Aluminum Trace Printed Circuit Board: Case Study

Similar documents
Design Guidelines for SFT Chipsets Assembly

3D Silicon Capacitors

The Vaisala AUTOSONDE AS41 OPERATIONAL EFFICIENCY AND RELIABILITY TO A TOTALLY NEW LEVEL.

Thermal Management of SMT LED Application Note

Laplace Transform in Circuit Analysis

Table of Contents. DS163 LUXEON V Product Datasheet Lumileds Holding B.V. All rights reserved.

WTSC144.xxx Wire Bonding Temperature Silicon Vertical Capacitor

SignalSure 150. Mid power solution AUTOMOTIVE. SignalSure 150 is a compact, surface-mount, mid power LED signaling

TECHNICAL INFORMATION

Effects of Stresses in Highly Accelerated Limit Test (HALT)

Production of 2G HTS Conductor at SuperPower: Recent Progress and Ongoing Improvements

The purpose of this report is to recommend a Geographic Information System (GIS) Strategy for the Town of Richmond Hill.

EV Group. Enabling processes for 3D interposer. Dr. Thorsten Matthias EV Group

Next Generation of Nano-Enhanced Composites and 3D Printable Materials. Dr. Elena Polyakova, CEO OTCQB: GPHBF TSX-V:GGG OTCQB: GPHBF

Alluvium Consulting Australia Senior integrated water management specialist Position Description March 2018

The Increasing Importance of the Thermal Management for Modern Electronic Packages B. Psota 1, I. Szendiuch 1

Full-Bridge Strain Gauges for Force Transducers

The Canadian Ceoscience Knowledge Network. - A Collaborative Effort for Unified Access to Ceoscience Data

Vaisala AviMet Automated Weather Observing System

SPECIFICATION FOR APPROVAL INDEX

Large Scale Mapping Policy for the Province of Nova Scotia

7 GEOMATICS BUSINESS SOLUTIONS - ANNUAL REPORT 2006

HSG-IMIT Application AG

HONOURTEK Delux Array Series HRA0303 Preliminary

1. CONSTRUCTION Pink surface mount LEDs with reflector packaged featuring InGaN on SiC and phosphor technology.

PLW7070* Series and PLW3535* Series I2LED High Power LED Product Application Note

LUXEON UV U1. Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology ILLUMINATION

Technical Notes. Introduction. PCB (printed circuit board) Design. Issue 1 January 2010

Sample Header for slide

HONOURTEK Delux Array Series HRA0407 Preliminary

ATC 700 B Series NPO Porcelain and Ceramic Multilayer Capacitors

31 Dec '01 07 Jan '02 14 Jan '02 21 Jan '02 28 Jan '02 M T W T F S S M T W T F S S M T W T F S S M T W T F S S M T W T F S S

KL12LM Corded Cap Lamp

Effective Thermal Management of Crystal IS LEDs. Biofouling Control Using UVC LEDs

NR ROTARY RING TABLE: FLEXIBLE IN EVERY RESPECT

Thermal Management of Golden DRAGON LED Application Note

Application Note Thermal Design for the AWB, AWM and AWT series of Power Amplifier Modules Rev 0

Enabling Success in Enterprise Asset Management: Case Study for Developing and Integrating GIS with CMMS for a Large WWTP

Globe Calendar Corporation

New SPOT Program. Customer Tutorial. Tim Barry Fire Weather Program Leader National Weather Service Tallahassee

MLCC with FLEXITERM. General Specifications GENERAL DESCRIPTION APPLICATIONS PRODUCT ADVANTAGES HOW TO ORDER

L u m b e r M e l a m i n e H a r d w o o d P l y w o o d A r c h i t e c t u r a l P a n e l s C o l o r e d C a u l k P a r t i c l e B o a r d E

University of Connecticut Department of Electrical and Computer Engineering. ECE 4901: Fall 2017 Spring 2018

Understanding Thermal Characteristic of SOT-223 Package

LUXEON Rebel. Direct Color Portfolio

1W, 1206, Low Resistance Chip Resistor (Lead free / Halogen Free)

Thermal Characterization of Packaged RFIC, Modeled vs. Measured Junction to Ambient Thermal Resistance

ISM Evolution. Elscolab. Nederland BV

WW12C, WW08C, WW06C, WW04C, WW02C. Low ohm chip resistors ( power ) Size 1206, 0805, 0603, 0402, 0201

IBU VENUE DRESSING GUIDE IBU VENUE DRESSING GUIDE OPEN EUROPEAN CHAMPIONSHIPS. (IBU Brand Identification for Biathlon Venues)

AN829. PolarPAK Thermal Impedance (Rth) vs. Heat Sink Assembly Clamping Torque. Vishay Siliconix. By Kandarp Pandya

A Guide to Board Layout for Best Thermal Resistance for Exposed Packages

SnapLED 150. Reliability and robustness AUTOMOTIVE. SnapLED 150 cold clinching technology provides automotive exterior

The Green. Chemistry Checklist Why Green Chemistry? The Business Case. Inside. Support and Communication. Design and Innovation

HARTING D-Sub Selection Guide

TOP MARKET SURVEY INSTRUCTION SHEET. Requirements. Overview

Reaxys Improved synthetic planning with Reaxys

MLCC with FLEXITERM. General Specifications GENERAL DESCRIPTION APPLICATIONS PRODUCT ADVANTAGES HOW TO ORDER C 104 K A Z 2 A

Failure Rate 4 = Automotive

DISCRETE SEMICONDUCTORS DATA SHEET. BLT92/SL UHF power transistor

DATA SHEET. BYG70 series Fast soft-recovery controlled avalanche rectifiers DISCRETE SEMICONDUCTORS Jun 05

Superconductivity for Electric Systems 2006 Annual DOE Peer Review

Accelerated Life Test Principles and Applications in Power Solutions

Global Geoparks focus on developing their regions as Sustainable Tourism Destinations.

NO LONGER ORDERABLE LUXEON S. Best punch and easy integration. For NEW designs consider these replacement products: ILLUMINATION

EVERLIGHT ELECTRONICS CO.,LTD. Technical Data Sheet High Power LED 1W (Preliminary)

Failure Rate 4 = Automotive

2G HTS Wire for Demanding Applications and Continuous Improvement Plans

LPSC424.xxx Low Profile Silicon Capacitor

Double-Sided Chip Resistors

DISCRETE SEMICONDUCTORS DATA SHEET. BLF543 UHF power MOS transistor

tablet casegoods timeless design refined materials sustainable options

Job Description. 1) To provide a range of meteorological services, including a forecaster consultancy service.

tablet casegoods timeless design refined materials sustainable options

ArcGIS Pro Q&A Session. NWGIS Conference, October 11, 2017 With John Sharrard, Esri GIS Solutions Engineer

GIS Visualization: A Library s Pursuit Towards Creative and Innovative Research

Alternative Approaches to Teaching Extended Surface Heat Transfer

Multi Beam Sputtering

American Zettler AZ742 RELAY Datasheet

BIOCHEMISTRY - THE MOLECULAR BASIS OF CELL STRUCTURE AND FUNCTION BY ALBERT L. LEHNINGER

Development and Field Deployment of a Novel AUV Gravimeter

Effect of Direction of Ultrasonic Vibration on Flip-Chip Bonding

Balancing with an Offset Mass Center

SAPLING TIME ZONE CLOCKS. here, there, everywhere

Geographic Information System Services. Strategic Plan FY

Multilayer Ferrite Chip Beads


Lediko INLENE luminaire INLENE. Industrial LED luminaire

Tools for Thermal Analysis: Thermal Test Chips Thomas Tarter Package Science Services LLC

Near 1000 ТЕС models with wide range oftemperature differences and cooling power are availaыe

MODELS TO ESTIMATE PRINTED CIRCUIT BOARD FABRICATION YIELD DURING THE DESIGN STAGE

Solder Joints Quality Assessment as Function of VPS Process Parameters

2018 AWS Global Summit Sponsorship Overview

Measurement and control of grinding circuit performance by real-time particle size measurement on individual cyclones

Reaxys Medicinal Chemistry Fact Sheet

Paper and Cellulosic Materials as Flexible Substrates for 2D Electronic Materials

Baltimore Aircoil Company w w w. B a l t i m o r e A i r c o i l. c o m

ANYTIME PDUs: COMBO PACK 4 (62 PDUs) No Longer Available PLAN SUMMARY TAKE COURSES ONLINE 24/7** Purchase Option

Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards

CHAPTER 6 THERMAL DESIGN CONSIDERATIONS. page. Introduction 6-2. Thermal resistance 6-2. Junction temperature 6-2. Factors affecting R th(j-a) 6-2

Transcription:

Aluminum Trace Printed Circuit Board: Case Study The research team at D-Wave Systems needed a PCB that could operate in cryogenic environments at 500 mk above absolute zero while retaining superconductivity. Omni Circuit Boards provided the solution. Please feel free to share, as long as you provide credit and link to Omni Circuit Boards at www.omnicircuitboards.com PLEASE SHARE (Always Attribute)

Summary D-Wave Systems, a British Columbia-based leader in the field of quantum computing, approached Omni Printed Circuit Boards for a collaborative project. The research team at D-Wave Systems needed a PCB that could operate in cryogenic environments between absolute zero and 500 millikelvin while retaining superconductivity. Through a process of ongoing testing, refinement, and design modifications, Omni produced the world's first aluminium / copper bimetal trace, etched PCB, opening the door for future applications combining cryogenics, superconducting PCB traces and chip interconnection using superconducting wirebonds especially for high-tech research and development departments around the globe. Aluminium Trace PCB Information courtesy of Omni Circuit Boards. Please feel free to share, as long as you provide credit and link to Omni Circuit Boards at www.omnicircuitboards.com or www.omnigraph.com. PLEASE SHARE (Always Attribute) 2

The Challenge D-Wave Systems, a British Columbia-based technology firm, is an industry leader in the development of quantum computing hardware and applications. Their systems, which consist of engineered artificial atoms, uniquely use quantum mechanics to revolutionize the way information is processed to enable organizations to solve their most complex computational problems. However, in order to utilize quantum processing, researchers required a dependable printed circuit board that could operate in cryogenic environments of 500 millikelvin above absolute zero while retaining electrical superconductivity and thermal conductivity qualities and allowing for elements to be aluminium wedge bonded directly to the PCB. A survey of PCB designers and manufacturers around the world yielded no viable solution. D-Wave System's research team determined that milling boards internally would not be an option, and set out to search for a PCB firm that would be willing to experiment with different ideas, materials, and processes. The research team at D-Wave Systems reached out to Omni Printed Circuit Boards, another British Columbia firm specializing in the development of custom PCB platforms. Through a collaborative design, development, and testing process, the two teams were able to agree on parameters for a prototype and begin manufacturing. By focusing on the client's needs, and ongoing feedback from live tests, Omni Circuit Boards was able to determine aluminium trace etching offered superconductivity, reliability, and a far superior aluminum-to-aluminum bond than prior technologies (including gold or silver-to-aluminum). The resulting PCBs were further tested and refined to ensure that wire bonding would be reliable, and the boards would be able to stand up to repeated cryogenic cycling. 3

The Result Aluminium Material Thickness The resulting aluminium trace PCB is a custom product that perfectly fits the requirements and capabilities laid out by D-Wave Systems in their initial consultations. The monometal wirebond interface is at least 10 times stronger/more reliable than our current technology minimizing the amount of time needed for re-installation and maintenance. Additionally, they excel at superconductivity in low-temperature quantum computing environments. Just as importantly, the solderable aluminium trace PCBs developed by Omni allow for aluminium-to-aluminium wire bonding, and have design parameters specifically configured for the D-Wave Systems chipset. The finished product serves as a testament to Omni's innovative approach to PCB production. Our mix of cutting-edge products and technology, a committed research and engineering staff, and a desire to find unorthodox solutions to advanced technology challenges, makes us the ideal partner for research projects. We are not afraid to find new answers or re-envision the PCB manufacturing process, which allows us to create products that other firms cannot duplicate. 30 µm aluminum 254 µm dielectric substrate 5 µm copper typical human hair thickness 100 µm 4

Future Applications An initial assessment of the aluminium trace PCB product shows new opportunities for applications and cryogenics, quantum computing, and other leading-edge processing projects that call for unpackaged chips to be mounted to custom PCB layouts. Omni anticipates that this technology will be particularly intriguing to universities, physicists, and technology research departments. Because the Omni Printed Circuit Board philosophy is to bend the spectrum of PCB design possibilities to meet new testing and manufacturing challenges for our clients, the best uses may remain uncovered at the present moment. By working closely with the organizations that need new answers especially in cryogenic and superconductive environments we look forward to finding new applications. 5

How to Get More Information Organizations interested in exploring aluminium trace PCBs and other custom circuit board products and solutions are encouraged to contact Omni directly through our convenient online "quote request" generator, which can be found at: http://www.omnicircuitboards.com/art/. For the most accurate and complete quote possible, please include your first and last name, relevant contact information, and any available Gerber or NC files for our design team to examine. In addition, please provide details regarding the quantity and delivery schedule associated with your request. Or, to find out more about the technical specifications and applications of our aluminium-on-aluminium PCB, contact a member of the Omni team directly at 1-855-798-9717. 6

About Omni Printed Circuit Boards Omni Printed Circuit boards is a PCB design and manufacturing firm located in Richmond, British Columbia. Our mission is to develop custom, innovative, and cutting-edge products for our clients, delivering solutions that can not be found anywhere else in the market. We treat every project as a collaborative process, working closely with designers, engineers, and researchers to produce results within even the most challenging performance environments. You can learn more about us, our team, and our PCB design and manufacturing process at Omni Circuit Boards (omnicircuitboards.com). PLEASE SHARE (Always Attribute) 7