Product Specification Thermal Print Head Model: MT-S2-8-5ES1 Rev:

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Transcription:

Product Specification Thermal Print Head Model: MT-S2-8-5ES1 Rev: 0086-6 Thermal Print Head Page 1 of 10

1. Description The specification is applicable to thermal print head, model MT-S2-8-5ES1, on which CMOS driver IC s are mounted. 2. Structure and Appearance 2.1 Structure Two-inch wide side face type thermal print head comprises of a high-density thick film printing technologies on alumina substrate, electric connection method and protective metal shield mounted on an aluminum heat sink. 2.2 Appearance No scratches, stains and/or warps affecting printing quality are allowed. 3. Mechanical Features 3.1 Dimension (1) Outline drawing see Fig. 1 (2) Flatness of heater not more than 20 μm 3.2 Heater Element (1) Number of heater element 384 dots (2) Size of heater element (X) 0.125 mm (Y) 0.130 mm (3) Pitch between each heater element 0.125 mm (4) Print width 48.0 mm 4. Electrical Features 4.1 Circuitry (1) Schematic diagram see Fig. 2 (2) Timing chart see Fig. 3 (3) Specifications for driver ICs see Table 1 (4) Number of driver ICs 64 bits x 6 (5) Logic supply voltage + 5 V (6) Data signal transfer clocked serial input (7) Clock rate 4 MHz (8) Direction of print data inputs From left to right, Fig. 1 Thermal Print Head Page 2 of 10

(9) Number of print line separation 5 strobes (10) Thermistor 103ET-2 R 25 = 10.0 kω±3.0% B 25 = 3,250 K ±1.0% Dissipation constant = 0.7 mw / C Time constant = 3.4 s 4.2 Resistance of Heater Element (Single Dot) (1) Average resistance (R av ) 880 Ω± 15 % (2) R av Deviation within one individual dot line R av ± 15 % 4.3 Pin Connection see Table 2 5. Operation Characteristics 5.1 Standard Mechanical Parameters (1) Platen pressure 14.7 ~ 19.6 N/head (1.5 ~ 2.0 kgf/head) (2) Platen diameter 25.0 mm (3) Platen hardness 30.0 ~ 50.0 Shore hardness 5.2 Standard Operating Parameters (1) Pulse width (heating strobe) (P w ) 2.0 ms (2) Total pulse duration 4.0 ms (3) Heater power consumption (P) 0.6 W/dot (4) Heater voltage (Vpp) 24.0 V (5) Heater element (dot) current 26.1 ma/dot (6) Thermal paper TP50KS-4HM or equivalent (Nippon Paper Industries Co., Ltd.) 5.3 Absolute Maximum Rating (1) Heater energy consumption 1.42 mj/dot (2) Heater power consumption 0.7 W/dot (3) Heater voltage 26.0 V (4) Duty cycle 60 % (5) Heatsink temperature 80 C Thermal Print Head Page 3 of 10

6. Life Expectancy (1) Dot heating cycle (any one dot) 5.0 x 10 7 pulse (Note 1) (2) Abrasion life 50.0 km Note 1. These figures result from life-test performed on MITANI-TPH s in unconditioned real world environment (see also section 5.1 and 5.2). Clean conditions (pollution free, heat controlled and/or anti-static discharge assembly or usage etc) can extend lifetime-figures significantly. 7. Environment (1) Operating temperature -10 ~ +50 C (2) Operating humidity (non condensing) 10 ~ 90 %RH (3) Storage temperature -20 ~ +80 C Table 1 CMOS driver IC Parameter Symbol Min. Typ. Max. Unit Remarks Supply voltage V cc 4.5 5.0 5.5 V Consumption current I cc - 0.4 0.8 ma V cc = 5.0 V F ck = 5 MHz DI/DO fixed Input voltage V IH 0.7 V cc - V cc V V IL 0.0-0.3 V cc V Input current I IH - - 0.5 μa V IH = V cc Driver output Voltage Current I IL - - 0.5 μa V IL = 0 V, V cc = 5.0 V V O - 26.4 V V OL - 0.7 2.0 V at I OL = 100 ma I OL - - 100.0 ma Thermal Print Head Page 4 of 10

Table 1 CMOS driver IC (continued) Parameter Symbol Min. Typ. Max. Unit Remarks Clock frequency f CLK - - 8.0 MHz Clock pulse width t w(clk) 45.0 - - ns Data setup time t su(d) 40.0 - - ns Data -> Clock Latch setup time t su(l) 100.0 - - ns Clock -> Latch Latch pulse width t w(l) 100.0 - - ns Data hold time t hold 10.0 - - ns Clock -> Data In Output delay time t p - 3.5 10.0 μs Strobe -> Data Out t w(clk) Clock Data-In t su(d) t hold Latch t su(l) t w(l) Strobe t p Output Voltage Thermal Print Head Page 5 of 10

Direction of printing-data input R001 Heat Sink R384 G Head Cover F G H B R001 R384 A E MITANI THERMAL PRINT HEAD N 1 13 14 26 Capacitor 35V-10uF Occupied by thread P 14 1 O I J R Q 26 13 Connector: PS-26PE-D4LT1-PN1 (JAE) Thermistor Capacitor 16V-10uF K C Occupied by thread D L M Item Dimension (Unit in mm) A 2.0 ± 0.2 B 3.0 ± 0.1 C D 12.0 Max 16.0 Max E 5.0 ± 0.1 F 48.0 ± 0.1 G 5.5 ± 0.1 H 60.0 ± 0.1 I 48.0 ± 0.1 J 30.0 ± 0.1 K 11.0 ± 0.2 L 15.0 ± 0.1 M 17.0 ± 0.1 N 35.0 ± 0.3 O 2 φ2.5 ± 0.1 P 2 M3, Depth 3.5 Max. Q φ8.0 ± 0.2 R Width 4.0± 0.2 Depth 2.0± 0.2 Fig. 1 Outline Thermal Print Head Page 6 of 10

Table 2 Pin Connection Pin Name Pin Name 1 Thermistor 14 Thermistor 2 V TH 15 V TH 3 Data In 16 Clock 4 Strobe 1 17 Strobe 2 5 Strobe 3 18 NC 6 GND 19 GND 7 GND 20 GND 8 GND 21 GND 9 Strobe 4 22 Strobe 5 10 Latch 23 Data Out 11 NC 24 NC 12 V cc (+ 5 V) 25 V cc (+ 5 V) 13 V TH 26 V TH Note 1. Connector model No. PS-26PE-D4LT1-PN1 (JAE) Thermal Print Head Page 7 of 10

V TH R001 - R064 R065 - R128 R129 - R192 R193 - R256 R257 - R320 R321 - R384 + 35V 10μF - GND IC #1 IC #2 IC #3 IC #4 IC #5 IC #6 STROBE1 STROBE2 STROBE3 STROBE4 STROBE5 LATCH LATCH DATA IN SHIFT REGISTER CLOCK DATA OUT V CC GND + - 16V 10μF TM TM Fig.2 Schematic diagram Thermal Print Head Page 8 of 10

Clock Data-In Latch Strobe Off Off Driver Output On On Fig. 3 Timing Thermal Print Head Page 9 of 10

8. General Precautions (1) Latch up prevention Latch-up conditions can cause failures and/or severe damage. To prevent latch-up each power should be applied to the thermal print head in the following sequences. Power On: 4.75 V (5 V) Power Off: (5 V) 4.75 V V cc V cc (V TH max.) (V TH max.) 1.0 V max. V TH V TH 1.0 V max. 2.0 ms min. 2.0 ms min. (2) Overload protection Strobes should always be at L level when the printline is not in contact with a media and/or during switch-off in order to prevent burn-out of the printing dots. (3) CMOS protection The unit is sensitive to static loads (CMOS IC s). Utmost care should therefore be taken in order to prevent from any static discharge to the thermal print head during storage and handling. Static discharge may deadly damage the thermal print head. (4) Protective head cover A metal cover is used to protect the IC s-area against mechanic force. It should never be removed nor should any high pressure or impact be loaded on the protective head cover. (5) Connector Misconnection or loose connection while operating the thermal print head might cause failures or even severe damages. (6) Mechanical protection The surface of the thermal print head must never be treated with objects hard enough to cause scratches. Penetration of the protective layers covering the heaters and/or the conductors may result in electrical shorts or conduction breaks. Thermal Print Head Page 10 of 10