The effect of point defects in zircon

Similar documents
Defects in Semiconductors

Resonant photo-ionization of point defects in HfO 2 thin films observed by second-harmonic generation.

Foster, Adam; Lopez Gejo, F.; Shluger, A. L.; Nieminen, Risto Vacancy and interstitial defects in hafnia

Structural and dielectric properties of amorphous ZrO 2 and HfO 2

American Mineralogist, Volume 88, pages , 2003

6. Computational Design of Energy-related Materials

Outline. Introduction: graphene. Adsorption on graphene: - Chemisorption - Physisorption. Summary

ATOMIC-SCALE THEORY OF RADIATION-INDUCED PHENOMENA

Molecular dynamics modeling of irradiation damage in highly coordinated mineral structures

arxiv:cond-mat/ v1 [cond-mat.mtrl-sci] 4 Oct 2004

J. Price, 1,2 Y. Q. An, 1 M. C. Downer 1 1 The university of Texas at Austin, Department of Physics, Austin, TX

Electrons, Holes, and Defect ionization

NITROGEN CONTAINING ULTRA THIN SiO 2 FILMS ON Si OBTAINED BY ION IMPLANTATION

Classification of Solids

Joint ICTP-IAEA Workshop on Physics of Radiation Effect and its Simulation for Non-Metallic Condensed Matter.

Electronic structure of transition metal high-k dielectrics: interfacial band offset energies for microelectronic devices

Chapter 6 ELECTRICAL CONDUCTIVITY ANALYSIS

Atomistic Simulation of Nuclear Materials

Electronic Supplementary Information

Development of Radiation Hard Si Detectors

Semiconductor Detectors

The role of nitrogen-related defects in high-k dielectric oxides: Density-functional studies

Gate Carrier Injection and NC-Non- Volatile Memories

Displacement Damage Effects in Single-Event Gate Rupture

ESE 570: Digital Integrated Circuits and VLSI Fundamentals

Theory of Hydrogen-Related Levels in Semiconductors and Oxides

How the nature of the chemical bond governs resistance to amorphization by radiation damage

ESE 570: Digital Integrated Circuits and VLSI Fundamentals

Simulations of Li ion diffusion in the electrolyte material Li 3 PO 4

Spectroscopic studies ofthe electrical structure oftransition metal and rare earth complex oxides

Radiation Effects in Emerging Materials Overview Leonard C. Feldman

Chap. 11 Semiconductor Diodes

Surfaces, Interfaces, and Layered Devices

23.0 Review Introduction

Challenges and Opportunities. Prof. J. Raynien Kwo 年

Radiation Damage Modeling of Fused Silica in Fusion Systems

Review Energy Bands Carrier Density & Mobility Carrier Transport Generation and Recombination

Graphene Annealing: How Clean Can It Be?

How a single defect can affect silicon nano-devices. Ted Thorbeck

! CMOS Process Enhancements. ! Semiconductor Physics. " Band gaps. " Field Effects. ! MOS Physics. " Cut-off. " Depletion.

! CMOS Process Enhancements. ! Semiconductor Physics. " Band gaps. " Field Effects. ! MOS Physics. " Cut-off. " Depletion.

Hussein Ayedh. PhD Studet Department of Physics

RADIATION EFFECTS AND DAMAGE

Electrically active defects in semiconductors induced by radiation

L ECE 4211 UConn F. Jain Scaling Laws for NanoFETs Chapter 10 Logic Gate Scaling

Electrical Properties

Electrical Conduction in Ceramic Materials 1 Ref: Barsoum, Fundamentals of Ceramics, Ch7, McGraw-Hill, 2000

MSE 310/ECE 340: Electrical Properties of Materials Fall 2014 Department of Materials Science and Engineering Boise State University

Defect Ch em Ch istry 1

Chapter 4: Bonding in Solids and Electronic Properties. Free electron theory

in this web service Cambridge University Press

Electrostatic charging and redox effects in oxide heterostructures

Applications of near-infrared FT-Raman spectroscopy in metamict and annealed zircon: oxidation state of U ions

Topics to discuss...

Materials and Devices in Electrical Engineering

Novel High-Efficiency Crystalline-Si-Based Compound. Heterojunction Solar Cells: HCT (Heterojunction with Compound. Thin-layer)

Solid State Device Fundamentals

André Schleife Department of Materials Science and Engineering

Quantum Mechanical Simulation for Ultra-thin High-k Gate Dielectrics Metal Oxide Semiconductor Field Effect Transistors

Stretching the Barriers An analysis of MOSFET Scaling. Presenters (in order) Zeinab Mousavi Stephanie Teich-McGoldrick Aseem Jain Jaspreet Wadhwa

CONDUCTIVITY MECHANISMS AND BREAKDOWN CHARACTERISTICS OF NIOBIUM OXIDE CAPACITORS

Chapter 1. Ionizing radiation effects on MOS devices and ICs

Supplementary Information

Defect structure and oxygen diffusion in PZT ceramics

Chemistry Instrumental Analysis Lecture 8. Chem 4631

Fast Monte-Carlo Simulation of Ion Implantation. Binary Collision Approximation Implementation within ATHENA

Excitations and Interactions

Electrical material properties

Experience with Moving from Dpa to Changes in Materials Properties

EECS143 Microfabrication Technology

TOTAL IONIZING DOSE RADIATION EFFECTS AND NEGATIVE BIAS TEMPERATURE INSTABILITY ON SiGe pmos DEVICES

Journal of Electron Devices, Vol. 18, 2013, pp JED [ISSN: ]

Chris G. Van de Walle Materials Department, UCSB

Energetic particles and their detection in situ (particle detectors) Part II. George Gloeckler

Defect Formation in 18 MeV Electron Irradiated MOS Structures

How to run SIESTA. Introduction to input & output files

Surface passivation and high-κ dielectrics. integration of Ge-based FETs: First-principles. calculations and in situ characterizations YANG MING

characterization in solids

Comparisons of DFT-MD, TB- MD and classical MD calculations of radiation damage and plasmawallinteractions

Semiconductor-Detectors

Crystal Properties. MS415 Lec. 2. High performance, high current. ZnO. GaN

UNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences. EECS 130 Professor Ali Javey Fall 2006

INTRODUCTION TO THE DEFECT STATE IN MATERIALS

Ab initio study of Mn doped BN nanosheets Tudor Luca Mitran

Introduction to Density Functional Theory with Applications to Graphene Branislav K. Nikolić

ELECTRONIC STRUCTURE OF Pu 3+ AND Pu 4+ IMPURITY CENTERS IN ZIRCON INTRODUCTION

VERY SHORT ANSWER TYPE QUESTIONS (1 Mark)

This article has been accepted and published on J-STAGE in advance of copyediting. Content is final as presented.

First principles simulations of materials and processes in photocatalysis

ESE370: Circuit-Level Modeling, Design, and Optimization for Digital Systems

Characterization of Charge Trapping and Dielectric Breakdown of HfAlOx/SiON Dielectric Gate Stack

Defects and diffusion in metal oxides: Challenges for first-principles modelling

4. Interpenetrating simple cubic

Density-functional calculations of defect formation energies using the supercell method: Brillouin-zone sampling

Electronics with 2D Crystals: Scaling extender, or harbinger of new functions?

Two-dimensional lattice

EE143 Fall 2016 Microfabrication Technologies. Evolution of Devices

A study of the double-acceptor level of the silicon divacancy in a proton irradiated n-channel CCD.

Luminescence Process

The aperiodic states of zircon: an ab initio molecular dynamics study

Transcription:

aterials for nuclear waste immobilization: The effect of point defects in zircon iguel Pruneda Department of Earth Sciences University of Centre for Ceramic Immobilisation

Radiation damage process α-decay process α-particle ~ 5 ev Recoil ~ 100 kev 238 U / 234 Th l It causes: Amorphisation (metamict) Swelling Cracks Leaching Zircon: model study: old natural samples

Why first principles? Atomistic description Complex structures D simulations Empirical potentials Complex chemistry Zr, Ti, Sn, Ca, La, Gd,

Swelling in zircon (ZrSiO 4 ) X-Rays Crystalline swelling: lattice parameters vs dose Total: ~20% Crystalline: ~5% anisotropic

IR, Raman and NR spectroscopies IR NR I. Farnan & E.K.H Salje, JAP 89, 2084 (2001). Zhang & E. K. H Salje, J. Phys. Condens. atter 13, 3057 (2001)

Localized defects in radiation-damaged zircon (Rios et. al. Acta Cryst. (2000) B56, 947) X-ray diffraction experiments in natural samples. (1.8x10 18 α-decay/g) SiO4 tetrahedra remain essentially undistorted Larger anisotropic displacement parameters found for Zr and O atoms DFT calculations: Formation energies for a choice of chemical potentials High values of the formation energies for all defects, except oxygen interstitial J.-P. Crocombette, Phys. Chem. inerals 27, 138 (1999)

Our method Linear-scaling DFT based on NAOs (Numerical Atomic Orbitals) P. Ordejon, E. Artacho & J.. Soler, Phys. Rev. B 53, R10441 (1996) Born-Oppenheimer (relaxations, mol. dynamics) DFT (LDA, GGA) Pseudopotentials (norm conserving, factorised) Numerical atomic orbitals as basis (finite range) Numerical evaluation of matrix elements (3D grid) Implemented in the SIESTA program D. Sanchez-Portal, P. Ordejon, E. Artacho & J.. Soler Int. J. Quantum Chem. 65, 453 (1997)

Intrinsic point defects and volume swelling in ZrSiO 4 Radiation cascades & defect accumulation ~10 21 defects/cm 3 Si 0.2% swelling!! Tetragonal I4 1 /amd space group BCC unit cell with four formula units. Structural parameters: a, c, u, v Alternating SiO 4 tetrahedra & ZrO 8 dodecadeltahedra

Playing with the concentration of defects Supercell approach: n n n x Repetitions of the unit cell y z (Periodic super-structure of defects) 1x1x1 1x1x2 2x2x1 2x2x2 (24 atoms) (48 atoms) (96 atoms) (192 atoms) Lattice relaxation Low-concentration limit atomic relaxation only!

The catalogue of defects Interstitials: O i, Si i, Zr i Vacancies: V O, V si, V Zr Antisite defects: Zr Si & Si Zr Frenkel pairs: O FP, Si FP & Zr FP Different charge-states: 4, 3, 2, 1 + 1, + 2, + 3, + 4 0

J.. Pruneda, T. Archer, and E. Artacho to be published in PRB Possible defects: O & Si interstitials Zr Si anti-site

Swelling as a function of the concentration Almost linear behavior Considerable anisotropy Effect of disorder

Oxygen interstitial Neutral defect has a dumbbell structure similar to ZrO2.

Silicon interstitial Zr Si anti-site Local Vibrational odes IR active at 729 cm -1 (O i ) 743 cm -1 (Si i )

Simulation of NR spectra Combining methods: SIESTA+PARATEC Experiments in damaged samples Chemical shifts due to swelling?

O: -170.1 (-170) Si: -78.6 (-81.5)

Formation Energies f ( α q) = E( α, q) µ n q( µ E ) E + +, i i e V i µ Zr ( ) + µ Si + 4µ O = G f ZrSiO 4 µ µ Zr Si ( ) + 2µ O G f ZrO 2 ( ) + 2µ O G f SiO 2

The stability triangle

Formation energies for neutral defects Converged in size Values given at the point A ore stable defects: Vacancies and interstitials of O Antisites.

Properties of charged defects Negative-U behavior Gain in energy when a second electron/hole is captured. 0 2 2Oi Oi + Oi + 0 2+ 2V O VO + VO Strong ionic interaction for cation-defects (& charged FP) X 0 i + V 0 X X n i + V n+ X

Alternative gate dielectrics OSFET Device current drive is proportional to the oxide capacitance per unit area; thus, the best way to increase the drive current and thereby achieve high performance is to reduce the equivalent oxide thickness (EOT) To reduce the gate leakage current: 1. the dielectric must be physically thick 2. it must have reasonably large band offsets to Si Scaling of the gate-oxide thickness: Roadmaps vs. actual trends.

Dielectric Constants of Zr Silicates Vol. 46, 2/3, 2002 G.. Rignanese, et. al. PRL 89,117601 (2002) Vertically scaled OSFET gate stacks and junctions: How far are we likely to go? aterials such as HfO 2 and ZrO 2, having dielectric constants of about 15 and offsets of about 1.5 ev, have the potential of meeting the long-term leakage requirements. Their silicates have almost the same barrier height, nearly as high a dielectric constant, potentially lower charge levels, and much better thermal stability; thus, they may be even better candidates.

Band-Offsets In the interface, it is required a high tunneling barrier to both electrons and holes. R. Puthenkovilakam et. al. PRB 69 155329 (2004) Band alignment at ZrSiO4(001)/Si(100) interface. (No Zr d states in the gap)

Charged defects!! The dielectric cannot contain traps that would promote trapassisted tunneling or locally uncompensated charges that would degrade channel mobility. The conduction in the dielectric must be purely electronic, not ionic, and preferably by electrons only. O i O i -2

Transition Energies E α ( q / q ) = [ E ( α, q) E ( α, q )] ( q q) f f Acceptor levels for O i,v Si and V Zr that can trap electrons from the bottom of the silicon valence band. Donor level of V O can trap holes injected from silicon.

Conclusions We have studied the effect of high concentration of point defects in ZrSiO4. A roughly linear dependence between swelling and the defect concentration of periodically repeated defects was obtained. Based on experimental evidence of anisotropic lattice expansion, we have selected a set of defects as good candidates to be responsible of the swelling: O i, Si i, and Zr Si. Interstitials and vacancies of oxygen, and the antisite Zr Si are the most stable defects. There is a strong tendency towards ionization, and a negative-u behavior is observed.

Thanks to Emilio Artacho, T. D. Archer, Kostya Trachenko, artin Dove, Ian Farnan, Laurent Le Polles, Sharon Ashbrook, Jonathan Yates, Greg Lumpkin, Susana Rios, ing Zhang