APQ02SN60AA-XXJ0 APQ02SN60AB DEVICE SPECIFICATION. 600V/2A N-Channel MOSFET

Similar documents
500V N-Channel MOSFET

TSP10N60M / TSF10N60M

GP1M003A080H/ GP1M003A080F GP1M003A080HH/ GP1M003A080FH

Features. Symbol Parameter Rating Units V DS Drain-Source Voltage 600 V V GS Gate-Source Voltage ±30 V

N- & P-Channel Enhancement Mode Field Effect Transistor

Features. Symbol Parameter Rating Units V DS Drain-Source Voltage 30 V V GS Gate-Source Voltage ±20 V

SSF7NS65UF 650V N-Channel MOSFET

Elerical Characteristics T C = 5 C unless otherwise noted Symbol Parameter Test Conditions Min Typ Max Units Off Characteristics BS Drain-Source Break

SSF65R580F. Main Product Characteristics 700V. V J max. 0.52Ω (typ.) I D 8.0A TO-220F. Features and Benefits. Description

AOT404 N-Channel Enhancement Mode Field Effect Transistor

400V N-Channel MOSFET GENERAL DESCRIPTION VDSS RDS(ON) ID. Features. Ordering Information 400V 0.55Ω 10.5A. This Power MOSFET is produced using

P-Channel Enhancement Mode Field Effect Transistor PARAMETERS/TEST CONDITIONS SYMBOL LIMITS UNITS

AO7401 P-Channel Enhancement Mode Field Effect Transistor

AO4620 Complementary Enhancement Mode Field Effect Transistor

Product Summary: BVDSS 30V RDSON (MAX.) 50mΩ 4.5A I D. Pb Free Lead Plating & Halogen Free EMB50P03J

N-Channel 30-V (D-S) MOSFET With Sense Terminal

IXFH42N60P3. Polar3 TM HiperFET TM Power MOSFET. = 600V = 42A 185m. Preliminary Technical Information. R DS(on)

Description. Symbol Parameter Ratings Units V DSS Drain to Source Voltage 250 V V GSS Gate to Source Voltage ±30 V

AO3411 P-Channel Enhancement Mode Field Effect Transistor

IXTH80N65X2 V DSS. X2-Class Power MOSFET = 650V I D25. = 80A 38m. R DS(on) N-Channel Enhancement Mode Avalanche Rated TO-247 G D S

IXFR18N90P V DSS. Polar TM HiPerFET TM Power MOSFET = 900V I D25 = 10.5A. R DS(on) 300ns. t rr

AON4605 Complementary Enhancement Mode Field Effect Transistor

STD5N20L N-CHANNEL 200V Ω - 5A DPAK STripFET MOSFET

SSF8NP60U. Main Product Characteristics: 600V V DSS. 0.73Ω (typ.) Features and Benefits: Description: Absolute max Rating:

AO V Dual P + N-Channel MOSFET

IXFH400N075T2 IXFT400N075T2

AO4802 Dual N-Channel Enhancement Mode Field Effect Transistor

IXTH3N150 V DSS. High Voltage Power MOSFET = 1500V I D25 = 3A 7.3. R DS(on) N-Channel Enhancement Mode. Avalanche Rated. Fast Intrinsic Diode TO-247

Maximum Ratings Parameter Symbol Value Unit Continuous drain current T C = 25 C T C = 100 C

BSS84 P-Channel Enhancement Mode Field-Effect Transistor

SIPMOS Small-Signal Transistor BSP 149

CoolMOS Power Transistor

AOP606 Complementary Enhancement Mode Field Effect Transistor

IXFL32N120P. Polar TM HiPerFET TM Power MOSFET V DSS I D25 = 1200V = 24A. 300ns. Preliminary Technical Information. R DS(on) t rr

Max Q1. Symbol V GS I DM 15 I DSM 7.8 I AS E AS V SPIKE P D 2.5 P DSM. Junction and Storage Temperature Range T J, T STG

Product Summary: BVDSS RDSON (MAX.) D 60V 60mΩ 12A I D. UIS, Rg 100% Tested Pb Free Lead Plating & Halogen Free EMB60N06C

CoolMOS Power Transistor

Features. T A =25 o C unless otherwise noted

Maximum Ratings Parameter Symbol Value Unit Continuous drain current T C = 25 C T C = 100 C

AO4607, AO4607L(Lead-Free) Complementary Enhancement Mode Field Effect Transistor

PSMN006-20K. N-channel TrenchMOS SiliconMAX ultra low level FET

CoolMOS Power Transistor

CoolMOS TM Power Transistor

OptiMOS &!Power-Transistor

TrenchMV TM Power MOSFET

AOV11S60. V T j,max 700V 45A. The AOV11S60 has been fabricated using the advanced αmos TM high voltage process that is designed to deliver

TrenchMV TM Power MOSFET

CoolMOS TM Power Transistor

Complementary (N- and P-Channel) MOSFET

IXFK120N30T IXFX120N30T

CoolMOS Power Transistor

CoolMOS Power Transistor

SIPMOS Power-Transistor

Maximum Ratings Parameter Symbol Value Unit Continuous drain current T C = 25 C T C = 100 C

IRFR Description. 2. Features. 3. Applications. 4. Pinning information. N-channel enhancement mode field effect transistor

CoolMOS TM Power Transistor

CoolMOS TM Power Transistor

IXTA24N65X2 IXTP24N65X2 IXTH24N65X2

BUK9Y53-100B. N-channel TrenchMOS logic level FET. Table 1. Pinning Pin Description Simplified outline Symbol 1, 2, 3 source (S) 4 gate (G)

IXFN140N30P. Polar TM Power MOSFET HiPerFET TM = 300V = 110A V DSS I D ns. t rr. N-Channel Enhancement Mode Avalanche Rated Fast Intrinsic Diode

Product Summary. Drain source voltage V DS 200 V Drain-Source on-state resistance R DS(on) 0.4 Ω Continuous drain current I D 7 A I D.

BUK B. N-channel TrenchMOS standard level FET

N-channel TrenchMOS logic level FET

OptiMOS 3 Power-Transistor

N-channel TrenchMOS standard level FET. Higher operating power due to low thermal resistance Low conduction losses due to low on-state resistance

OptiMOS 3 M-Series Power-MOSFET

OptiMOS 2 Power-Transistor

PHT6N06T. 1. Product profile. 2. Pinning information. TrenchMOS standard level FET. 1.1 Description. 1.2 Features. 1.

AOD4184A 40V N-Channel MOSFET

A I DM. W/ C V GS Gate-to-Source Voltage ± 20. Thermal Resistance Symbol Parameter Typ. Max. Units

TrenchMV TM Power MOSFET

MDS9651 Complementary N-P Channel Trench MOSFET

AUTOMOTIVE GRADE. A I DM Pulsed Drain Current P A = 25 C Maximum Power Dissipation 2.0 P A = 70 C Maximum Power Dissipation 1.

CoolMOS Power Transistor

IRLML2030TRPbF HEXFET Power MOSFET

IRF5851. HEXFET Power MOSFET. Ultra Low On-Resistance Dual N and P Channel MOSFET Surface Mount Available in Tape & Reel Low Gate Charge.

OptiMOS -P Small-Signal-Transistor

SIPMOS Small-Signal-Transistor

A I DM W/ C V GS. Thermal Resistance Symbol Parameter Typ. Max. Units

P-Channel Enhancement Mode Mosfet

SPN03N60C3. Cool MOS Power Transistor V T jmax 650 V

AOD466 N-Channel Enhancement Mode Field Effect Transistor

PSMN4R5-40PS. N-channel 40 V 4.6 mω standard level MOSFET. High efficiency due to low switching and conduction losses

IXFA7N100P IXFP7N100P IXFH7N100P

PSMN4R3-30PL. N-channel 30 V 4.3 mω logic level MOSFET. High efficiency due to low switching and conduction losses

OptiMOS 2 Small-Signal-Transistor

CoolMOS TM Power Transistor

OptiMOS 3 Power-Transistor

SPN01N60C3. Cool MOS Power Transistor V T jmax 650 V

A I DM. W/ C V GS Gate-to-Source Voltage ± 16. Thermal Resistance Symbol Parameter Typ. Max. Units

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

Type V DS I D R DS(on) Package Ordering Code BTS V 10 A 0.2 Ω TO-220AB C67078-A5008-A2

OptiMOS 3 M-Series Power-MOSFET

N-channel TrenchMOS standard level FET. Higher operating power due to low thermal resistance Low conduction losses due to low on-state resistance

Maximum Ratings Parameter Symbol Value Unit Continuous drain current T C = 25 C T C = 100 C

PSMN2R6-40YS. N-channel LFPAK 40 V 2.8 mω standard level MOSFET

OptiMOS TM 3 Power-Transistor

SPB03N60S5. Cool MOS Power Transistor V DS 600 V

PHB108NQ03LT. N-channel TrenchMOS logic level FET

OptiMOS Power-Transistor

Transcription:

1 Description These N-Channel enhancement mode power field effect transistors are produced using planar stripe, DMOS technology. This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation mode. These devices are well suited for high efficiency switched mode power supplies, active power factor correction based on half bridge topology. 2 Features 600V / 2A R DS(on) =3.8Ω(typ),V GS =10V, I D =1.2A Fast switching 100% avalanche tested Improved dv/dt capability.. 3 Absolute Maximum Ratings T C = 25 C unless otherwise noted -XXM0 -XXM0 Symbol Parameter -XXJ0 -XXM1 -- -XXJ1 Units TO-251 TO-252 V DSS Drain-Source Voltage 600 V I D Drain Current - Continuous (T C = 25 C) 2 A - Continuous (T C = 100 C) 1.35 A I DM Drain Current Pulsed 1 8.0 A V GS Gate-Source Voltage ± 30 V E AS Single Pulsed Avalanche Energy 2 13.3 mj I AR Avalanche Current 2.0 A E AR Repetitive Avalanche Energy 4.2 mj dv/dt Peak Diode Recovery dv/dt 3 3.0 V/ns P D Power Dissipation (T C = 25 C) 42 W -De-rate above 25 C 0.33 W/ C T J, T STG Operating and Storage Temperature Range -55 to +150 C T L Maximum lead temperature for soldering purposes, 1/8"from case for 5 seconds 300 C * note : 1 Repetitive Rating: Pulse width limited by maximum junction temperature. 2 V DD =50V, starting T J =25, L=TBD, R G =25Ω, I AS =2A 3 I SD 2A, di/dt 40A/μs, V DD V (BR)DSS, T J 150. Rev:D 1/11

4 Thermal Characteristics -XXM0 -XXM0 Symbol Parameter -XXJ0 -XXM1 -- -XXJ1 Units TO-251 TO-252 R θjc Thermal Resistance, Junction-to-Case 3.0 C/W R θcs Thermal Resistance, Case-to-Sink Typ. 50 C/W R θja Thermal Resistance, Junction-to-Ambient 110 C/W 5 Electrical Characteristics T C = 25 C unless otherwise noted Symbol Parameter Test Conditions Min Typ Max Units Off Characteristics BV DSS Drain-Source Breakdown Voltage ΔBV DSS / Breakdown Voltage ΔT J Temperature Coefficient I DSS Gate to Source leakage current I GSSF Gate-Body Leakage Current, Forward I GSSR Gate-Body Leakage Current, Reverse V GS = 0 V, I D = 250 μa 600 -- -- V I D = 250 μa, Referenced to 25 C -- 0.6 -- V/ C V DS = 600 V, V GS = 0 V -- -- 20 μa V GS = 30 V, V DS = 0 V -- -- 100 na V GS = -30 V, V DS = 0 V -- -- -100 na On Characteristics V GS(th) Gate Threshold Voltage V DS = V GS, I D = 250 μa 2.0 -- 4.0 V R DS(on) Static Drain-Source On- V Resistance GS = 10 V, I D = 1.2 A 4 -- 3.8 4.4 Ω g FS Forward Transconductance V DS = 15 V, I D = 1 A 1 -- -- 10 S Dynamic Characteristics C iss Input Capacitance V DS = 25 V, V GS = 0 V, -- 348 -- pf C oss Output Capacitance f = 1.0 MHz -- 45 -- pf C rss Reverse Transfer Capacitance -- 8.3 -- pf Switching Characteristics t d(on) Turn-On Delay Time V DD = 300 V, I D = 2A, -- 8.0 -- ns t r Turn-On Rise Time R G = 10 Ω, R D =150Ω, -- 5.6 -- ns t d(off) Turn-Off Delay Time V GS =10V 4 -- 33.8 -- ns t f Turn-Off Fall Time -- 12.5 -- ns Q g Total Gate Charge V DS = 480 V, I D = 2A, -- 8.5 -- nc Q gs Gate-Source Charge V GS = 10 V 4 -- 1.8 -- nc Gate-Drain Charge -- 3.9 -- nc Q gd Drain-Source Diode Characteristics and Maximum Ratings I S Maximum Continuous Drain-Source Diode Forward Current -- -- 2 A I SM Maximum Pulsed Drain-Source Diode Forward Current -- -- 8 A Rev:D 2/11

V SD Drain-Source Diode Forward Voltage V GS = 0 V, I S = 2A -- -- 1.5 V t rr Reverse Recovery Time V GS = 0 V, I F = 2 A, -- 365 -- ns Reverse Recovery Charge di F / dt = 100 A/μs 4 -- 10.2 -- μc Q rr Notes: 1 Repetitive Rating: Pulse width limited by maximum junction temperature. 2 V DD =50V, starting T J =25, L=TBD, R G =25Ω, I AS =2A 3 I SD 2A, di/dt 100A/μs, V DD V (BR)DSS, T J 150 4 Pulse Test: Pulse width 300μs, Duty cycle 2%. Rev:D 3/11

Rev:D 4/11

Rev:D 5/11

6 Package Dimensions -XXM0 TO-251 TO-251 DIMENSION DIM MILLIMETERS MIN MAX TYP. DIM MIN MAX TYP A 6.35 6.73 6.54 H 0.64 0.89 0.77 A1 4.95 5.46 5.21 I 2.18 2.39 2.29 B 0.89 1.27 1.08 J 0.46 0.89 0.66 C 5.97 6.22 6.10 K 0.89 1.14 1.02 D 1.14 1.52 1.33 L 0.46 0.61 0.54 E 1.91 2.29 2.10 M 4.32 -- -- F 8.89 9.65 9.27 N 5.21 - - G 0.84 1.14 0.99 O 2.29 BSC Rev:D 6/11

-XXJ0 TO-251 TO-251 DIMENSION DIM MILLIMETERS MIN MAX TYP. DIM MIN MAX TYP A 6.350 6.650 6.50 H 0.500 0.700 0.600 A1 5.200 5.400 5.300 I 2.200 2.400 2.300 B 1.350 1.650 1.500 J 0.430 0.580 0.505 C 5.400 5.700 5.550 K 1.050 1.350 1.2 E 1.91 2.29 2.100 L 0.430 0.580 0.505 F 7.500 7.900 7.700 N 3.800 REF. G 0.700 0.900 0.800 O 2.300 Typ. Rev:D 7/11

-XXM0 TO-252 TO-252DIMENSION DIM MILLIMETERS MIN MAX TYP. DIM MIN MAX TYP. A 6.35 6.73 6.54 J 0.46 0.61 0.535 A1 5.21 5.46 5.335 K 2.550 2.900 2.725 B 0.89 1.27 1.08 L 0.46 0.61 0.535 C 5.97 6.22 6.095 M 4.83 -- E 0.64 1.01 0.825 N 5.21 -- F 9.65 10.14 9.895 O 2.29 BSC G 0.84 1.14 0.99 P 0.51 BSC H 0.64 0.89 0.765 Q 0 0.130 0.065 I 2.19 2.38 2.285 R 1.40 1.780 1.590 Rev:D 8/11

-XXM1 TO-252 TO-252DIMENSION DIM MILLIMETERS MIN MAX TYP. DIM MIN MAX TYP. A 6.35 6.73 6.54 I 2.19 2.39 2.29 A1 5.22 5.48 5.35 J 0.46 0.62 0.54 B 0.89 1.27 1.08 L 0.46 0.62 0.54 C 6.06 6.44 6.25 M 4.83 MIN. E 0.64 1.02 0.83 N 5.21 MIN. F 9.65 10.41 10.03 O 2.29 TYP.. 2.29 G 0.84 1.14 0.99 Q 0 0.14 0.07 H 0.64 0.90 0.77 Rev:D 9/11

-XXJ1 TO-252 TO-252DIMENSION DIM MILLIMETERS MIN MAX TYP. DIM MIN MAX TYP A 6.50 6.70 6.60 J 0.46 0.56 0.51 A1 5.12 5.46 5.29 K 2.9 REF B 0.89 1.27 1.08 L 0.56 0.46 0.51 C 6.00 6.20 6.10 M 4.83 REF E 0.6 1.0 0.80 N 5.35 REF F 9.80 10.4 10.00 O 2.19 2.39 2.29 H 0.71 0.81 0.76 Q 0 0.10 0.05 I 2.20 2.38 2.29 R 1.40 1.70 1.55 Rev:D 10/11

Note The declared data are only a description of product, information furnished is believed to be accurate and reliable. However, alpha pacific assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of alpha pacific. alpha pacific reserves the right to make changes on this specification without notice at any time. This publication supersedes and replaces all information previously supplied. All alpha pacific products are not authorized for use as critical components in life support devices or systems, except by a written approval of alpha pacific. Reprinting this data sheet - or parts of it - is only allowed with a license of alpha pacific. contact Alpha Pacific Technologies Co., Ltd 3F-6, No.18, Lane 609, Sec.5 Chung Sin road, Shan Chang Dristrict, New Taipei City, TAIWAN, R.O.C tel +886-2-2999 5456 fax +886-2-2999 5270 internet www.apttw.com Rev:D 11/11