MULTILAYER CERAMIC CAPACITORS High Q / Low ESR Series (HH) 0201 to 0805 Sizes NP0 Dielectric Halogen Free & RoHS Compliance *Contents in this sheet are subject to change without prior notice. Page 1 of 11 ASC_ HQ_Low ESR_(HH)_006U_AS Oct. 2017
1. INTRODUCTION MLCC consists of a conducting material and electrodes. To manufacture a chip-type SMT and achieve miniaturization, high density and high efficiency, ceramic condensers are used. WTC HH series MLCC is used at high frequencies generally have a small temperature coefficient of capacitance, typical within the ±30ppm/ C required for NP0 (C0G) classification and have excellent conductivity internal electrode. Thus, WTC HH series MLCC will be with the feature of low ESR and high Q characteristics. 2. FEATURES a. High Q and low ESR performance at high frequency. b. Quality improvement of telephone calls for low power loss and better performance. 3. APPLICATIONS a. Mobile telecommunication: Mobile phone, WLAN. b. RF module: Power amplifier, VCO. c. Tuners. 4. HOW TO ORDER HH 15 N 100 G 500 C T Series Size Dielectric Capacitance Tolerance Rated voltage Termination Packaging HH=High Q/ Low ESR 03=0201 (0603) 15=0402 (1005) 18=0603 (1608) 21=0805 (2012) N=NP0 (C0G) Two significant digits followed by no. of zeros. And R is in place of decimal point. eg.: R47=0.47pF 0R5=0.5pF 1R0=1.0pF 100=10x10 0 =10pF A=±0.05pF B=±0.1pF C=±0.25pF D=±0.5pF F=±1% G=±2% J=±5% Two significant digits followed by no. of zeros. And R is in place of decimal point. 100=10 VDC 160=16 VDC 250=25 VDC 500=50 VDC 101=100 VDC 201=200 VDC 251=250 VDC 501=500 VDC 631=630 VDC C=Cu/Ni/Sn T=7 reeled G=13 reeled Page 2 of 11 ASC_ HQ_Low ESR_(HH)_006U_AS Oct. 2017
5. EXTERNAL DIMENSIONS Size Inch (mm) L (mm) W (mm) T (mm)/symbol Remark M B (mm) L 0201 (0603) 0.6±0.03 0.3±0.03 0.3±0.03 L # 0.15±0.05 T 0402 (1005) 1.00±0.05 0.50±0.05 0.50±0.05 N # 0.25 +0.05/-0.10 M B M B W 0603 (1608) 1.60±0.10 0.80±0.10 0.80±0.07 S 1.60 +0.15/-0.10 0.80 +0.15/-0.10 0.80 +0.15/-0.10 X 0.40±0.15 Fig. 1 The outline of MLCC 0.60±0.10 A 0805 (2012) ±0.15 1.25±0.10 # Reflow soldering only is recommended. 0.80±0.10 B 1.25±0.10 D # 0.50±0.20 6. GENERAL ELECTRICAL DATA Dielectric NP0 Size 0201, 0402, 0603, 0805 Capacitance* Capacitance tolerance Rated voltage (WVDC) Q* Insulation resistance at Ur Operating temperature Capacitance change Termination 0.5pF to 3300pF Cap 5pF #1 : A (±0.05pF), B (±0.1pF), C (±0.25pF) 5pF<Cap<10pF: C (±0.25pF), D (±0.5pF) Cap 10pF: F (±1%), G (±2%), J (±5%) 10V, 16V, 25V, 50V, 100V, 200V, 250V, 500V, 630V Cap<30pF: Q 400+20C Cap 30pF: Q 1000 10GΩ or RxC 100Ω-F whichever is smaller. -55 to +125 C ±30ppm #1: NP0, 0.1pF product only provide B tolerance Ni/Sn (lead-free termination) * Measured at the conditions of 25 C ambient temper ature and 30~70% related humidity. Apply 1.0±0.2Vrms, 1.0MHz±10% for Cap 1000pF and 1.0±0.2Vrms, 1.0kHz±10% for Cap>1000pF. ** 0402, Capacitance <0.5pF: On request. 7. PACKAGING DIMENSION AND QUANTITY Size Thickness (mm)/symbol Paper tape Plastic tape 7 reel 13 reel 7 reel 13 reel 0201 0.30±0.03 L 15,000 70,000 - - 0402 0.50±0.05 N 10,000 50,000 - - 0603 0.80±0.07 S 0.80 +0.15/-0.10 X 4,000 15,000 - - 0.60±0.10 A 0805 0.80±0.10 B 4,000 15,000 - - 1.25±0.10 D - - 3,000 10,000 Unit: pieces Page 3 of 11 ASC_ HQ_Low ESR_(HH)_006U_AS Oct. 2017
8. CAPACITANCE RANGE Capacitance DIELECTRIC NP0 SIZE 0201 0402 0603 0805 Rated Voltage 10 16 25 50 16 25 50 100 16 25 50 100 200 50 100 200 250 500 630 0.5pF (0R5) L L L L N N N N S S S S S B B 0.6pF (0R6) L L L L N N N N S S S S S B B 0.7pF (0R7) L L L L N N N N S S S S S B B 0.8pF (0R8) L L L L N N N N S S S S S B B 0.9pF (0R9) L L L L N N N N S S S S S B B 1.0pF (1R0) L L L L N N N N S S S S S B B B B B B 1.2pF (1R2) L L L L N N N N S S S S S B B B B B B 1.5pF (1R5) L L L L N N N N S S S S S B B B B B B 1.8pF (1R8) L L L L N N N N S S S S S B B B B B B 2.2pF (2R2) L L L L N N N N S S S S S B B B B B B 2.7pF (2R7) L L L L N N N N S S S S S B B B B B B 3.3pF (3R3) L L L L N N N N S S S S S B B B B B B 3.9pF (3R9) L L L L N N N N S S S S S B B B B B B 4.7pF (4R7) L L L L N N N N S S S S S B B B B B B 5.6pF (5R6) L L L L N N N N S S S S S B B B B B B 6.8pF (6R8) L L L L N N N N S S S S S B B B B B B 8.2pF (8R2) L L L L N N N N S S S S S B B B B B B 10pF (100) L L L L N N N N S S S S S B B B B B B 12pF (120) L L L L N N N N S S S S B B B B B B 15pF (150) L L L L N N N N S S S S B B B B B B 18pF (180) L L L L N N N N S S S S B B B B B B 22pF (220) L L L L N N N N S S S S B B B B B B 27pF (270) L L L L N N N N S S S S B B B B B B 33pF (330) L L L L N N N N S S S S B B B B B B 39pF (390) N N N N S S S S B B B B B B 47pF (470) N N N N S S S S B B B B B B 56pF (560) N N N N S S S S B B B B B B 68pF (680) N N N N S S S S B B B B B B 82pF (820) N N N N S S S S B B B B B B 100pF (101) N N N N S S S S B B B B B B 120pF (121) N N N N S S S S D D D D D D 150pF (151) N N N N S S S S D D D D D D 180pF (181) N N N N S S S S D D D D 220pF (221) N N N N S S S S D D D D 270pF (271) N N N S S S S D D D D 330pF (331) N N N S S S S D D D D 390pF (391) N N N S S S S D D D D 470pF (471) N N N S S S S 560pF (561) S S S S 680pF (681) S S S S 820pF (821) S S S S 1,000pF (102) S S S S 1,200pF (122) X X X 1,500pF (152) X X X 1,800pF (182) X X X 2,200pF (222) X X X 2,700pF (272) X X X 3,300pF (332) X X X 1. The letter in cell is expressed the symbol of product thickness. 2. 0201 & 0402, Capacitance <0.5pF: On request. 3. For more information about products with special capacitance or other data, please contact WTC local representative. Page 4 of 11 ASC_ HQ_Low ESR_(HH)_006U_AS Oct. 2017
9. ELECTRICAL CHARACTERISTICS 1.000 ESR vs Frequency 0201 ESR(ohm) 0.100 0.010 33 pf Fig. 2 ESR vs. Frequency (0201 size) Fig. 3 ESR vs. Frequency (0402 size) 10000 1000 Q vs Frequency 0201 Q 100 10 1 33 pf Fig. 4 Q vs. Frequency (0201 size) Fig. 5 Q vs. Frequency (0402 size) 1000.0 Z vs Frequency 0201 Z(ohm) 100.0 10.0 1.0 33 pf Fig. 6 Impedance vs. Frequency. (0201 size) Fig. 7 Impedance vs. Frequency (0402 size) Page 5 of 11 ASC_ HQ_Low ESR_(HH)_006U_AS Oct. 2017
1.000 ESR vs Frequency 0805 ESR(ohm) 0.100 0.010 100 pf Fig. 8 ESR vs. Frequency (0603 size) Fig. 9 ESR vs. Frequency (0805 size) 10000 1000 Q vs Frequency 0805 Q 100 10 100 pf 1 Fig. 10 Q vs. Frequency (0603 size) Fig. 11 Q vs. Frequency (0805 size) 1000.0 100.0 Z vs Frequency 0805 Z(ohm) 10.0 1.0 0.1 100 pf Fig.12 Impedance vs. Frequency. (0603 size) Fig.13 Impedance vs. Frequency (0805 size) Fig.14 Self resonance frequency vs. Capacitance Page 6 of 11 ASC_ HQ_Low ESR_(HH)_006U_AS Oct. 2017
10. RELIABILITY TEST CONDITIONS AND REQUIREMENTS No. Item Test Conditions Requirements 1. Visual and Mechanical --- * No remarkable defect. * Dimensions to conform to individual specification sheet. 2. Capacitance Cap 1000pF, 1.0±0.2Vrms, 1MHz±10% * Shall not exceed the limits given in the detailed spec. 3. Q/ D.F. (Dissipation Factor) Cap>1000pF, 1.0±0.2Vrms, 1KHz±10% At 25 C ambient temperature. * NP0: Cap 30pF, Q 1000; Cap<30pF, Q 400+20C 4. Dielectric Strength * To apply voltage: ( 100V ) 250% of rated voltage. * Duration: 1 to 5 sec. * Charge and discharge current less than 50mA. * To apply voltage: * No evidence of damage or flash over during test. 200V~300V 500V~999V 2 times VDC 1.5 times VDC 5. Insulation Resistance 6. Temperature Coefficient 7. Adhesive Strength of Termination 8. Vibration Resistance * Cut-off, set at 10mA * TEST= 15 sec. * RAMP=0 Rated voltage:<200v To apply rated voltage for max. 120 sec. Rated voltage:200~630v To apply rated voltage (500V max.) for 60 sec. With no electrical load. Operating temperature: -55~125 C at 25 C * Pressurizing force: 5N ( 0603) and 10N (>0603) * Test time: 10±1 sec. * Vibration frequency: 10~55 Hz/min. * Total amplitude: 1.5mm * Test time: 6 hrs. (Two hrs each in three mutually perpendicular directions.) * Cap./DF(Q) Measurement to be made after de-aging at 150 C for 1hr then set for 24±2 hrs at room temp. 10GΩ 10GΩ or RxC 100Ω-F whichever is smaller * Capacitance change: within ±30ppm/ C * No remarkable damage or removal of the terminations. * Cap change and Q/D.F.: To meet initial spec. 9. Solderability * Solder temperature: 235±5 C 95% min. coverage of all metalized area. * Dipping time: 2±0.5 sec. 10. Bending Test * The middle part of substrate shall be pressurized by means of the pressurizing rod at a rate of about 1 mm per second until * Cap change: within ±5.0% or ±0.5pF whichever is larger. the deflection becomes 1 mm and then the pressure shall be maintained for 5±1 sec. * Measurement to be made after keeping at room temp. for (This capacitance change means the change of capacitance under specified flexure of substrate from the capacitance measured before the test.) 11. Resistance to Soldering Heat 24±2 hrs. * Solder temperature: 260±5 C * Dipping time: 10±1 sec * Preheating: 120 to 150 C for 1 minute before imme rse the capacitor in a eutectic solder. * Cap. / DF(Q) / I.R. Measurement to be made after de-aging at 150 C for 1hr then set for 24±2 hrs at room temp. * Cap change: within ±2.5% or ±0.25pF whichever is larger. * Q/D.F., I.R. and dielectric strength: To meet initial requirements. * 25% max. leaching on each edge. Page 7 of 11 ASC_ HQ_Low ESR_(HH)_006U_AS Oct. 2017
No. Item Test Condition Requirements 12. Temperature Cycle 13. Humidity (Damp Heat) Steady State 14. Humidity (Damp Heat) Load 15. High Temperature Load (Endurance) * Conduct the five cycles according to the temperatures and time. Step Temp. ( C) Time (min.) 1 Min. operating temp. +0/-3 30±3 2 Room temp. 2~3 3 Max. operating temp. +3/-0 30±3 4 Room temp. 2~3 * Cap. / DF(Q) / I.R. Measurement to be made after de-aging at 150 C for 1hr then set for 24±2 hrs at room temp. * Test temp.: 40±2 C * Humidity: 90~95% RH * Test time: 500+24/-0hrs. * Cap. / DF(Q) / I.R. Measurement to be made after de-aging at 150 C for 1hr then set for 24±2 hrs at room temp. * Test temp.: 40±2 C * Humidity: 90~95%RH * Test time: 500+24/-0 hrs. * To apply voltage:rated voltage (Max. 500V) * Cap. / DF(Q) / I.R. Measurement to be made after de-aging at 150 C for 1hr then set for 24±2 hrs at room temp. * Test temp.: NP0: 125±3 C * To apply voltage: (1) <500V: 200% of rated voltage. (2) 500V: 150% of rated voltage. (3) 630V: 120% of rated voltage. * Test time: 1000+24/-0 hrs. * Cap. / DF(Q) / I.R. Measurement to be made after de-aging at 150 C for 1hr then set for 24±2 hrs at room temp. * Cap change:within ±2.5% or ±0.25pF whichever is larger. * Q/D.F., I.R. and dielectric strength: To meet initial requirements. * Cap change: within ±5.0% or ±0.5pF whichever is larger. * Q/D.F. value: NP0: Cap 30pF, Q 350; 10pF Cap<30pF, Q 275+2.5C Cap<10pF; Q 200+10C * I.R.: 1GΩor RxC 50Ω-F whichever is smaller. * Cap change: within ±7.5% or ±0.75pF whichever is larger. * Q/D.F. value: NP0: Cap 30pF, Q 200; Cap<30pF, Q 100+10/3C * I.R.: 500MΩ or RxC 25Ω-F whichever is smaller. * Cap change: within ±3.0% or ±0.3pF whichever is larger. * Q/D.F. value: NP0: Cap 30pF, Q 350 10pF Cap<30pF, Q 275+2.5C Cap<10pF, Q 200+10C * I.R.: 1GΩ or RxC 50Ω-F whichever is smaller. Page 8 of 11 ASC_ HQ_Low ESR_(HH)_006U_AS Oct. 2017
APPENDIXES Tape & reel dimensions Fig. 15 The dimension of paper tape Fig. 16 The dimension of plastic tape Size 0201 0402 0603 0805 Thickness L N S, X A B C, D, I A 0 0.39 1.05 1.50 1.50 0.70 +/-0.2 +/-0.07 +/-0.30 < 1.80 B 0 0.69 1.80 2.30 2.30 1.20 +/-0.2 +/-0.07 +/-0.30 < 2.70 T 0.50 0.80 1.20 1.15 1.30 0.23 +/-0.1 K 0 - - - - - < 2.50 W P 0 10xP 0 P 1 P 2 D 0 1.55 1.55 1.55 1.55 D 1 - - - - - E F 1.55 1.50 +0.1/-0 1.00 Size 0201, 0402, 0603, 0805 Reel size 7 10 13 C 13.0+0.5/-0.2 13.0+0.5/-0.2 13.0+0.5/-0.2 W 1 8.4+1.5/-0 8.4+1.5/-0 8.4+1.5/-0 A 178.0±1.0 250.0±1.0 330.0±1.0 N 60.0+1.0/-0 100.0±1.0 100±1.0 Fig. 17 The dimension of reel Page 9 of 11 ASC_ HQ_Low ESR_(HH)_006U_AS Oct. 2017
Description of customer label a. Customer name b. WTC order series and item number c. Customer P/O d. Customer P/N e. Description of product f. Quantity g. Bar code including quantity & WTC P/N or customer h. WTC P/N i. Shipping date j. Order bar code including series and item numbers k. Serial number of label Constructions No. Name NP0 1 Ceramic material BaTiO 3 based 2 Inner electrode Ni 3 Inner layer Cu 4 Termination Middle layer Ni 5 Outer layer Sn Fig. 18 The construction of MLCC Storage and handling conditions (1) To store products at 5 to 40 C ambient temperature and 20 to 70%. related humidity conditions. (2) The product is recommended to be used within one year after shipment. Check solderability in case of shelf life extension is needed. Cautions: a. The corrosive gas reacts on the terminal electrodes of capacitors, and results in the poor solderability. Do not store the capacitors in the ambience of corrosive gas (e.g., hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas etc.) b. In corrosive atmosphere, solderability might be degraded, and silver migration might occur to cause low reliability. c. Due to the dewing by rapid humidity change, or the photochemical change of the terminal electrode by direct sunlight, the solderability and electrical performance may deteriorate. Do not store capacitors under direct sunlight or dewing condition. To store products on the shelf and avoid exposure to moisture.. Page 10 of 11 ASC_ HQ_Low ESR_(HH)_006U_AS Oct. 2017
Multilayer Ceramic Capacitors Recommended soldering conditions The lead-free termination MLCCs are not only to be used on SMT against lead-free solder paste, but also suitable against lead-containing solder paste. If the optimized solder joint is requested, increasing soldering time, temperature and concentration of N2 within oven are recommended. 4 / sec max Over 60sec at least by natural cooling Fig. 19 Recommended reflow soldering profile for SMT process with SnAgCu series solder paste. Page 11 of 11 Fig. 20 Recommended wave soldering profile for SMT process with SnAgCu series solder. ASC_ HQ_Low ESR_(HH)_006U_AS Oct. 2017