74HC164; 74HCT bit serial-in, parallel-out shift register

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Rev. 03 4 pril 2005 Product data sheet 1. General description 2. Features 3. Quick reference data The are high-speed Si-gate CMOS devices and are pin compatible with Low power Schottky TTL (LSTTL). They are specified in compliance with JEEC standard no. 7. The are 8-bit edge-triggered shift registers with serial data entry and an output from each of the eight stages. ata is entered serially through one of two inputs (S or SB); either input can be used as an active HIGH enable for data entry through the other input. Both inputs must be connected together or an unused input must be tied HIGH. ata shifts one place to the right on each LOW-to-HIGH transition of the clock () input and enters into Q0, which is the logical N of the two data inputs (S and SB) that existed one set-up time prior to the rising clock edge. LOW level on the master reset (MR) input overrides all other inputs and clears the register asynchronously, forcing all outputs LOW. Gated serial data inputs synchronous master reset Complies with JEEC standard no. 7 ES protection: HBM EI/JES22-114-B exceeds 2000 V MM EI/JES22-115- exceeds 200 V. Multiple package options Specified from 40 C to +85 C and 40 C to +125 C. Table 1: Quick reference data GN = 0 V; T amb = 25 C; t r = t f = 6 ns. Type 74HC164 t PHL, t PLH propagation delay to Qn C L = 15 pf; V CC = 5 V - 12 - ns MR to Qn C L = 15 pf; V CC = 5 V - 11 - ns

4. Ordering information Table 1: Quick reference data continued GN = 0 V; T amb = 25 C; t r = t f = 6 ns. f max maximum clock frequency C L = 15 pf; - 78 - MHz V CC = 5 V C I input capacitance - 3.5 - pf C P power dissipation [1] - 40 - pf capacitance per package [2] Type 74HCT164 t PHL, t PLH propagation delay to Qn C L = 15 pf; V CC = 5 V - 14 - ns MR to Qn C L = 15 pf; - 16 - ns V CC = 5 V f max maximum clock frequency C L = 15 pf; - 61 - MHz V CC = 5 V C I input capacitance - 3.5 - pf C P power dissipation capacitance per package [1] [3] - 40 - pf [1] C P is used to determine the dynamic power dissipation (P in µw). P = C P V 2 CC f i N + (C L V 2 CC f o ) where: f i = input frequency in MHz f o = output frequency in MHz N = number of inputs switching (C L V 2 CC f o ) = sum of outputs C L = output load capacitance in pf V CC = supply voltage in Volts [2] For HC the condition is V I = GN to V CC. [3] For HCT the condition is V I = GN to V CC 1.5 V. Table 2: Type number Ordering information Package Temperature Name escription Version range 74HC164N 40 C to +125 C IP14 plastic dual in-line package; 14 leads (300 mil) SOT27-1 74HC164 40 C to +125 C SO14 plastic small outline package; 14 leads; body width SOT108-2 3.9 mm; body thickness 1.47 mm 74HC164B 40 C to +125 C SSOP14 plastic shrink small outline package; 14 leads; body SOT337-1 width 5.3 mm 74HC164PW 40 C to +125 C TSSOP14 plastic thin shrink small outline package; 14 leads; body SOT402-1 width 4.4 mm 74HCT164N 40 C to +125 C IP14 plastic dual in-line package; 14 leads (300 mil) SOT27-1 74HCT164 40 C to +125 C SO14 plastic small outline package; 14 leads; body width 3.9 mm; body thickness 1.47 mm SOT108-2 Product data sheet Rev. 03 4 pril 2005 2 of 24

Table 2: Type number Ordering information continued Package Temperature range 74HCT164B 40 C to +125 C SSOP14 plastic shrink small outline package; 14 leads; body width 5.3 mm 74HCT164PW 40 C to +125 C TSSOP14 plastic thin shrink small outline package; 14 leads; body width 4.4 mm 74HCT164BQ 40 C to +125 C HVQFN14 plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2.5 3 0.85 mm 5. Functional diagram Name escription Version SOT337-1 SOT402-1 SOT762-1 8 9 R C1/ SRG8 S SB MR 1 2 3 4 5 6 10 8 11 12 9 13 001aac423 Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7 1 2 & 1 3 4 5 6 10 11 12 13 001aac424 Fig 1. Logic symbol Fig 2. IEC logic symbol S SB MR 1 2 8 9 8-BIT SERIL IN/PRLLEL OUT SHIFT REGISTER 3 4 5 6 10 11 12 13 Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7 001aac425 Fig 3. Logic diagram Product data sheet Rev. 03 4 pril 2005 3 of 24

S Q Q Q Q Q Q Q Q SB FF1 FF2 FF3 FF4 FF5 FF6 FF7 FF8 R R R R R R R R MR Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7 001aac616 Fig 4. Functional diagram 6. Pinning information 6.1 Pinning Fig 5. S SB Q0 Q1 Q2 Q3 GN 1 2 3 4 5 6 164 001aac422 14 13 12 11 10 7 8 V CC Q7 Q6 Q5 Q4 MR Pin configuration IP14, SO14, SSOP14 and TSSOP14 9 Fig 6. terminal 1 index area SB Q0 Q1 Q2 Q3 S 1 4 164 11 5 GN (1) 10 6 9 GN VCC 2 13 3 12 7 14 8 Transparent top view Q7 Q6 Q5 Q4 MR 001aac828 (1) The die substrate is attached to the exposed die pad using conductive die attach material. It can not be used as a supply pin of input. Pin configuration HVQFN14 6.2 Pin description Table 3: Pin description Symbol Pin escription S 1 data input SB 2 data input Q0 3 output Q1 4 output Q2 5 output Q3 6 output Product data sheet Rev. 03 4 pril 2005 4 of 24

7. Functional description Table 3: Pin description continued Symbol Pin escription GN 7 ground (0 V) 8 clock input (LOW-to-HIGH, edge-triggered) MR 9 master reset input (active LOW) Q4 10 output Q5 11 output Q6 12 output Q7 13 output V CC 14 positive supply voltage 8. Limiting values 7.1 Function selection Table 4: Function table [1] Operating Input Output modes MR S SB Q0 Q1 to Q7 Reset (clear) L X X X L L to L Shift H l l L q0 to q6 H l h L q0 to q6 H h l L q0 to q6 H h h H q0 to q6 [1] H = HIGH voltage level h = HIGH voltage level one set-up time prior to the LOW-to-HIGH clock transition L = LOW voltage level I = LOW voltage level one set-up time prior to the LOW-to-HIGH clock transition q = lower case letters indicate the state of the referenced input one set-up time prior to the LOW-to-HIGH clock transition = LOW-to-HIGH clock transition Table 5: Limiting values In accordance with the bsolute Maximum Rating System (IEC 60134). Voltages are referenced to GN (ground = 0 V). Symbol Parameter Conditions Min Max Unit V CC supply voltage 0.5 +7 V I IK input diode current V I < 0.5 V or - ±20 m V I >V CC + 0.5 V I OK output diode current V O < 0.5 V or - ±20 m V O >V CC + 0.5 V I O output source or sink current V O = 0.5 V to V CC + 0.5 V - ±25 m I CC, I GN V CC or GN current - ±50 m T stg storage temperature 65 +150 C Product data sheet Rev. 03 4 pril 2005 5 of 24

Table 5: Limiting values continued In accordance with the bsolute Maximum Rating System (IEC 60134). Voltages are referenced to GN (ground = 0 V). Symbol Parameter Conditions Min Max Unit P tot [1] For IP14 packages: P tot derates linearly with 12 mw/k above 70 C. [2] For SO14 packages: P tot derates linearly with 8 mw/k above 70 C. For SSOP14 and TSSOP14 packages: P tot derates linearly with 5.5 mw/k above 60 C. For HVQFN14 packages: P tot derates linearly with 4.5 mw/k above 60 C. 9. Recommended operating conditions total power dissipation IP14 package [1] - 750 mw SO14; SSOP14; TSSOP14; HVQFN14 package [2] - 500 mw 10. Static characteristics Table 6: Recommended operating conditions Type 74HC164 V CC supply voltage 2.0 5.0 6.0 V V I input voltage 0 - V CC V V O output voltage 0 - V CC V t r, t f input rise and fall time V CC = 2.0 V - - 1000 ns V CC = 4.5 V - 6.0 500 ns V CC = 6.0 V - - 400 ns T amb ambient temperature 40 - +125 C Type 74HCT164 V CC supply voltage 4.5 5.0 6.0 V V I input voltage 0 - V CC V V O output voltage 0 - V CC V t r, t f input rise and fall time V CC = 4.5 V - 6.0 500 ns T amb ambient temperature 40 - +125 C Table 7: Static characteristics for 74HC164 t recommended operating conditions; voltages are referenced to GN (ground = 0 V). T amb =25 C V IH HIGH-level input voltage V CC = 2.0 V 1.5 1.2 - V V CC = 4.5 V 3.15 2.4 - V V CC = 6.0 V 4.2 3.2 - V Product data sheet Rev. 03 4 pril 2005 6 of 24

Table 7: Static characteristics for 74HC164 continued t recommended operating conditions; voltages are referenced to GN (ground = 0 V). V IL LOW-level input voltage V CC = 2.0 V - 0.8 0.5 V V CC = 4.5 V - 2.1 1.35 V V CC = 6.0 V - 2.8 1.8 V V OH HIGH-level output voltage V I =V IH or V IL I O = 20 µ; V CC = 2.0 V 1.9 2.0 - V I O = 20 µ; V CC = 4.5 V 4.4 4.5 - V I O = 20 µ; V CC = 6.0 V 5.9 6.0 - V I O = 4 m; V CC = 4.5 V 3.98 4.32 - V I O = 5.2 m; V CC = 6.0 V 5.48 5.81 - V V OL LOW-level output voltage V I =V IH or V IL I O =20µ; V CC = 2.0 V - 0 0.1 V I O =20µ; V CC = 4.5 V - 0 0.1 V I O =20µ; V CC = 6.0 V - 0 0.1 V I O = 4 m; V CC = 4.5 V - 0.15 0.26 V I O = 5.2 m; V CC = 6.0 V - 0.16 0.26 V I LI input leakage current V I =V CC or GN; V CC = 6.0 V - - ±0.1 µ I CC quiescent supply current V I =V CC or GN; I O =0; - - 8.0 µ V CC = 6.0 V C I input capacitance - 3.5 - pf T amb = 40 C to +85 C V IH HIGH-level input voltage V CC = 2.0 V 1.5 - - V V CC = 4.5 V 3.15 - - V V CC = 6.0 V 4.2 - - V V IL LOW-level input voltage V CC = 2.0 V - - 0.5 V V CC = 4.5 V - - 1.35 V V CC = 6.0 V - - 1.8 V V OH HIGH-level output voltage V I =V IH or V IL I O = 20 µ; V CC = 2.0 V 1.9 - - V I O = 20 µ; V CC = 4.5 V 4.4 - - V I O = 20 µ; V CC = 6.0 V 5.9 - - V I O = 4 m; V CC = 4.5 V 3.84 - - V I O = 5.2 m; V CC = 6.0 V 5.34 - - V V OL LOW-level output voltage V I =V IH or V IL I O =20µ; V CC = 2.0 V - - 0.1 V I O =20µ; V CC = 4.5 V - - 0.1 V I O =20µ; V CC = 6.0 V - - 0.1 V I O = 4 m; V CC = 4.5 V - - 0.33 V I O = 5.2 m; V CC = 6.0 V - - 0.33 V I LI input leakage current V I =V CC or GN; V CC = 6.0 V - - ±1.0 µ I CC quiescent supply current V I =V CC or GN; I O =0; V CC = 6.0 V - - 80 µ Product data sheet Rev. 03 4 pril 2005 7 of 24

Table 7: Static characteristics for 74HC164 continued t recommended operating conditions; voltages are referenced to GN (ground = 0 V). T amb = 40 C to +125 C V IH HIGH-level input voltage V CC = 2.0 V 1.5 - - V V CC = 4.5 V 3.15 - - V V CC = 6.0 V 4.2 - - V V IL LOW-level input voltage V CC = 2.0 V - - 0.5 V V CC = 4.5 V - - 1.35 V V CC = 6.0 V - - 1.8 V V OH HIGH-level output voltage V I =V IH or V IL - I O = 20 µ; V CC = 2.0 V 1.9 - - V I O = 20 µ; V CC = 4.5 V 4.4 - - V I O = 20 µ; V CC = 6.0 V 5.9 - - V I O = 4 m; V CC = 4.5 V 3.7 - - V I O = 5.2 m; V CC = 6.0 V 5.2 - - V V OL LOW-level output voltage V I =V IH or V IL - I O =20µ; V CC = 2.0 V - - 0.1 V I O =20µ; V CC = 4.5 V - - 0.1 V I O =20µ; V CC = 6.0 V - - 0.1 V I O = 4 m; V CC = 4.5 V - - 0.4 V I O = 5.2 m; V CC = 6.0 V - - 0.4 V I LI input leakage current V I =V CC or GN; V CC = 6.0 V - - ±1.0 µ I CC quiescent supply current V I =V CC or GN; I O =0; V CC = 6.0 V - - 160 µ Table 8: Static characteristics for 74HCT164 t recommended operating conditions; voltages are referenced to GN (ground = 0 V). T amb =25 C V IH HIGH-level input voltage V CC = 4.5 V to 5.5 V 2.0 1.6 - V V IL LOW-level input voltage V CC = 4.5 V to 5.5 V - 1.2 0.8 V V OH HIGH-level output voltage V I =V IH or V IL I O = 20 µ; V CC = 4.5 V 4.4 4.5 - V I O = 4 m; V CC = 4.5 V 3.98 4.32 - V V OL LOW-level output voltage V I =V IH or V IL I O =20µ; V CC = 4.5 V - 0 0.1 V I O = 4 m; V CC = 4.5 V - 0.15 0.26 V I LI input leakage current V I =V CC or GN; V CC = 5.5 V - - ±0.1 µ I CC quiescent supply current V I =V CC or GN; I O =0; V CC = 5.5 V - - 8.0 µ I CC additional quiescent supply current per input pin V I =V CC 2.1 V; other inputs V I =V CC or GN; V CC = 4.5 V to 5.5 V; I O =0-100 360 µ C I input capacitance - 3.5 - pf Product data sheet Rev. 03 4 pril 2005 8 of 24

Table 8: Static characteristics for 74HCT164 continued t recommended operating conditions; voltages are referenced to GN (ground = 0 V). T amb = 40 C to +85 C V IH HIGH-level input voltage V CC = 4.5 V to 5.5 V 2.0 - - V V IL LOW-level input voltage V CC = 4.5 V to 5.5 V - - 0.8 V V OH HIGH-level output voltage V I =V IH or V IL I O = 20 µ; V CC = 4.5 V 4.4 - - V I O = 4 m; V CC = 4.5 V 3.84 - - V V OL LOW-level output voltage V I =V IH or V IL I O =20µ; V CC = 4.5 V - - 0.1 V I O = 4 m; V CC = 4.5 V - - 0.33 V I LI input leakage current V I =V CC or GN; V CC = 5.5 V - - ±1.0 µ I CC quiescent supply current V I =V CC or GN; I O =0; V CC = 5.5 V - - 80.0 µ I CC additional quiescent supply current per input pin V I =V CC 2.1 V; other inputs V I =V CC or GN; V CC = 4.5 V to 5.5 V; I O =0 - - 450 µ T amb = 40 C to +125 C V IH HIGH-level input voltage V CC = 4.5 V to 5.5 V 2.0 - - V V IL LOW-level input voltage V CC = 4.5 V to 5.5 V - - 0.8 V V OH HIGH-level output voltage V I =V IH or V IL I O = 20 µ; V CC = 4.5 V 4.4 - - V I O = 4 m; V CC = 4.5 V 3.7 - - V V OL LOW-level output voltage V I =V IH or V IL I O =20µ; V CC = 4.5 V - - 0.1 V I O = 4 m; V CC = 4.5 V - - 0.4 V I LI input leakage current V I =V CC or GN; V CC = 5.5 V - - ±1.0 µ I CC quiescent supply current V I =V CC or GN; I O =0; V CC = 5.5 V - - 160.0 µ I CC additional quiescent supply current per input pin V I =V CC 2.1 V; other inputs V I =V CC or GN; V CC = 4.5 V to 5.5 V; I O =0 - - 490 µ Product data sheet Rev. 03 4 pril 2005 9 of 24

11. ynamic characteristics Table 9: ynamic characteristics for 74HC164 GN = 0 V; t r = t f = 6 ns; C L = 50 pf; test circuit see Figure 10; unless otherwise specified T amb = 25 C t PHL, t PLH propagation delay to Qn V CC = 2.0 V - 41 170 ns V CC = 4.5 V - 15 34 ns V CC = 6.0 V - 12 29 ns t PHL propagation delay see Figure 8 MR to Qn V CC = 2.0 V - 39 140 ns V CC = 4.5 V - 14 28 ns V CC = 6.0 V - 11 24 ns t THL, t TLH output transition time V CC = 2.0 V - 19 75 ns V CC = 4.5 V - 7 15 ns V CC = 6.0 V - 6 13 ns t W clock pulse width; HIGH or LOW V CC = 2.0 V 80 14 - ns V CC = 4.5 V 16 5 - ns V CC = 6.0 V 14 4 - ns master reset pulse width; LOW see Figure 8 V CC = 2.0 V 60 17 - ns V CC = 4.5 V 12 6 - ns V CC = 6.0 V 10 5 - ns t rem removal time MR to see Figure 8 V CC = 2.0 V 60 17 - ns V CC = 4.5 V 12 6 - ns V CC = 6.0 V 10 5 - ns t su set-up time see Figure 9 S, and SB to V CC = 2.0 V 60 8 - ns V CC = 4.5 V 12 3 - ns V CC = 6.0 V 10 2 - ns t h hold time S and SB see Figure 9 to V CC = 2.0 V +4 6 - ns V CC = 4.5 V +4 2 - ns V CC = 6.0 V +4 2 - ns f max maximum clock pulse frequency V CC = 2.0 V 6 23 - MHz V CC = 4.5 V 30 71 - MHz V CC = 6.0 V 35 85 - MHz Product data sheet Rev. 03 4 pril 2005 10 of 24

Table 9: ynamic characteristics for 74HC164 continued GN = 0 V; t r = t f = 6 ns; C L = 50 pf; test circuit see Figure 10; unless otherwise specified T amb = 40 C to +85 C t PHL, t PLH propagation delay to Qn V CC = 2.0 V - - 215 ns V CC = 4.5 V - - 43 ns V CC = 6.0 V - - 37 ns t PHL propagation delay see Figure 8 MR to Qn V CC = 2.0 V - - 175 ns V CC = 4.5 V - - 35 ns V CC = 6.0 V - - 30 ns t THL, t TLH output transition time V CC = 2.0 V - - 95 ns V CC = 4.5 V - - 19 ns V CC = 6.0 V - - 16 ns t W clock pulse width; HIGH or LOW V CC = 2.0 V 100 - - ns V CC = 4.5 V 20 - - ns V CC = 6.0 V 17 - - ns master reset pulse width; LOW see Figure 8 V CC = 2.0 V 75 - - ns V CC = 4.5 V 15 - - ns V CC = 6.0 V 13 - - ns t rem removal time MR to see Figure 8 V CC = 2.0 V 75 - - ns V CC = 4.5 V 15 - - ns V CC = 6.0 V 13 - - ns t su set-up time see Figure 9 S and SB to V CC = 2.0 V 75 - - ns V CC = 4.5 V 15 - - ns V CC = 6.0 V 13 - - ns t h hold time S and SB see Figure 9 - to V CC = 2.0 V 4 - - ns V CC = 4.5 V 4 - - ns V CC = 6.0 V 4 - - ns f max maximum clock pulse frequency V CC = 2.0 V 5 - - MHz V CC = 4.5 V 24 - - MHz V CC = 6.0 V 28 - - MHz Product data sheet Rev. 03 4 pril 2005 11 of 24

Table 9: ynamic characteristics for 74HC164 continued GN = 0 V; t r = t f = 6 ns; C L = 50 pf; test circuit see Figure 10; unless otherwise specified T amb = 40 C to +125 C t PHL, t PLH propagation delay to Qn V CC = 2.0 V - - 255 ns V CC = 4.5 V - - 51 ns V CC = 6.0 V - - 43 ns t PHL propagation delay MR to Qn V CC = 2.0 V - - 210 ns V CC = 4.5 V - - 42 ns V CC = 6.0 V - - 36 ns t THL, t TLH output transition time V CC = 2.0 V - - 110 ns V CC = 4.5 V - - 22 ns V CC = 6.0 V - - 19 ns t W clock pulse width; HIGH or LOW V CC = 2.0 V 120 - - ns V CC = 4.5 V 24 - - ns V CC = 6.0 V 20 - - ns master reset pulse width; LOW V CC = 2.0 V 90 - - ns V CC = 4.5 V 18 - - ns V CC = 6.0 V 15 - - ns t rem removal time MR to see Figure 8 V CC = 2.0 V 90 - - ns V CC = 4.5 V 18 - - ns V CC = 6.0 V 15 - - ns t su set-up time see Figure 9 S and SB to V CC = 2.0 V 90 - - ns V CC = 4.5 V 18 - - ns V CC = 6.0 V 15 - - ns t h hold time S and SB see Figure 9 to V CC = 2.0 V 4 - - ns V CC = 4.5 V 4 - - ns V CC = 6.0 V 4 - - ns f max maximum clock pulse frequency V CC = 2.0 V 4 - - MHz V CC = 4.5 V 20 - - MHz V CC = 6.0 V 24 - - MHz Product data sheet Rev. 03 4 pril 2005 12 of 24

Table 10: ynamic characteristics for 74HCT164 GN = 0 V; t r = t f = 6 ns; C L = 50 pf; test circuit see Figure 10; unless otherwise specified T amb = 25 C t PHL, t PLH propagation delay to Qn - 17 36 ns t PHL propagation delay MR to Qn see Figure 8 t THL, t TLH output transition time t W clock pulse width; HIGH or LOW master reset pulse width; LOW see Figure 8 t rem removal time MR to see Figure 8 t su set-up time S, and SB to t h hold time S, and SB to f max maximum clock pulse frequency T amb = 40 C to +85 C t PHL, t PLH propagation delay to Qn t PHL propagation delay MR to Qn see Figure 9 see Figure 9 see Figure 8 t THL, t TLH output transition time t W clock pulse width; HIGH or LOW master reset pulse width; LOW see Figure 8 t rem removal time MR to see Figure 8 t su set-up time S, and SB to t h hold time S, and SB to f max maximum clock pulse frequency T amb = 40 C to +125 C t PHL, t PLH propagation delay to Qn t PHL propagation delay MR to Qn see Figure 9 see Figure 9 see Figure 8 t THL, t TLH output transition time - 19 38 ns - 7 15 ns 18 7 - ns 18 10 - ns 16 7 - ns 12 6 - ns +4 2 - ns 27 55 - MHz - - 45 ns - - 48 ns - - 19 ns 23 - - ns 23 - - ns 20 - - ns 15 - - ns 4 - - ns 22 - - MHz - - 54 ns - - 57 ns - - 22 ns Product data sheet Rev. 03 4 pril 2005 13 of 24

Table 10: ynamic characteristics for 74HCT164 continued GN = 0 V; t r = t f = 6 ns; C L = 50 pf; test circuit see Figure 10; unless otherwise specified t W clock pulse width; HIGH or LOW master reset pulse width; LOW see Figure 8 t rem removal time MR to see Figure 8 t su t h f max set-up time S and SB to hold time S and SB to maximum clock pulse frequency see Figure 9 see Figure 9 27 - - ns 27 - - ns 24 - - ns 18 - - ns 4 - - ns 18 - - MHz V I 1/f max input V M GN t W t PHL t PLH V OH Qn output V M V OL 001aac426 (1) 74HC164: V M = 50 %; V I = GN to V CC. 74HCT164: V M = 1.3 V; V I = GN to 3 V. Fig 7. Waveforms showing the clock () to output (Qn) propagation delays, the clock pulse width, the output transition times and the maximum clock frequency Product data sheet Rev. 03 4 pril 2005 14 of 24

V I MR input V M GN t W t rem V I input V M GN t PHL V OH Qn output V M V OL 001aac427 (1) 74HC164: V M = 50 %; V I = GN to V CC. 74HCT164: V M = 1.3 V; V I = GN to 3 V. Fig 8. Waveforms showing the master reset (MR) pulse width, the master reset to output (Qn) propagation delays and the master reset to clock () removal time V I input V M GN t su t su V I t h th n input V M GN V OH Qn output V M V OL 001aac428 Fig 9. (1) 74HC164: V M = 50 %; V I = GN to V CC. 74HCT164: V M = 1.3 V; V I = GN to 3 V. The shaded areas indicate when the input is permitted to change for predictable output performance. Waveforms showing the data set-up and hold times for n inputs Product data sheet Rev. 03 4 pril 2005 15 of 24

V CC PULSE GENERTOR V I.U.T. V O R T C L mna101 efinitions test circuit. R T = termination resistance should be equal to output impedance Z o of the pulse generator. C L = Load capacitance including jig and probe capacitance. Fig 10. Load circuitry for switching times Product data sheet Rev. 03 4 pril 2005 16 of 24

12. Package outline IP14: plastic dual in-line package; 14 leads (300 mil) SOT27-1 M E seating plane 2 L 1 Z 14 e b b 1 8 w M c (e ) 1 M H pin 1 index E 1 7 0 5 10 mm scale IMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches max. 1 2 (1) (1) min. max. b b 1 c E e e 1 L M E M H 4.2 0.51 3.2 0.17 0.02 0.13 1.73 1.13 0.068 0.044 0.53 0.38 0.021 0.015 0.36 0.23 0.014 0.009 19.50 18.55 0.77 0.73 6.48 6.20 0.26 0.24 2.54 7.62 0.1 0.3 3.60 3.05 0.14 0.12 8.25 7.80 0.32 0.31 10.0 8.3 0.39 0.33 w 0.254 0.01 (1) Z max. 2.2 0.087 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEEC JEIT EUROPEN PROJECTION ISSUE TE SOT27-1 050G04 MO-001 SC-501-14 99-12-27 03-02-13 Fig 11. Package outline SOT27-1 (IP14) Product data sheet Rev. 03 4 pril 2005 17 of 24

SO14: plastic small outline package; 14 leads; body width 3.9 mm; body thickness 1.47 mm SOT108-2 E X c y H E v M Z 14 8 pin 1 index 2 1 ( ) 3 θ L p 1 7 L e b p w M detail X 0 2.5 5 mm scale IMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches max. 1.75 1 2 3 b p c (1) E (1) e H (1) E L L p v w y Z 0.25 0.10 0.069 0.010 0.004 1.55 1.40 0.061 0.055 0.25 0.01 0.49 0.36 0.019 0.014 0.25 0.19 0.0100 0.0075 8.75 8.55 0.35 0.34 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 4.0 3.8 0.16 0.15 1.27 0.05 6.2 5.8 0.244 0.228 1.05 0.041 1.0 0.4 0.039 0.016 0.25 0.25 0.1 0.01 0.01 0.004 θ 0.7 0.3 o 8 o 0.028 0 0.012 OUTLINE VERSION REFERENCES IEC JEEC JEIT EUROPEN PROJECTION ISSUE TE SOT108-2 MS-012 01-05-29 03-02-19 Fig 12. Package outline SOT108-2 (SO14) Product data sheet Rev. 03 4 pril 2005 18 of 24

SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm SOT337-1 E X c y H E v M Z 14 8 Q 2 1 ( ) 3 pin 1 index 1 7 L detail X L p θ e b p w M 0 2.5 5 mm scale IMENSIONS (mm are the original dimensions) UNIT 1 2 3 b p c (1) E (1) e H E L L p Q v w y Z(1) max. mm 2 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 6.4 6.0 5.4 5.2 7.9 1.03 0.9 0.65 1.25 0.2 7.6 0.63 0.7 0.13 0.1 1.4 0.9 θ o 8 o 0 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEEC JEIT EUROPEN PROJECTION ISSUE TE SOT337-1 MO-150 99-12-27 03-02-19 Fig 13. Package outline SOT337-1 (SSOP14) Product data sheet Rev. 03 4 pril 2005 19 of 24

TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1 E X c y H E v M Z 14 8 pin 1 index 2 1 Q ( ) 3 θ 1 7 e b p w M L detail X L p 0 2.5 5 mm scale IMENSIONS (mm are the original dimensions) UNIT 1 2 3 b p c (1) E (2) e H (1) E L L p Q v w y Z max. mm 1.1 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 1 0.75 0.50 0.4 0.3 0.2 0.13 0.1 0.72 0.38 θ o 8 o 0 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEEC JEIT SOT402-1 MO-153 EUROPEN PROJECTION ISSUE TE 99-12-27 03-02-18 Fig 14. Package outline SOT402-1 (TSSOP14) Product data sheet Rev. 03 4 pril 2005 20 of 24

HVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2.5 x 3 x 0.85 mm SOT762-1 B E 1 c terminal 1 index area detail X terminal 1 index area e 1 e b 2 6 v M w M C C B y 1 C C y L 1 7 E h e 14 8 13 9 h X 0 2.5 5 mm scale IMENSIONS (mm are the original dimensions) UNIT (1) max. 1 b c (1) h E (1) E h e e 1 L v w y y 1 mm 1 0.05 0.00 0.30 0.18 0.2 3.1 2.9 1.65 1.35 2.6 2.4 1.15 0.85 0.5 2 0.5 0.3 0.1 0.05 0.05 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEEC JEIT SOT762-1 - - - MO-241 - - - EUROPEN PROJECTION ISSUE TE 02-10-17 03-01-27 Fig 15. Package outline SOT762-1 (HVQFN14) Product data sheet Rev. 03 4 pril 2005 21 of 24

13. Revision history Table 11: Revision history ocument I Release date ata sheet status Change notice oc. number Supersedes 74HC_HCT164_3 20050404 Product data sheet - 9397 750 14693 74HC_HCT164_ CNV_2 Modifications: The format of this data sheet is redesigned to comply with the current presentation and information standard of Philips Semiconductors dded SOT762-1 and Ordering information 74HC_HCT164_CNV_2 19901201 Product specification - - - Product data sheet Rev. 03 4 pril 2005 22 of 24

14. ata sheet status Level ata sheet status [1] Product status [2] [3] efinition I Objective data evelopment This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CN). [1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. [3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 15. efinitions 16. isclaimers Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the bsolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. pplication information pplications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Life support These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status Production ), relevant changes will be communicated via a Customer Product/Process Change Notification (CN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 17. Contact information For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com Product data sheet Rev. 03 4 pril 2005 23 of 24

18. Contents 1 General description...................... 1 2 Features............................... 1 3 Quick reference data..................... 1 4 Ordering information..................... 2 5 Functional diagram...................... 3 6 Pinning information...................... 4 6.1 Pinning............................... 4 6.2 Pin description......................... 4 7 Functional description................... 5 7.1 Function selection....................... 5 8 Limiting values.......................... 5 9 Recommended operating conditions........ 6 10 Static characteristics..................... 6 11 ynamic characteristics................. 10 12 Package outline........................ 17 13 Revision history........................ 22 14 ata sheet status....................... 23 15 efinitions............................ 23 16 isclaimers............................ 23 17 Contact information.................... 23 Koninklijke Philips Electronics N.V. 2005 ll rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. ate of release: 4 pril 2005 ocument number: 9397 750 14693 Published in The Netherlands