Ultralow V F Hyperfast Rectifier for Discontinuous Mode PFC, 5 FRED Pt 3 2L TO-22C 2 FETURES Hyperfast recovery time Benchmark ultralow forward voltage drop 75 C operating junction temperature Low leakage current Designed and qualified according to JEDEC -JESD 47 Material categorization: for definitions of compliance please see www.vishay.com/doc?9992 Base cathode 2 3 Cathode node PRIMRY CHRCTERISTICS I F(V) 5 V R 6 V V F at I F.85 V t rr typ. 6 ns T J max. 75 C Package 2L TO-22C Circuit configuration Single DESCRIPTION State of the art, ultralow V F, soft-switching hyperfast rectifiers optimized for Discontinuous (Critical) Mode (DCM) Power Factor Correction (PFC). The minimized conduction loss, optimized stored charge and low recovery current minimize the switching losses and reduce over dissipation in the switching element and snubbers. The device is also intended for use as a freewheeling diode in power supplies and other power switching applications. PPLICTIONS C/DC SMPS 7 W to 4 W e.g. laptop and printer C adaptors, desktop PC, TV and monitor, games units and DVD C/DC power supplies. BSOLUTE MXIMUM RTINGS PRMETER SYMBOL TEST CONDITIONS VLUES UNITS Peak repetitive reverse voltage V RRM 6 V verage rectified forward current I F(V) T C = 54 C 5 Non-repetitive peak surge current I FSM 25 Peak repetitive forward current I FM 3 Operating junction and storage temperatures T J, T Stg -65 to +75 C ELECTRICL SPECIFICTIONS ( unless otherwise specified) PRMETER SYMBOL TEST CONDITIONS MIN. TYP. MX. UNITS Breakdown voltage, blocking voltage V BR, V R I R = μ 6 - - I F = 5 -.99.5 Forward voltage V F I F = 5, T J = 5 C -.85.92 V R = V R rated -. Reverse leakage current I R T J = 5 C, V R = V R rated - 5 2 μ Junction capacitance C T V R = 6 V - 2 - pf Series inductance L S Measured lead to lead 5 mm from package body - 8. - nh V Revision: 23-Nov-7 Document Number: 9675
DYNMIC RECOVERY CHRCTERISTICS (T C = 25 C unless otherwise specified) PRMETER SYMBOL TEST CONDITIONS MIN. TYP. MX. UNITS I F =, di F /dt = /μs, V R = 3 V - 6 2 Reverse recovery time t rr I F = 5, di F /dt = /μs, V R = 3 V - 9 27-22 - ns T J = 25 C - 32 - I F = 5-9 - Peak recovery current I RRM di F /dt = 2 /μs T J = 25 C - 26 - V R = 39 V - 2.2 - Reverse recovery charge Q rr μc T J = 25 C - 4.3 - THERML MECHNICL SPECIFICTIONS PRMETER SYMBOL TEST CONDITIONS MIN. TYP. MX. UNITS Maximum junction and storage temperature range T J, T Stg -65-75 C Thermal resistance, junction-to-case R thjc -..3 Thermal resistance, junction-to-ambient per R leg thj Typical socket mount - - 7 Mounting surface, flat, smooth, Thermal resistance, case-to-heatsink R thcs -.5 - and greased Weight Mounting torque C/W - 2. - g -.7 - oz. Marking device Case style 2L TO-22C 5ETL6 6. (5.) - 2 () kgf cm (lbf in) I F - Instantaneous Forward Current () T J = 75 C T J = 5 C..4.6.8..2.4.6 2 3 4 5 6 V FM - Forward Voltage Drop (V) Fig. - Maximum Forward Voltage Drop Characteristics I R - Reverse Current (µ).. T J = 75 C T J = 5 C T J = 25 C T J = C T J = 75 C T J = 5 C V R - Reverse Voltage (V) Fig. 2 - Typical Values of Reverse Current vs. Reverse Voltage Revision: 23-Nov-7 2 Document Number: 9675
C T - Junction Capacitance (pf) 2 3 4 5 6 V R - Reverse Voltage (V) Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage Z thjc - Thermal Impedance ( C/W) D =.5 t. D =.2 D =. t 2 D =.5 Notes: D =.2 Single pulse. Duty factor D = t /t 2. D =. (thermal resistance) 2. Peak T J = P DM x Z thjc + T C...... t - Rectangular Pulse Duration (s) Fig. 4 - Maximum Thermal Impedance Z thjc Characteristics P DM. llowable Case Temperature ( C) 8 7 6 5 4 See note () DC Square wave (D =.5) Rated V R applied 3 5 5 2 25 verage Power Loss (W) 25 2 5 5 DC RMS limit D =. D =.2 D =.5 D =. D =.2 D =.5 5 5 2 25 I F(V) - verage Forward Current () Fig. 5 - Maximum llowable Case Temperature vs. verage Forward Current I F(V) - verage Forward Current () Fig. 6 - Forward Power Loss Characteristics Note () Formula used: T C = T J - (Pd + Pd REV ) x R thjc ; Pd = forward power loss = I F(V) x V FM at (I F(V) /D) (see fig. 5); Pd REV = inverse power loss = V R x I R ( - D); I R at V R = rated V R Revision: 23-Nov-7 3 Document Number: 9675
t rr (ns) 5 4 3 2 I F = 3 I F = 5 Q rr (nc) 9 8 7 6 5 4 3 I F = 3 I F = 5 V R = 39 V T J = 25 C di F /dt (/µs) Fig. 7 - Typical Reverse Recovery Time vs. di F /dt 2 V R = 39 V T J = 25 C di F /dt (/µs) Fig. 8 - Typical Stored Charge vs. di F /dt (3) t rr I F t a tb (2) I RRM (4) Q rr.5 I RRM di (rec)m /dt (5).75 I RRM () di F /dt () di F /dt - rate of change of current through zero crossing (2) I RRM - peak reverse recovery current (3) t rr - reverse recovery time measured from zero crossing point of negative going I F to point where a line passing through.75 I RRM and.5 I RRM extrapolated to zero current. (4) Q rr - area under curve defined by t rr and I RRM t rr x I Q RRM rr = 2 (5) di (rec)m /dt - peak rate of change of current during t b portion of t rr Fig. 9 - Reverse Recovery Waveform and Definitions Revision: 23-Nov-7 4 Document Number: 9675
ORDERING INFORMTION TBLE Device code VS- 5 E T L 6 -M3 2 3 4 5 6 7 - product 2 - Current rating (5 = 5 ) 3 - E = single diode 4 - T = TO-22, D 2 PK (TO-263B) 5 - L = ultralow V F hyperfast recovery 6 - Voltage rating (6 = 6 V) 7 - Environmental digit: -M3 = halogen-free, RoHS-compliant, and termination lead (Pb)-free ORDERING INFORMTION (Example) PREFERRED P/N QUNTITY PER T/R MINIMUM ORDER QUNTITY PCKGING DESCRIPTION 5 ntistatic plastic tube Dimensions Part marking information SPICE model LINKS TO RELTED DOCUMENTS www.vishay.com/doc?9656 www.vishay.com/doc?9539 www.vishay.com/doc?965 Revision: 23-Nov-7 5 Document Number: 9675
DIMENSIONS in millimeters and inches 2L TO-22C Outline Dimensions Q (6) E Ø P.4 M B M (6) H (7) B (H) (E) Thermal pad 2 D C C D L (2) (6) D c D2 (6) D 2 x b 2 x b2 Detail B 2 Detail B L C E (6) Base metal (b, b2) Plating.5 M B M 2 x e e View - c c (4) (4) b, b3 Section C - C and D - D Lead tip Conforms to JEDEC outline TO-22C SYMBOL MILLIMETERS INCHES MILLIMETERS INCHES NOTES SYMBOL MIN. MX. MIN. MX. MIN. MX. MIN. MX. NOTES 4.25 4.65.67.83 D2.68 2.88.46.57 6.4.4.45.55 E..5.398.44 3, 6 2 2.5 2.92.98.5 E 6.86 8.89.27.35 6 b.69..27.4 e 2.4 2.67.95.5 b.38.97.5.38 4 e 4.88 5.28.92.28 b2.2.73.47.68 H 6.9 6.48.24.255 6, 7 b3.4.73.45.68 4 L 3.52 4.2.532.552 c.36.6.4.24 L 3.32 3.82.3.5 2 c.36.56.4.22 4 Ø P 3.54 3.9.39.54 D 4.85 5.35.585.64 3 Q 2.6 3..2.8 D 8.38 9.2.33.355 Notes () Dimensioning and tolerancing as per SME Y4.5M-994 (2) Lead dimension and finish uncontrolled in L (3) Dimension D, D, and E do not include mold flash. Mold flash shall not exceed.27 mm (.5") per side. These dimensions are measured at the outermost extremes of the plastic body (4) Dimension b, b3, and c apply to base metal only (5) Controlling dimensions: inches (6) Thermal pad contour optional within dimensions E, H, D2, and E (7) Outline conforms to JEDEC TO-22, except D2 (minimum) Revision: 6-Dec-7 Document Number: 9656
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