Heat Transfer Characteristics of Flow Between Two Parallel Plates

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30 mm (Title Page) Heat Transfer Characteristics of Flow Between Two Parallel Plates (Three Blank Lines) by (Font size 12, Times New Roman and Centered) (Three Blank Lines) (Md. Ruhul Amin) (Font size 12, Bold, Times New Roman and Centered) 30 mm (Four Blank Lines) 25 mm A thesis submitted in partial fulfillment of the requirements for the degree of (Master of Engineering/ Master of Philosophy/ Doctor of Philosophy) in (Name of Department) (Font size 12, Times New Roman and Centered) (Three Blank Lines) University Monogram (Three Blank Lines ) Khulna University of Engineering & Technology Khulna 920300, Bangladesh (Font size 12, Times New Roman and Centered) April 2005 (Font size 12, Bold, Times New Roman and Centered) 25 mm

Declaration (Three Blank Lines ) This is to certify that the thesis work entitled " (Name of Project / Thesis Title)" has been carried out by (Name of the Candidate) in the Department of (Name of the Department), Khulna University of Engineering & Technology, Khulna, Bangladesh. The above thesis work or any part of this work has not been submitted anywhere for the award of any degree or diploma. Signature of Supervisor Signature of Candidate

Approval (Two Blank Lines) This is to certify that the thesis work submitted by (Name of the Candidate) entitled " (Name of Project / Thesis Title)" has been approved by the board of examiners for the partial fulfillment of the requirements for the degree of (Name of the Degree) in the Department of (Name of the Department), Khulna University of Engineering & Technology, Khulna, Bangladesh in April 2005. BOARD OF EXAMINERS 1. Name Designation University Chairman (Supervisor) 2. Head of the Department Name of the Department Khulna University of Engineering & Technology Member 3. 4. Name Designation University (If any) Name Designation University Member (Co-Supervisor) Member 5. Name Designation University Member 6. Name Designation University Member (External)

Title Page Declaration Certificate of Research Acknowledgement Abstract Contents List of Tables List of Figures List of Illustrations Nomenclature Contents (One Blank Lines) (Font size 12, Times New Roman and Left Indent) PAGE (Font size 12, Bold, Times New Roman and Centered) i ii iii iv v vi vii viii x xi CHAPTER I (Font size 12, Bold, Times New Roman and Centered) Introduction 1.1 1.2 1.3 1.4 1 1 2 2 3 CHAPTER II Literature Review 2.1 2.2 2.3 2.4 (Font size 12, Times New Roman and Left Indent) 5 5 15 20 22 CHAPTER III Procedure / Methodology 3.1 (Font size 12, Times New 3.2 Roman and Left Indent) 3.3 3.4 26 26 29 30 44 CHAPTER IV Results and Discussion 4.1 4.2 4.3 (Font size 12, Times New Roman and Left Indent) 52 52 54 58 CHAPTER V Conclusions and Recommendations (Font size 12, Times New Roman and Left Indent) References (Font size 12, Times New Roman and Left Indent) Appendices (Font size 12, Times New Roman and Left Indent) 70 73 76

LIST OF TABLES (One Blank Lines) Table No Description Page 2.1 Pentium Classic-Power dissipation requirements for thermal design. 2 2 3.1 Variation of temperature recorder reading with thermometer reading. 15 18 3.4 Experimental data for heat sink type A. 21 20 3.5 Experimental data for heat sink type N. 23 21 3.6 Experimental data for heat sink type B. 24 23 3.7 Experimental data for heat sink type X. 26 25 3.8 Experimental data for heat sink type D. 28 27 28 3.9 Experimental data for heat sink (Pin fin). 28 3.10 Experimental data for thermal conductivity. 28 31 3.11 Experimental data for heat sink (Constructed ). 4.1 Experimental result for heat sink type A. 30 4.2 Experimental result for heat sink type N. 31 31 32 32 32

LIST OF FIGURES (One Blank Lines) Figure No Description Page 2.1 2.2 2.3 2.4 2.5 2.6 2.7 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 Cooling fan Liquid Cooling Cooling of microprocessor with heat sink Heat sink with flat fins Heat sink with pin fins Folded fins heat sink Conduction & convection through a rectangular fin Experimental Setup (Top View) Front view of experimental setup Circuit diagram of experimental setup Calibration curve of temperature recorder Heat sink (type A) Front View (Type A) Heat sink (Type N) Front view (Type N) Heat sink (Type B) 3 4 4 5 5 5 6 13 14 14 16 17 17 19 19 21

LIST OF ILLUSTRATIONS (One Blank Lines) Illustration Description No. 2.1 Pentium Classic-Power dissipation requirements for thermal design. Page 33 2.5 Experimental setup 43 3.1 Flow Visualization of the Phenomena 44 3.9 Color Doppler view of heat sink type N 56 4.3 Color Doppler view of heat sink (Constructed ) 66 4.5 Isotherms in the test section over heat sink type A. 69 4.4 Velocity vector plot over heat sink type B 70

Nomenclature (Font size 12, Bold, Times New Roman and Left Indent) (Two Blank Lines) C p Co-efficient of Pressure, (P 2 - P a ) pv j 2 d Jet diameter in m. k Thermal conductivity of fluid (air). (W/m. -K) Nu Average Nusselt number. Re Reynolds number based on the diameter of the jet. X Non dimensional length along the jet. x Length along the jet, in m. ε Dimensionless relative roughness.

CHAPTER I (Font size 12, Bold, Times New Roman and Centered) (Two Blank Lines) Introduction (Two Blank Lines) 1.1 General (Font size 12, Bold, Times New Roman, two blank spaces after article no, and Left Indent) (One Blank Line) Electronics cooling has served as a key enabling technology in the development of advanced microelectronic systems. With the increase in heat dissipation from microelectronics devices and the reduction in overall form factors, electronics cooling becomes a more and more important element of electronic product design. Thermal management of electronic equipment has become an important issue because of increased power levels and the simultaneous miniaturization of the devices. With the advent of denser device packaging and faster intrinsic speeds, cost, reliability and size have been improved, but, unfortunately, thermal management have not followed at the same speed. As a result, it may be difficult to use the latest technology available. 1.2 Flow Phenomena (Font size 12, Bold, Times New Roman, two blank spaces after article no, and Left Indent) The surface roughness encountered in practice varies in their shape, size, distribution and arrangement, micro-scopical surface property, characteristics behavior with flow etc. The roughness formed by sand particles or stone chips is called sand roughness. Nikurades described the sand roughness from technical point of view. The average absolute protrusion height of the roughness elements or the relative roughness heights with respect to some significant length are used to describe such roughness. 1.2.1 Types of Flow (Font size 12, Bold, Times New Roman, two blank spaces after article no, and Left Indent) 1. Axial Flow: Depending on the ratio of the height of the roughness ribs and pitch, such roughness can be divided into D-type and K-type roughness. When the error in the origin is proportional to the height of the roughness elements then the roughness is called K-type or sand grain roughness.

2. Radial Flow: For a D-type roughness the error in origin is a linear function of the distance in the downstream direction. For specific engineering purposes the roughness elements for different geometrical shape are sometimes used, their characteristic length defines these. Another type of roughness termed as tuft roughness are also sometimes encountered. The examples of these types of roughness are grassy lands, green bushes, cornfields, and green mosses grown in the ship hull. Table 3.1: The value of different variables published by other investigator's are shown Sl. No. Velocity Temperature Altitude Pressure m/sec o C m Kg/cm 2 1 2 3 4 0.25 Co-efficient of pressure, Cp 0.2 0.15 0.1 0.05 = Smooth = 0.01371 = 0.01435 = 0.01581 = 0.01613 0 1.0 3.0 5.0 7.0 9.0 11.0 13.0 15.0 17.0 Tick Marks Length, X 12 Font, Times New Roman Figure 4.1: Distribution co-efficient of pressure along axial locations varies with surface roughness at a particular flow situation.

REFERENCES (Font size 12, Bold, Times New Roman and Centered) (Two Blank Lines) 1 Djilali, N. and Grath store I.S., 1991, Turbulent Flow Around A bluff rectangular plate, Part 1. Experimental investigation. ASME Journal of fluid Engineering, Vol. 113, pp.51-59. 2 Sam, R.G, lessman R.C and Test, F.L.,1979, An experimental study of fluid Engineering, Vol. 101, 443-448. 3 Test, F.T an Lessman, R.C, 1980, An Experimental study of heat transfer during forced convection over Rectangular Body. ASMF Journal of HEAT TRANSFER, Vol. 106, pp. 276-283. 4 Ota. T. and Ita saka, M., 1976, A separated and Reattached flow on A blunt flat plate, ASME Journal of fluid Engineering, Vol. 98, pp. 79-86. 5 Md. Khorshed Alam and Mostafizur Rahrnan Khan, 2000, Measurement of Temperature Distribution over a wedge in uniform flow, undergraduate Project, Dept. of Mechanical Engineering, KUET. 6. V. L. Streeter, 1975, "Fluid Mechanics", Chap 9, pp 234, MacGraw Hill, 3rd. Ed. For Illustrations same style as Figure should be adopted and 1.5 line spacing should be used for all text. The cover page will be color and laminated. Cover page will be same as title page but title in cover page will be in capital letter with golden color. The color for cover page is, 1. For M.Sc. Engg. 2. M. Phil 3. Ph. D.