Lecture 22 Field-Effect Devices: The MOS Capacitor

Similar documents
ESE 570: Digital Integrated Circuits and VLSI Fundamentals

ESE 570: Digital Integrated Circuits and VLSI Fundamentals

MOS Capacitor MOSFET Devices. MOSFET s. INEL Solid State Electronics. Manuel Toledo Quiñones. ECE Dept. UPRM.

Lecture Outline. ESE 570: Digital Integrated Circuits and VLSI Fundamentals. Review: MOSFET N-Type, P-Type. Semiconductor Physics.

Semiconductor Devices. C. Hu: Modern Semiconductor Devices for Integrated Circuits Chapter 5

! CMOS Process Enhancements. ! Semiconductor Physics. " Band gaps. " Field Effects. ! MOS Physics. " Cut-off. " Depletion.

Electrical Characteristics of MOS Devices

ESE 570: Digital Integrated Circuits and VLSI Fundamentals

Lecture 7 PN Junction and MOS Electrostatics(IV) Metal Oxide Semiconductor Structure (contd.)

! CMOS Process Enhancements. ! Semiconductor Physics. " Band gaps. " Field Effects. ! MOS Physics. " Cut-off. " Depletion.

Lecture 2. Introduction to semiconductors Structures and characteristics in semiconductors

ECE-305: Fall 2017 Metal Oxide Semiconductor Devices

ECE 340 Lecture 39 : MOS Capacitor II

ECE 305 Exam 5 SOLUTIONS: Spring 2015 April 17, 2015 Mark Lundstrom Purdue University

Class 05: Device Physics II

Lecture 8 PN Junction and MOS Electrostatics (V) Electrostatics of Metal Oxide Semiconductor Structure (cont.) October 4, 2005

Lecture 2. Introduction to semiconductors Structures and characteristics in semiconductors

MOS Capacitors ECE 2204

EECS130 Integrated Circuit Devices

Lecture 6 PN Junction and MOS Electrostatics(III) Metal-Oxide-Semiconductor Structure

Section 12: Intro to Devices

Lecture 12: MOS Capacitors, transistors. Context

ESE 570 MOS TRANSISTOR THEORY Part 1. Kenneth R. Laker, University of Pennsylvania, updated 5Feb15

Fundamentals of the Metal Oxide Semiconductor Field-Effect Transistor

Lecture 2. Introduction to semiconductors Structures and characteristics in semiconductors. Fabrication of semiconductor sensor

Week 3, Lectures 6-8, Jan 29 Feb 2, 2001

Lecture 04 Review of MOSFET

an introduction to Semiconductor Devices

EE105 - Spring 2007 Microelectronic Devices and Circuits. Structure and Symbol of MOSFET. MOS Capacitor. Metal-Oxide-Semiconductor (MOS) Capacitor

Lecture 22 - The Si surface and the Metal-Oxide-Semiconductor Structure (cont.) April 2, 2007

ESE370: Circuit-Level Modeling, Design, and Optimization for Digital Systems

ECE606: Solid State Devices Lecture 22 MOScap Frequency Response MOSFET I-V Characteristics

EE 560 MOS TRANSISTOR THEORY

Energy Bands & Carrier Densities

Lecture 7 MOS Capacitor

SECTION: Circle one: Alam Lundstrom. ECE 305 Exam 5 SOLUTIONS: Spring 2016 April 18, 2016 M. A. Alam and M.S. Lundstrom Purdue University

FIELD-EFFECT TRANSISTORS

Lecture 6: 2D FET Electrostatics

Lecture 7 - PN Junction and MOS Electrostatics (IV) Electrostatics of Metal-Oxide-Semiconductor Structure. September 29, 2005

MOS CAPACITOR AND MOSFET

Lecture 3: CMOS Transistor Theory

MOS electrostatic: Quantitative analysis

Lecture 15 OUTLINE. MOSFET structure & operation (qualitative) Review of electrostatics The (N)MOS capacitor

Lecture 12: MOSFET Devices

! Previously: simple models (0 and 1 st order) " Comfortable with basic functions and circuits. ! This week and next (4 lectures)

UNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences. EECS 130 Professor Ali Javey Fall 2006

CMPEN 411 VLSI Digital Circuits. Lecture 03: MOS Transistor

MSE 310/ECE 340: Electrical Properties of Materials Fall 2014 Department of Materials Science and Engineering Boise State University

Lecture 15 OUTLINE. MOSFET structure & operation (qualitative) Review of electrostatics The (N)MOS capacitor

ESE370: Circuit-Level Modeling, Design, and Optimization for Digital Systems

Semiconductor Physics Problems 2015

6.012 Electronic Devices and Circuits

The Gradual Channel Approximation for the MOSFET:

Extensive reading materials on reserve, including

Lecture 20: Semiconductor Structures Kittel Ch 17, p , extra material in the class notes

Semiconductor Integrated Process Design (MS 635)

Part 4: Heterojunctions - MOS Devices. MOSFET Current Voltage Characteristics

Section 12: Intro to Devices

ESE 570: Digital Integrated Circuits and VLSI Fundamentals

ESE370: Circuit-Level Modeling, Design, and Optimization for Digital Systems. Today MOS MOS. Capacitor. Idea

! PN Junction. ! MOS Transistor Topology. ! Threshold. ! Operating Regions. " Resistive. " Saturation. " Subthreshold (next class)

Transistors - a primer

Dept. of Materials Science and Engineering. Electrical Properties Of Materials

Long Channel MOS Transistors

ECE 442. Spring, Lecture -2

Lecture 11: MOS Transistor

ECE 342 Electronic Circuits. Lecture 6 MOS Transistors

Choice of V t and Gate Doping Type

Scaling Issues in Planar FET: Dual Gate FET and FinFETs

MOSFET: Introduction

ECE-305: Fall 2017 MOS Capacitors and Transistors

Final Examination EE 130 December 16, 1997 Time allotted: 180 minutes

For the following statements, mark ( ) for true statement and (X) for wrong statement and correct it.

MENA9510 characterization course: Capacitance-voltage (CV) measurements

! Previously: simple models (0 and 1 st order) " Comfortable with basic functions and circuits. ! This week and next (4 lectures)

ECEN 3320 Semiconductor Devices Final exam - Sunday December 17, 2000

Lecture 23 - The Si surface and the Metal-Oxide-Semiconductor Structure (cont.) April 4, 2007

This is the 15th lecture of this course in which we begin a new topic, Excess Carriers. This topic will be covered in two lectures.

The Devices: MOS Transistors

Thermionic Emission Theory

Semiconductor Junctions

EE 3329 Electronic Devices Syllabus ( Extended Play )

1st Year-Computer Communication Engineering-RUC. 4- P-N Junction

ESE370: Circuit-Level Modeling, Design, and Optimization for Digital Systems. Today. Refinement. Last Time. No Field. Body Contact

Lecture 1. OUTLINE Basic Semiconductor Physics. Reading: Chapter 2.1. Semiconductors Intrinsic (undoped) silicon Doping Carrier concentrations

Integrated Circuits & Systems

6.152J / 3.155J Spring 05 Lecture 08-- IC Lab Testing. IC Lab Testing. Outline. Structures to be Characterized. Sheet Resistance, N-square Resistor

Department of Electrical and Computer Engineering, Cornell University. ECE 3150: Microelectronics. Spring Exam 1 ` March 22, 2018

CHAPTER 5 EFFECT OF GATE ELECTRODE WORK FUNCTION VARIATION ON DC AND AC PARAMETERS IN CONVENTIONAL AND JUNCTIONLESS FINFETS

Department of Electrical and Computer Engineering, Cornell University. ECE 3150: Microelectronics. Spring Due on March 01, 2018 at 7:00 PM

Classification of Solids

Chapter 2 MOS Transistor theory

Content. MIS Capacitor. Accumulation Depletion Inversion MOS CAPACITOR. A Cantoni Digital Switching

MOS Transistor I-V Characteristics and Parasitics

Electronic Circuits 1. Transistor Devices. Contents BJT and FET Characteristics Operations. Prof. C.K. Tse: Transistor devices

GaN based transistors

The Intrinsic Silicon

Charge Storage in the MOS Structure. The Inverted MOS Capacitor (V GB > V Tn )

Electrochemistry of Semiconductors

ECE321 Electronics I

Transcription:

Lecture 22 Field-Effect Devices: The MOS Capacitor F. Cerrina Electrical and Computer Engineering University of Wisconsin Madison Click here for link to F.C. homepage Spring 1999 0 Madison, 1999-II

Topics Quantitative relations between gate voltage V G and MOS carriers Focus is on semiconductor potential 1 Madison, 1999-II

MOS Capacitor The field effect is implemented using: A gate electrode A silicon oxide dielectric insulator A semiconductor electrode A voltage applied on the gate controls the charge in the semiconductor The voltage is distributed part on the oxide and part on the semiconductor (series capacitors) 2 Madison, 1999-II

MOS Band Structure In equilibrium E F must be constant The gap of the oxide is much larger than that of the semiconductor Flat bands model: at V G = 0 there is no band bending What happens if we apply a voltage? No current flowing: E F remains defined Difference between E F is equal to qv G Define Surface Potential ψ S 3 Madison, 1999-II

Charging of the MOS capacitor The bias voltage shifts up and down the bulk E i. At the surface the band edges cannot move. Band bending makes the bands stretchable Assuming flat bands for V G =0,n-type material (Fig. 16.6) V G = 0, nothing happens V G > 0, electrons are attracted under the gate Accumulation V G < 0, electrons are repelled, i.e., holes are attracted; bands curve upward because E F must get closer to E V, Depletion V G = V i semiconductor becomes intrinsic under the gate V G = V T semiconductor begins to reverse type, n = p. At this voltage (threshold voltage) the material becomes artificially n-type Threshold V G >V T semiconducotr is n-type, n>p, under the gate. Inversion The gate voltage controls the semiconductor polarity! Also case of n-type, Fig. 16.5 4 Madison, 1999-II

MOS Capacitor II Define bulk and surface potentials: ψ = 1 q (E i E f ) ψ s = 1 q (E i(bulk) E i (surface)) The sign must be considered carefully and is sometimes used incorrectly in books; ψ < 0 for n-type, ψ > 0 for p-type The surface potential ψ s is the change in potential from bulk to surface, while the bulk potential is the change in potential from doped to intrinsic Cfr. Fig. 16.7 5 Madison, 1999-II

MOS Band Structure As usual carrier density is defined by universal relation: At the surface we can write: n = n i e (E f E i )/kt = ni e qψ/kt E F E i (s) =E F E i (B)+E i (B) E i (s) ψ = ψ bulk + ψ s n = n i e q [ kt ( ψ bulk+ψ s ) = n i e q ] kt ψ bulk e + q kt ψ s n(surface) =n p0 e + q kt ψ s p(surface) =p p0 e q kt ψ s This relation is the central relation in the operation of the MOS 6 Madison, 1999-II

Charging of the MOS Consider a p-type bulk. Hence ψ B =(E i E f )/q > 0. We can distinguish: ψ s > 0 Accumulation of holes (bands bend up) ψ s = 0 Flat bands ψ B >ψ s > 0 Depletion (bands bend down) ψ s = ψ B Intrinsic surface (bands bend down) ψ s >ψ B Inversion (bands bend down) (-) Accumulation 0 Depletion V T Inversion (+) For ψ s =2ψ B we have the transition from depletion to inversion Consider Example 16.2 7 Madison, 1999-II

Delta-depletion Solution The main problem is how to find ψ s (V G ) Voltage is divided between depletion layer and oxide: V G = ψ S + V oxide Q metal = Q Semiconductor V ox C o = C S ψ S V ox = ψ s C S C o W (ψ) = 2Ks ɛ 0 qn A ψ S, C(ψ S )= K Sɛ 0 W (ψ) V G = ψ S + K S K o x o 2qNA K S ɛ 0 ψ s Given V G it is easy to compute ψ S 8 Madison, 1999-II

Charge stages Before Inversion: In this stage the gate voltage V G directly affects the width of the depletion layer: No channel of free charge Lateral conduction not possible Variable depletion layer After Inversion: At the surface a thin layer of free carriers is formed. Further increase in V G increase the amount of free carriers rather than the depletion layer width Channel of free charge Lateral conduction possible Fixed width of the depletion layer 9 Madison, 1999-II

Conclusions The band structure of the MOS capacitor is controlled by the gate voltage Carrier concentration determined by surface potential 10 Madison, 1999-II