CD74HC165, CD74HCT165

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Data sheet acquired from Harris Semiconductor SCHS156 February 1998 CD74HC165, CD74HCT165 High Speed CMOS Logic 8-Bit Parallel-In/Serial-Out Shift Register Features [ /Title (CD74H C165, CD74H CT165) /Subject High peed MOS ogic 8- it Parllel- Buffered Inputs Asynchronous Parallel Load Complementary Outputs Typical f MAX = 60MHz at V CC = 5V, C L = 15pF, T A = 25 o C Fanout (Over Temperature Range) - Standard Outputs............... 10 LSTTL Loads - Bus Driver Outputs............. 15 LSTTL Loads Wide Operating Temperature Range... -55 o C to 125 o C Balanced Propagation Delay and Transition Times Significant Power Reduction Compared to LSTTL Logic ICs HC Types - 2V to 6V Operation - High Noise Immunity: N IL = 30%, N IH = 30% of V CC at V CC = 5V HCT Types - 4.5V to 5.5V Operation - Direct LSTTL Input Logic Compatibility, V IL = 0.8V (Max), V IH = 2V (Min) - CMOS Input Compatibility, I l 1µA at V OL, V OH Pinout CD74HC165, CD74HCT165 (PDIP, SOIC) TOP VIEW 1 16 V CC CP 2 15 CE D4 3 14 D3 D5 4 13 D2 D6 5 12 D1 D7 6 11 D0 Q 7 7 10 DS 8 9 Q 7 CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright Harris Corporation 1998 1 File Number 1672.1

Description The Harris CD74HC165 and CD74HCT165 are 8-bit parallel or serial-in shift registers with complementary serial outputs (Q 7 and Q 7 ) available from the last stage. When the parallel load () input is LOW, parallel data from the D0 to D7 inputs are loaded into the register asynchronously. When the is HIGH, data enters the register serially at the DS input and shifts one place to the right (Q 0 Q 1 Q 2, etc.) with each positive-going clock transition. This feature allow parallel-to-serial converter expansion by typing the Q 7 output to the DS input of the succeeding device. For predictable operation the LOW-to-HIGH transition of CE should only take place while CP is HIGH. Also, CP an d CE should be LOW before the LOW-to-HIGH transition of to prevent shifting the data when goes HIGH. Ordering Information PART NUMBER TEMP. RANGE ( o C) PACKAGE PKG. NO. CD74HC165E -55 to 125 16 Ld PDIP E16.3 CD74HCT165E -55 to 125 16 Ld PDIP E16.3 CD74HC165M -55 to 125 16 Ld SOIC M16.15 CD74HCT165M -55 to 125 16 Ld SOIC M16.15 NOTES: 1. When ordering, use the entire part number. Add the suffix 96 to obtain the variant in the tape and reel. 2. Wafer and die is available which meets all electrical specifications. Please contact your local sales office or Harris customer service for ordering information. Functional Diagram PARALLEL DATA INPUTS 11 D0 12 D1 13 D2 14 D3 3 D4 D5 D6 4 5 6 D7 10 DS 9 Q 7 7 Q 7 SERIAL OUTPUTS CE 1 15 2 = 8 VCC = 16 CP TRUTH TABLE INPUTS Q n REGISTER OUTPUTS OPERATING MODE CE CP DS D0 - D7 Q 0 Q 1 - Q 6 Q 7 Q 7 Parallel Load L X X X L L L-L L H L X X X H H H-H H L Serial Shift H L l X L q 0 - q 5 q 6 q 6 H L h X H q 0 - q 5 q 6 q 6 Hold Do Nothing H H X X X q 0 q 1 - q 6 q 7 q 7 2

TRUTH TABLE INPUTS Q n REGISTER OUTPUTS OPERATING MODE CE CP DS D0 - D7 Q 0 Q 1 - Q 6 Q 7 Q 7 NOTE: H = High Level h = High Level One Set-up Time Prior To The Low-to-high Clock Transition l = Low Level One Set-up Time Prior To The Low-to-high Clock Transition L = Low Level X = Don t Care = Transition from Low to High Level q n = Lower Case Letters Indicate The State Of the Reference Output Clock Transition 3

Absolute Maximum Ratings DC Supply, V CC........................ -0.5V to 7V DC Input Diode Current, I IK For V I < -0.5V or V I > V CC + 0.5V......................±20mA DC Output Diode Current, I OK For V O < -0.5V or V O > V CC + 0.5V....................±20mA DC Drain Current per Output, IO For V O < -0.5V V O > V CC + 0.5V......................±25mA DC Output Source or Sink Current per Output Pin, I O For V O > -0.5V or V O < V CC + 0.5V....................±25mA DC V CC or Ground Current, I CC or I..................±50mA Thermal Information Thermal Resistance (Typical, Note 3) θ JA ( o C/W) PDIP Package............................. 90 SOIC Package............................. 115 Maximum Junction Temperature....................... 150 o C Maximum Storage Temperature Range..........-65 o C to 150 o C Maximum Lead Temperature (Soldering 10s)............. 300 o C (SOIC - Lead Tips Only) Operating Conditions Temperature Range (T A )..................... -55 o C to 125 o C Supply Range, V CC HC Types.....................................2V to 6V HCT Types.................................4.5V to 5.5V DC Input or Output, V I, V O................. 0V to V CC Input Rise and Fall Time 2V...................................... 1000ns (Max) 4.5V...................................... 500ns (Max) 6V....................................... 400ns (Max) CAUTION: Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 3. θ JA is measured with the component mounted on an evaluation PC board in free air. DC Electrical Specifications TEST CONDITIONS PARAMETER HC TYPES SYMBOL V I (V) I O (ma) V CC (V) MIN TYP MAX MIN MAX MIN MAX High Level Input V IH - - 2 1.5 - - 1.5-1.5 - V 4.5 3.15 - - 3.15-3.15 - V 6 4.2 - - 4.2-4.2 - V Low Level Input V IL - - 2 - - 0.5-0.5-0.5 V 4.5 - - 1.35-1.35-1.35 V High Level Output CMOS Loads High Level Output TTL Loads Low Level Output CMOS Loads Low Level Output TTL Loads V OH V OL 6 - - 1.8-1.8-1.8 V V IH or -0.02 2 1.9 - - 1.9-1.9 - V V IL -0.02 4.5 4.4 - - 4.4-4.4 - V -0.02 6 5.9 - - 5.9-5.9 - V -4 4.5 3.98 - - 3.84-3.7 - V -5.2 6 5.48 - - 5.34-5.2 - V V IH or 0.02 2 - - 0.1-0.1-0.1 V V IL 0.02 4.5 - - 0.1-0.1-0.1 V 0.02 6 - - 0.1-0.1-0.1 V 4 4.5 - - 0.26-0.33-0.4 V 5.2 6 - - 0.26-0.33-0.4 V Input Leakage Current I I V CC or - 6 - - ±0.1 - ±1 - ±1 µa 4

DC Electrical Specifications (Continued) PARAMETER Quiescent Device Current HCT TYPES High Level Input Low Level Input High Level Output CMOS Loads High Level Output TTL Loads Low Level Output CMOS Loads Low Level Output TTL Loads Input Leakage Current Quiescent Device Current Additional Quiescent Device Current Per Input Pin: 1 Unit Load (Note 4) SYMBOL I CC V CC or V IH - - 4.5 to 5.5 V IL - - 4.5 to 5.5 V OH V OL I I I CC I CC (Note 4) TEST CONDITIONS V I (V) I O (ma) V CC (V) MIN TYP MAX MIN MAX MIN MAX 0 6 - - 8-80 - 160 µa 2 - - 2-2 - V - - 0.8-0.8-0.8 V V IH or -0.02 4.5 4.4 - - 4.4-4.4 - V V IL -4 4.5 3.98 - - 3.84-3.7 - V V IH or 0.02 4.5 - - 0.1-0.1-0.1 V V IL V CC to V CC or V CC -2.1 4 4.5 - - 0.26-0.33-0.4 V 0 5.5 - - ±0.1 - ±1 - ±1 µa 0 5.5 - - 8-80 - 160 µa - 4.5 to 5.5 NOTE: 4. For dual-supply systems theoretical worst case (V I = 2.4V, V CC = 5.5V) specification is 1.8mA. - 100 360-450 - 490 µa HCT Input Loading Table INPUT UNIT LOADS DS, D0 to D7 0.35 CP, 0.65 NOTE: Unit Load is I CC limit specified in DC Electrical Specifications table, e.g. 360µA max at 25 o C. Prerequisite For Switching Specifications PARAMETER SYMBOL V CC (V) MIN MAX MIN MAX MIN MAX HC TYPES CP Pulse Width t WL, t WH 2 80-100 - 120 - ns 4.5 16-20 - 24 - ns 5

Prerequisite For Switching Specifications (Continued) PARAMETER SYMBOL V CC (V) MIN MAX MIN MAX MIN MAX Pulse Width t WL 2 80-100 - 120 - ns 4.5 16-20 - 24 - ns Set-up Time t SU 2 80-100 - 120 - ns DS to CP 4.5 16-20 - 24 - ns CE to CP t SU(L) 2 80-100 - 120 - ns 4.5 16-20 - 24 - ns D0-D7 to t SU 2 80-100 - 120 - ns 4.5 16-20 - 24 - ns Hold Time t H 2 35-45 - 55 - ns DS to CP or CE 4.5 7-9 - 11 - ns 6 6-8 - 9 - ns CE to CP t H 2 0-0 - 0 - ns 4.5 0-0 - 0 - ns 6 0-0 - 0 - ns Recovery Time t REC 2 100-125 - 150 - ns to CP 4.5 20-25 - 30 - ns 6 17-21 - 26 - ns Maximum Clock Pulse Frequency f MAX 2 6-5 - 4 - MHz 4.5 30-24 - 20 - MHz 6 35-28 - 24 - MHz HCT TYPES CP Pulse Width t WL, t WH 4.5 18-23 - 27 - ns Pulse Width t WL 4.5 20-25 - 30 - ns Set-up Time DS to CP t SU 4.5 20-25 - 30 - ns CE to CP t SU(L) 4.5 20-25 - 30 - ns D0-D7 to t SU 6 20-25 - 30 - ns Hold Time DS to CP or CE t H 4.5 7-9 - 11 - ns CE to CP t S,t H 4.5 0-0 - 0 - ns Recovery Time to CP Maximum Clock Pulse Frequency t REC 4.5 20-25 - 30 - ns f MAX 4.5 27-22 - 18 - MHz 6

Switching Specifications Input t r, t f = 6ns PARAMETER SYMBOL TEST CONDITIONS V CC (V) TYP MAX MAX MAX HC TYPES Propagation Delay t H, t PHL C L = 50pF 2-165 205 250 ns CP or CE to Q 7 or Q 7 4.5-33 41 50 ns C L = 15pF 5 13 - - - ns C L = 50pF 6-28 35 43 ns to Q 7 or Q 7 t H, t PHL C L = 50pF 2-175 220 265 ns 4.5-35 44 53 ns C L = 15pF 5 14 - - - ns C L = 50pF 6-30 37 45 ns D7 to Q 7 or Q 7 t H, t PHL C L = 50pF 2-150 190 225 ns 4.5-30 38 45 ns C L = 15pF 5 12 - - - ns C L = 50pF 6-26 33 38 ns Output Transition Times t TLH, t THL C L = 50pF 2-75 95 110 ns 4.5-15 19 22 ns 6-13 16 19 ns Input Capacitance C IN - - - 10 10 10 pf Power Dissipation Capacitance (Notes 5, 6) C PD - 5 17 - - - pf HCT TYPES Propagation Delay t H, t PHL C L = 50pF 4.5-40 50 60 ns CP or CE to Q 7 or Q 7 C L = 15pF 5 17 - - - ns to Q 7 or Q 7 t H, t PHL C L = 50pF 4.5-40 50 60 ns C L = 15pF 5 17 - - - ns D7 to Q 7 or Q 7 t H, t PHL C L = 50pF 4.5-35 44 53 ns C L = 15pF 5 14 - - - ns Output Transition Times t TLH, t THL C L = 50pF 4.5-15 19 22 ns Input Capacitance C IN C L = 50pF - - 10 10 10 pf Power Dissipation Capacitance (Notes 5, 6) C PD - 5 24 - - pf NOTES: 5. C PD is used to determine the dynamic power consumption, per package. 6. P D =V 2 CC fi + (C L V 2 CC +fo ) where f i = Input Frequency, f O = Output Frequency, C L = Output Load Capacitance, V CC = Supply. 7

Test Circuits and Waveforms t r t f CP OR CE 90% 10% Q 7 OR Q 7 t TLH 90% 10% t W 1/f MAX t PHL th tthl Q 7 OR Q 7 t W t PHL t H FIGURE 3. SERIAL-SHIFT MODE FIGURE 4. PARALLEL-LOAD MODE INPUT D7 Q 7 OR Q 7 t r t H t THL 90% 10% 90% 10% t f t PHL t TLH INPUTS D0-D7 t SU VALID t H FIGURE 5. PARALLEL-LOAD MODE FIGURE 6. PARALLEL-LOAD MODE INPUTS DS CP OR CE t SU VALID t H CP OR CE t REC FIGURE 7. SERIAL-SHIFT MODE FIGURE 8. SERIAL-SHIFT MODE CE INHIBITED CP CE t SU t SU (L) t SU CP t SU (L) INHIBITED FIGURE 9. SERIAL-SHIFT, CLOCK-INHIBIT MODE 8

IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. CERTAIN APICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE ( CRITICAL APICATIONS ). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER S RISK. In order to minimize risks associated with the customer s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI s publication of information regarding any third party s products or services does not constitute TI s approval, warranty or endorsement thereof. Copyright 1998, Texas Instruments Incorporated