www.osram-os.com Produktdatenblatt Version 1.1 DIL SMT Silicon PIN Photodiode with Daylight Blocking Filter Applications Electronic Equipment Industrial Automation (Machine controls, Light barriers, Vision controls) Measurement Levelling Features: Package: black epoxy Qualifications: The product qualification test plan is based on the guidelines of AEC-Q11-REV-C, Stress Test Qualification for Automotive Grade Discrete Semiconductors. ESD: 2 kv acc. to ANSI/ESDA/JEDEC JS-1 (HBM, Class 2) Especially suitable for applications of 95 nm Short switching time (typ. 2 ns) DIL plastic package with high packing density Ordering Information Type Photocurrent Photocurrent Ordering Code typ. E e = 1 mw/cm²; λ = 95 nm; V R = 5 V E e = 1 mw/cm²; λ = 95 nm; V R = 5 V I P I P -Z 25 µa 34 µa Q6511A2627 1 Version 1.4 218-5-4
Maximum Ratings T A = 25 C Parameter Symbol Values Operating Temperature T op min. max. Storage temperature T stg min. max. -4 C 1 C -4 C 1 C Reverse voltage V R max. 2 V Total power dissipation P tot max. 15 mw ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-1 (HBM, Class 2) V ESD 2 kv 2 Version 1.4 218-5-4
Characteristics T A = 25 C Parameter Symbol Values Wavelength of max sensitivity λ S max typ. 95 nm Spectral range of sensitivity λ 1% typ. 8... 11 nm Radiant sensitive area A typ. 4.84 mm² Dimensions of active chip area L x W typ. 2.2 x 2.2 mm x mm Half angle φ typ. 6 Dark current V R = 1 V Spectral sensitivity of the chip λ = 95 nm Quantum yield of the chip λ = 95 nm Open-circuit voltage E e =.5 mw/cm²; λ = 95 nm Short-circuit current E e =.5 mw/cm²; λ = 95 nm Rise time V R = 5 V; R L = 5 Ω; λ = 85 nm Fall time V R = 5 V; R L = 5 Ω; λ = 85 nm Forward voltage I F = 1 ma; E = Capacitance V R = V; f = 1 MHz; E = Temperature coefficient of voltage λ = 85 nm Temperature coefficient of short-circuit current λ = 95 nm Noise equivalent power V R = 1 V; λ = 95 nm I R typ. max. 2 na 3 na S λ typ..7 A / W η typ..91 Electrons / Photon V O min. typ. 25 mv 33 mv I SC typ. 17 µa t r typ..2 µs t f typ..2 µs V F typ. 1.3 V C typ. 48 pf TC V typ. -2.6 mv / K TC I typ..18 % / K NEP typ..36 pw / Hz 1/2 Detection limit D* typ. 6.1e12 cm x Hz 1/2 / W 3 Version 1.4 218-5-4
Relative Spectral Sensitivity S rel = f (λ) 1 1), 2) OHF368 S rel % 8 6 4 2 7 8 9 1 nm 12 λ Directional Characteristics S rel = f (φ) 1), 2) 4 3 2 1 ϕ 1. OHF142 5.8 6.6 7.4 8.2 9 1 1..8.6.4 2 4 6 8 1 12 4 Version 1.4 218-5-4
Photocurrent/Open-Circuit Voltage 1), 2) Dark Current 1), 2) I P (V R = 5 V) / V O = f (E e ) I R = f (V R ) ; E = Ι P OHF156 1 3 1 4 µa mv V O Ι R 4 pa OHF8 1 2 3 1 3 V O 1 1 2 1 2 Ι P 1 1 1 1 1-1 1 1 1 1 1 2 2 µw/cm 1 4 E e 5 1 15 V 2 V R Dark Current I R = f (V R ) ; E = 1), 2) 1 2 OHF2284 na Ι R 1 1 1 1-1 2 4 6 8 1 12 14 16 V 2 V R 5 Version 1.4 218-5-4
Capacitance 1), 2) C = f (V R ); f = 1 MHz; E = ; 6 OHF1778 C pf 5 4 3 2 1 1-2 1-1 1 1 1 V 1 2 V R Dark Current 2) I R = f (T A ); E = ; V R = 1 V I R 1 4 na 1 3 OHF5717 1 2 1 1 1 1-1 2 4 6 8 C 1 T A 6 Version 1.4 218-5-4
Power Consumption P tot = f (T A ); P tot 16 mw 14 OHF394 12 1 8 6 4 2 2 4 6 8 C 1 T A 7 Version 1.4 218-5-4
Dimensional Drawing 3) 1.2 (.47) 1.1 (.43)...1 (...4).3 (.12) Chip position 1.1 (.43).9 (.35)...5 6.7 (.264) 6.2 (.244) 4.5 (.177) 4.3 (.169) 1.6 (.63).9 (.35).7 (.28) 1.7 (.67) 1.5 (.59) 4. (.157) 3.7 (.146).2 (.8).1 (.4) ±.2 (.8) Photosensitive area Cathode lead 2.2 (.87) x 2.2 (.87) GEOY6861 Approximate Weight: Package marking: 44. mg Cathode 8 Version 1.4 218-5-4
Reflow Soldering Profile Product complies to MSL Level 4 acc. to JEDEC J-STD-2E 3 C T 25 24 C 217 C 2 t P t L T p OHA4525 245 C 15 t S 1 5 25 C 5 1 15 2 25 s 3 t Profile Feature Symbol Pb-Free (SnAgCu) Assembly Unit Minimum Recommendation Maximum Ramp-up rate to preheat *) 25 C to 15 C 2 3 K/s Time t S t S 6 1 12 s T Smin to T Smax Ramp-up rate to peak *) 2 3 K/s T Smax to T P Liquidus temperature T L 217 C Time above liquidus temperature t L 8 1 s Peak temperature T P 245 26 C Time within 5 C of the specified peak temperature T P - 5 K Ramp-down rate* T P to 1 C t P 1 2 3 s 3 6 K/s Time 48 s 25 C to T P All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range 9 Version 1.4 218-5-4
Taping 3) Cathode/Collector Side 1.5 (.59).8 (.31) 2 (.79) 4 (.157) 4.1 (.161) 1.75 (.69) 5.5 (.217) OHAY2287 6.9 (.272) 12 (.472) Tape and Reel 4) W 1 D P P 2 F E W A N 13. ±.25 P 1 Label Direction of unreeling W 2 Direction of unreeling Leader: min. 4 mm * Trailer: min. 16 mm * *) Dimensions acc. to IEC 6286-3; EIA 481-D OHAY324 1 Version 1.4 218-5-4
Reel dimensions [mm] A W N min W 1 W 2 max Pieces per PU 18 mm 12 +.3 / -.1 6 12.4 + 2 18.4 15 Barcode-Product-Label (BPL) 11 Version 1.4 218-5-4
_< C). _< _< C). 11 _< 144 ML 2 2a 22 C R If wet, 5% parts still adequately dry. change desiccant If wet, 1% examine units, if necessary bake units If wet, 15% examine units, if necessary bake units WET Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. Do not eat. 11 (9D) D/C: 144 Bin2: Q-1-2 Bin3: ML Temp ST 2 22 C R 2a Dry Packing Process and Materials 3) CAUTION LEVEL If blank, see bar code label This bag contains MOISTURE SENSITIVE OPTO SEMICONDUCTORS 1. Shelf life in sealed bag: 24 months at < 4 C and < 9% relative humidity (RH). 2. After this bag is opened, devices that will be subjected to infrared reflow, vapor-phase reflow, or equivalent processing (peak package body temp. If blank, see bar code label a) Mounted within at factory conditions of 3 C/6% RH. Floor time see below b) Stored at 1% RH. 3. Devices require baking, before mounting, if: a) Humidity Indicator Card is > 1% when read at 23 C ± 5 C, or b) 2a or 2b is not met. 4. If baking is required, reference IPC/JEDEC J-STD-33 for bake procedure. Bag seal date (if blank, seal date is identical with date code). Date and time opened: Moisture Level 1 Floor time > 1 Year Moisture Level 4 Floor time 72 Hours Moisture Level 2 Floor time 1 Year Moisture Level 5 Floor time 48 Hours Moisture Level 2a Floor time 4 Weeks Moisture Level 5a Floor time 24 Hours Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours OSRAM Moisture-sensitive label or print Barcode label Humidity indicator Barcode label Comparator check dot Desiccant Humidity Indicator MIL-I-8835 OSRAM OHA539 Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-33. Transportation Packing and Materials 3) Barcode label Barcode label CAUTION This bag contains MOISTURE SENSITIVE OPTO SEMICONDUCTORS 1. Shelf life in sealed bag: 24 months at < 4 C and < 9% relative humidity (RH). 2. After this bag is opened, devices that will be subjected to infrared reflow, vapor-phase reflow, or equivalent processing (peak package body temp. If blank, see bar code label a) Mounted within at factory conditions of 3 C/6% RH. Floor time see below b) Stored at 1% RH. 3. Devices require baking, before mounting, if: a) Humidity Indicator Card is > 1% when read at 23 C ± 5 C, or b) 2a or 2b is not met. 4. If baking is required, reference IPC/JEDEC J-STD-33 for bake procedure. Bag seal date (if blank, seal date is identical with date code). Date and time opened: Moisture Level 1 Floor time > 1 Year Moisture Level 4 Floor time 72 Hours Moisture Level 2 Floor time 1 Year Moisture Level 5 Floor time 48 Hours Moisture Level 2a Floor time 4 Weeks Moisture Level 5a Floor time 24 Hours Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours LEVEL If blank, see bar code label OSRAM Opto Semiconductors (6P) BATCH NO: (1T) LOT NO: 2121998 123GH1234 LSY T676 Multi TOPLED Additional TEXT R77 PACKVAR: P-1+Q-1 OHA244 Muster (X) PROD NO: 1 (9D) D/C: 425 (Q)QTY: 2 Bin1: P-1-2 Bin2: Q-1-2 Bin3: Temp ST 24 C R 3 26 C RT (G) GROUP: R18 DEMY OSRAM Opto Semiconductors (6P) BATCH NO: (1T) LOT NO: 2121998 123GH1234 Muster (X) PROD NO: 1 425 (Q)QTY: 2 LSY T676 Multi TOPLED Bin1: P-1-2 24 C R 3 26 C RT Additional TEXT R77 PACKVAR: (G) GROUP: R18 DEMY P-1+Q-1 OSRAM Packing Sealing label 12 Version 1.4 218-5-4
Dimensions of transportation box in mm Width Length Height 195 ± 5 mm 195 ± 5 mm 3 ± 5 mm 13 Version 1.4 218-5-4
Notes The evaluation of eye safety occurs according to the standard IEC 62471:26 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the LED specified in this data sheet fall into the class exempt group (exposure time 1 s). Under real circumstances (for exposure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. When looking at bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irritation, annoyance, visual impairment, and even accidents, depending on the situation. Subcomponents of this LED contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. Therefore, we recommend that customers minimize LED exposure to aggressive substances during storage, production, and use. LEDs that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC681. For further application related informations please visit www.osram-os.com/appnotes 14 Version 1.4 218-5-4
Disclaimer Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version in the OSRAM OS Webside. Packing Please use the recycling operators known to you. We can also help you get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Product safety devices/applications or medical devices/applications OSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices. In case Buyer or Customer supplied by Buyer considers using OSRAM OS components in product safety devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordinate the customer-specific request between OSRAM OS and Buyer and/or Customer. 15 Version 1.4 218-5-4
Glossary 1) Testing temperature: T A = 25 C 2) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 3) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±.1 and dimensions are specified in mm. 4) Tape and Reel: All dimensions and tolerances are specified acc. IEC 6286-3 and specified in mm. 16 Version 1.4 218-5-4
Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-9355 Regensburg www.osram-os.com All Rights Reserved. 17 Version 1.4 218-5-4