bipolar Transistor Injection Models

Digital Integrated CircuitDesign

Device Physics: The Bipolar Transistor

Student Number: CARLETON UNIVERSITY SELECTED FINAL EXAMINATION QUESTIONS

Final Examination EE 130 December 16, 1997 Time allotted: 180 minutes

Lecture 17 - The Bipolar Junction Transistor (I) Forward Active Regime. April 10, 2003

Bipolar junction transistor operation and modeling

figure shows a pnp transistor biased to operate in the active mode

Recitation 17: BJT-Basic Operation in FAR

UNIVERSITY OF CALIFORNIA, BERKELEY College of Engineering Department of Electrical Engineering and Computer Sciences

BJT - Mode of Operations

ELEC 3908, Physical Electronics, Lecture 26. MOSFET Small Signal Modelling

I. Frequency Response of Voltage Amplifiers

ECE-342 Test 2 Solutions, Nov 4, :00-8:00pm, Closed Book (one page of notes allowed)

Forward-Active Terminal Currents

Lecture 38 - Bipolar Junction Transistor (cont.) May 9, 2007

Institute of Solid State Physics. Technische Universität Graz. Exam. Feb 2, 10:00-11:00 P2

EE105 Fall 2015 Microelectronic Devices and Circuits: Semiconductor Fabrication and PN Junctions

Lecture 17. The Bipolar Junction Transistor (II) Regimes of Operation. Outline

EE105 - Fall 2006 Microelectronic Devices and Circuits

CLASS 3&4. BJT currents, parameters and circuit configurations

Lecture 17 The Bipolar Junction Transistor (I) Forward Active Regime

Charge-Storage Elements: Base-Charging Capacitance C b

Lecture 23: Negative Resistance Osc, Differential Osc, and VCOs

Semiconductor Physics Problems 2015

Lecture 20 - p-n Junction (cont.) October 21, Non-ideal and second-order effects

For the following statements, mark ( ) for true statement and (X) for wrong statement and correct it.

Electronic Circuits 1. Transistor Devices. Contents BJT and FET Characteristics Operations. Prof. C.K. Tse: Transistor devices

Bipolar Junction Transistor (BJT) - Introduction

Lecture 27: Introduction to Bipolar Transistors

EECS130 Integrated Circuit Devices

ELEC 3908, Physical Electronics, Lecture 23. The MOSFET Square Law Model

6.012 Electronic Devices and Circuits

Metal-oxide-semiconductor field effect transistors (2 lectures)

Spring Semester 2012 Final Exam

Chapter 13 Small-Signal Modeling and Linear Amplification

Regional Approach Methods for SiGe HBT compact modeling

Memories Bipolar Transistors

Semiconductor Device Physics

6.012 Electronic Devices and Circuits Spring 2005

Lecture 15: MOS Transistor models: Body effects, SPICE models. Context. In the last lecture, we discussed the modes of operation of a MOS FET:

CHAPTER 4: P-N P N JUNCTION Part 2. M.N.A. Halif & S.N. Sabki

Introduction to Power Semiconductor Devices

Lecture 16 - The pn Junction Diode (II) Equivalent Circuit Model. April 8, 2003

Microelectronic Devices and Circuits Lecture 13 - Linear Equivalent Circuits - Outline Announcements Exam Two -

ECE-305: Spring 2018 Final Exam Review

13. Bipolar transistors

ECE321 Electronics I

Capacitors Diodes Transistors. PC200 Lectures. Terry Sturtevant. Wilfrid Laurier University. June 4, 2009

University of Pittsburgh

Lecture 35 - Bipolar Junction Transistor (cont.) November 27, Current-voltage characteristics of ideal BJT (cont.)

Lecture 37: Frequency response. Context

Lecture 19 - p-n Junction (cont.) October 18, Ideal p-n junction out of equilibrium (cont.) 2. pn junction diode: parasitics, dynamics

Lecture 29: BJT Design (II)

55:041 Electronic Circuits The University of Iowa Fall Exam 2

ECE 497 JS Lecture - 12 Device Technologies

L03: pn Junctions, Diodes

Semiconductor Physics fall 2012 problems

Electronic Devices and Circuits Lecture 18 - Single Transistor Amplifier Stages - Outline Announcements. Notes on Single Transistor Amplifiers

EE 3329 Electronic Devices Syllabus ( Extended Play )

6.012 Electronic Devices and Circuits

Appendix 1: List of symbols

Electronic Devices and Circuits Lecture 14 - Linear Equivalent Circuits - Outline Announcements

n N D n p = n i p N A

Biasing the CE Amplifier

ELEC 3908, Physical Electronics, Lecture 27. MOSFET Scaling and Velocity Saturation

CHAPTER.4: Transistor at low frequencies

Field effect = Induction of an electronic charge due to an electric field Example: Planar capacitor

Most matter is electrically neutral; its atoms and molecules have the same number of electrons as protons.

Lecture 11: MOS Transistor

Junction Bipolar Transistor. Characteristics Models Datasheet

Session 6: Solid State Physics. Diode

Semiconductor Physics fall 2012 problems

3 Minority carrier profiles (the hyperbolic functions) Consider a

Lecture 15 - The pn Junction Diode (I) I-V Characteristics. November 1, 2005

(e V BC/V T. α F I SE = α R I SC = I S (3)

Lecture 010 ECE4430 Review I (12/29/01) Page 010-1

DC and AC modeling of minority carriers currents in ICs substrate

Lecture 16 The pn Junction Diode (III)

12. Memories / Bipolar transistors

ECE 340 Lecture 27 : Junction Capacitance Class Outline:

Sample Exam # 2 ECEN 3320 Fall 2013 Semiconductor Devices October 28, 2013 Due November 4, 2013

SOLUTIONS: ECE 606 Homework Week 10 Mark Lundstrom. Purdue University. (Revised 3/29/13)

GATE SOLVED PAPER - EC

Lecture 04 Review of MOSFET

collisions of electrons. In semiconductor, in certain temperature ranges the conductivity increases rapidly by increasing temperature

Lecture 210 Physical Aspects of ICs (12/15/01) Page 210-1

Problem 9.20 Threshold bias for an n-channel MOSFET: In the text we used a criterion that the inversion of the MOSFET channel occurs when V s = ;2 F w

Diodes. anode. cathode. cut-off. Can be approximated by a piecewise-linear-like characteristic. Lecture 9-1

Lecture 15 OUTLINE. MOSFET structure & operation (qualitative) Review of electrostatics The (N)MOS capacitor

Section 12: Intro to Devices

1st Year-Computer Communication Engineering-RUC. 4- P-N Junction

Holes (10x larger). Diode currents proportional to minority carrier densities on each side of the depletion region: J n n p0 = n i 2

Tutorial #4: Bias Point Analysis in Multisim

EE 230 Lecture 33. Nonlinear Circuits and Nonlinear Devices. Diode BJT MOSFET

Lecture 15 OUTLINE. MOSFET structure & operation (qualitative) Review of electrostatics The (N)MOS capacitor

Solar Cell Physics: recombination and generation

Lecture 12: MOS Capacitors, transistors. Context

Transcription:

ELEC 3908, Physical Electronics, Lecture 19 BJT Base Resistance and Small Signal Modelling

Lecture Outline Lecture 17 derived static (dc) injection model to predict dc currents from terminal voltages This lecture begins by considering the resistance associated with current flow through the base region base resistance Now consider small signal operation and derive equivalent circuits for low and high frequency operation Will also use the high frequency equivalent circuit to define the transit frequency, a common figure of merit for bipolar transistors Page 19-2

Physical Origin of Base Resistance So far BJT analysis has been 1D, i.e. no lateral effects considered More accurate modelling of structure requires consideration of base current flow: From contact, I B must flow through base material to edge of active region Base current flow to emitter occurs in a distributed way along path into active device Page 19-3

Extrinsic Base Resistance The extrinsic (or external) base region is that between the active area and the base contact region, assume width is s B Resistance of this region can be determined from basic equation for resistance from resistivity - if ρ Bx is the resistivity of the extrinsic base region then ρl ρbxsb rbx = = A lw E B Page 19-4

Intrinsic Base Resistance - Geometry The intrinsic (or internal) base region is the volume of the active device area enclosed by the neutral base width and the emitter width and length Modelling of this resistance is more complicated because the current flow is not 1 dimensional - base current enters the side and leaves the top (to be injected into the emitter in forward active operation) Page 19-5

Intrinsic Base Resistance - Modelling Assume linear distribution of i B The lhs voltage due to the distributed voltage drop through the region is b 1 E Veff = Rxixdx b ( ) ( ) E The resistance from the lhs edge to a point x is Bix Rx ( )= ρ Wl The linearly distributed current is 0 B E ix ( )= ib 1 x b E Page 19-6

Intrinsic Base Resistance - Modelling Substituting the expressions for R(x) and i(x) into the V eff expression gives V eff = 1 b E b E 0 ρbix Wl B E i B 1 x b E dx Performing the integral and substituting limits gives the result r bb Veff Bib = = 1 ρ i 6 Wl B The effective intrinsic base resistance is therefore 1/6 of the value obtained if i B was flowing through the region E B E Page 19-7

Example 19.1: Base Resistance Calculation Calculate the intrinsic and extrinsic base resistances for the structure and potentials shown below. Assume the internal and external base dopings are identical, and that the base separation s B is 1.5 μm. The emitter width is 1.0 μm and the length is 10.0 μm. Page 19-8

Example 19.1: Solution Since the intrinsic and extrinsic base regions are identically doped, their resistivities will be the same, given by ρ Bx 1 1 = ρbi = = 19 17 qpμ 16. 10 10 480 p The external base resistance is therefore (note that the neutral base width was calculated in an earlier example) r Bx 4 ρbxsb 013. 15. 10 = = Wl 14. 10 10 10 B E 4 4 And the intrinsic base resistance is therefore r Bi 4 1 ρ BibE 1 013. 1 10 = = 6 Wl 6 14. 10 10 10 B E 4 4 = 013. Ωcm = 139 Ω = 155. Ω Page 19-9

Low Frequency Small Signal Parameters The transconductance g m, the rate of change of collector current with base emitter voltage, is given by g m di dv C BE d dv BE qa D n WB E nb Bo To account for the back injection component of base current in forward active operation, another conductance g π, the rate of change of base current with base-emitter voltage, is used, where e qv BE kt = q kt I C g π di dv B BE d dv BE qa D W p E pe Eo E e qv BE kt q kt I q kt I IB = B = C = 123 { IC g m 1 β F g β m F Page 19-10

Low Frequency Small Signal Equivalent Circuit Now assemble the base resistance and conductance parameters into an equivalent circuit valid for small signal operation Include a controlled current source to model the dependence of collector current variation on base current variation, and an output resistance to model the Early effect Result is a low frequency hybrid-π small signal equivalent circuit Page 19-11

Example 19.2: Conductance Parameter Calculations Calculate the parameters r π and g m for the device of example 19.1. Page 19-12

Example 19.2: Solution Using the value of I C calculated from the injection model equation 1 4 3 g m = 228. 10 = 88. 10 mhos 0026. From the value of g m found above and the forward active current gain already calculated in an earlier example g π g m = = β F 88. 10 204 3 5 = 4. 3 10 mhos = 233. kω Page 19-13

Depletion Capacitance in the BJT Structure Each pn-junction in the bipolar structure has an associated depletion capacitance C depbc is the absolute depletion capacitance (F) of the base collector junction, C depbe is the absolute capacitance (F) of the base-emitter junction Recall from diode discussion (lecture 13) ˆ ˆ ε C ( 0) Si dep Cdep ( VD ) = = W V 1 V V ( ) D D bi Page 19-14

BJT Depletion Capacitance Models Write models for each junction of the form of the original pn-junction model equation C$ ( V ) depbe BE = C$ ( 0) depbe ( 1 V V ) BE bibe z BE C$ ( 0) depbe = ε W BE Si ( 0) C$ ( V ) depbc BC = C$ ( 0) depbc ( 1 V V ) BC bibc z BC C$ ( 0) depbc = ε W BC Si ( 0) The total (absolute) capacitances are then the per unit area terms multiplied by the emitter area C = C$ A C = C$ A depbc depbc E depbe depbe E Page 19-15

Physical Origin of Base Diffusion Capacitance Recall that in general, capacitance is associated with the requirement to source or sink charge when changing a terminal s potential Because the stored charge in the base must be changed if V BE is changed, a capacitance will be created between the base and emitter terminals This is termed the base diffusion capacitance Page 19-16

Base Diffusion Capacitance Model The base diffusion capacitance C π (in F, not a per unit area term) can be modeled in terms of the base transit time τ B, the time taken to cross the neutral base region C The transit time is given in terms of physical parameters for a constant doped base by = g π τ B m τ B = W 2D 2 B nb Page 19-17

High Frequency Small Signal Equivalent Circuit If the capacitances are added to the low frequency equivalent circuit, the high frequency hybrid-π equivalent circuit is obtained Note that the base-emitter capacitances appear inside the base resistances, since they are part of the basic internal transistor structure Page 19-18

Example 19.3: Capacitance Calculations Calculate the high frequency hybrid-π equivalent circuit capacitances for the device in example 19.2. Page 19-19

Example 19.3: Solution The first step in determining the depletion capacitances is to find the zero bias depletion widths. Applying the formula for W at zero bias to each junction (using previously calculated built in potentials) gives W BE 2ε Si 1 1 ( 0) = + VbiBE = 11. 10 q N N AB DE 5 cm W BC 2ε Si 1 1 ( 0) = + VbiBC = 45. 10 q N N The zero bias capacitances are therefore AB DC 5 cm C$ ( 0) depbe ε Si. $ ε Si = = 94 10 Fcm CdepBC( 0) = = 23. 10 W ( 0) W ( 0) BE 8 2 8 2 BC Fcm Page 19-20

Example 19.3: Solution (con t) The capacitances at bias are therefore (note that the grading coefficient is 1/2 for uniformly doped junctions) C$ ( 08. ) = depbe C$ ( 07. ) = depbc 94. 10 ( 1 08. 093. ) 23. 10 ( 1+ 07. 074. ) = 25. 10 = 17. 10 The absolute depletion capacitances are therefore C C depbe depbc 8 05. 8 05. ( ) ( ) 7 8 Fcm 2 Fcm = 25. 10 1 10 10 10 = 25. 10 7 4 4 14 = 17. 10 1 10 10 10 = 17. 10 8 4 4 15 2 F F Page 19-21

Example 19.3: Solution (con t) The base transit time is found from τ B W 2D ( 14. 10 ) 2 4 2 B 10 = = = nb 2349. 28. 10 sec The base diffusion capacitance is therefore found using the transit time and the previously calculated transconductance as C 10 3 12 = g = 28. 10 88. 10 = 25. 10 F π τ B m Page 19-22

Transit Frequency Measurement Configuration One widely used figure of merit in bipolar performance is the transit frequency f T, the frequency at which the current gain with the collector and emitter short circuited becomes unity Page 19-23

Transit Frequency Analysis To determine f T, the high frequency small signal hybrid-p circuit can be used The effect of the collector-emitter short circuit is to short the output conductance r o The phasor collector current will be given by (note point a is ground) ( ω ) I = g V jωc V = V g j C C m b e depbc b e b e m depbc Page 19-24

Transit Frequency Analysis (con t) The base current phasor will be given by I ( g jωc jωc ) = V + + B b e π π depbc The ratio of collector current phasor to base current phasor is therefore I I C B = gm jωcdepbc 1 g + jω C + C + C jω C C g τ π ( + + ) ( ) ( ) π depbe depbc depbe depbc m B Page 19-25

Transit Frequency Analysis (con t) The transit frequency is then defined by I I C 1 1 = 2πf C C g T (( + ) + τ ) B f = f T depbe depbc m B And hence f T is given in terms of physical parameters as f T = 2π 1 (( C C ) g ) depbc + depbe m + τb Faster transit time, reduced capacitance and increased transconductance all improve the transit frequency Page 19-26

Example 19.4: Transit Frequency Calculation Calculate the transit frequency for the device of example 19.3. Page 19-27

Example 19.4: Solution The required values have all been calculated previously, so the result is obtained by substituting the values f T = 1 ( ) ( 14 15 3 10 + + ) 2π 25. 10 17. 10 88. 10 28. 10 8 = 56. 10 Hz This example transistor therefore has a transit frequency of 0.56 GHz. A modern commercial bipolar process would offer devices with an f T of 25-35 GHz. Page 19-28

Lecture Summary Current flow in bipolar structure experiences external and internal base resistance mechanisms are very different Low frequency small signal equivalent circuit contains r bb and r bx (internal/external base resistances), g π (dependence of back injection current on V BE), g m ( transconductance) and r o the output resistance (Early effect) High frequency small signal equivalent circuit contains the same elements plus C depbc, C depbe (depletion capacitances) and C π (diffusion capacitance) The transit frequency f T incorporates many of the important high frequency parameters, and so is a useful figure of merit of high frequency performance Page 19-29