COB Chip on Board (COB) LED Components, COB-4021 Series ma, 35.5 V. Electrical specifications. Mechanical and Thermal Data

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COB-4021 Chip on Board (COB) LED Components, COB-4021 Series High efficac of up to 161 lm/w @ 5000 K Lumen Output up to 5600 lm in a single LED package Design choice with colour temperatures from 2700K to 5000K Guaranteed colour rendering @ CRI >80 Eas assembl & small footprint (21.5 mm²) for design freedom 1080 ma, 35.5 V COB-4021 COB-4021-827-040 2700 COB-4021-830-040 3000 COB-4021-835-040 3500 COB-4021-840-040 4000 COB-4021-850-050 5000 Colour Flu bin Luminous flu Φv Efficac Colour Min. Ma Min. Ma Rank (K) (1F)* (lm) (lm) (lm/w) (lm/w) 41 3695 4050 105 115 42 4050 4400 115 125 43 4400 4750 125 134 44 4750 5100 134 144 41 3810 4175 108 118 42 4175 4535 118 128 43 4535 4895 128 139 44 4895 5255 139 149 41 3960 4340 103 113 42 4340 4720 113 123 43 4720 5100 123 133 44 5100 5480 133 143 41 4075 4465 115 126 42 4465 4855 126 137 43 4855 5245 137 148 44 5245 5635 148 159 41 4115 4505 116 127 42 4505 4900 127 139 43 4900 5295 139 150 44 5295 5690 150 161 (Bin) W3 (WA) V3 (VA) U3 (UA) T3 (TA) RT (RW, RX, RY, RZ) Relative Intensit 120% TC = 25 C 100% 80% 60% 40% 20% 0% -90-60 -30 0 30 60 90 Angular Displacement [Degree] Beam distribution: view angle 115 Note: All values with I fv = 1080 ma at TC= 25 C * Flu rank 1F Electrical specifications at Tc = 25 C Min. Nom. Ma Forward Current (ma) - 1080 1620 Forward Voltage (V) 32.5 35.5 38.5 Power Consumption (W) - 38.3 60 Mechanical and Thermal Data Dimensions 21.5 21.5 t 1.9 (mm) Thermal Resistance 0.8 C /W Colour Rendering Inde CRI > 80 Operating Conditions and Characteristics Ma LED junction temperature 150 C Operating temperature range -40 +105 C Storage temperature range -40 +120 C Helvar Data is subject to change without notice. More information at: www.helvar.com T27 005 1A 01.05.2014 1/6 1

Dimensions TC-point Cathode(-) 21.50 4-Ø3.3 hole 1.90 1.00 unit : mm Tolerance : ± 0.15 21.50 Ø17 18.60 Anode(+) 2.00 2.00 0,440 Footprint Thickness of PCB Height 21.50 21.50 ± 0.15 mm 0.9 ± 0.2 mm 1.9 ± 0.2 mm Chromaticit Co-ordinates Condition : IF = 720 ma, Ta : 25 C 1) The Chromaticit Coordinates refers to ANSI C78.377-2008 2700 K 3000 K 3500 K CIE1931 chromaticit diagram(e-star) 0,435 MOQ = 180 pcs. CIE1931 chromaticit diagram(e -Star) Packing details 1 Tra 1 AL bag = Bo Num. of modules 60 180 Bo : 338(L) 148(W) 60(h) (Tolerance : ±2 mm) 0,420 CIE1931 chromaticit diagram(e -Star) 0,430 0,420 0,410 0,425 0,415 0,405 0,410 0,400 0,390 0,400 0,395 0,370 0,390 0,380 0,430 0,440 0,450 0,460 0,470 0,480 0,490 Macadam Ellipse 3-step (WA) θ a b 0.4578 0.4101 53.7 0.0081 0.0042 0,385 0,375 0,405 0,415 0,425 0,435 0,445 0,455 0,465 Macadam Ellipse 3-step (VA) θ a b 0.4338 0.4030 53.22 0.0083 0.0041 0,370 0,360 0,380 0,390 0,400 0,410 0,420 0,430 0,440 Macadam Ellipse 3-step (UA) θ a b 0.4037 0.3917 54.0 0.0093 0.0041 0,410 0,400 0,390 0,380 0,370 0,360 4000 K CIE1931 chromaticit diagram(e -Star) 0,350 0,355 0,365 0,375 0,385 0,395 0,405 0,415 Macadam Ellipse 3-step (TA) θ a b 0.3818 0.3797 53.72 0.0094 0.0040 0,385 0,375 0,365 0,355 0,345 0,335 5000 K CIE1931 chromaticit diagram(e -Star) 5311K 5028K 4745K RW RX 0,325 0,315 0,325 0,335 0,345 0,355 0,365 0,375 RY RZ B.BLocus Table CIE X CIE Y 0.3376 0.3616 RW 0.3463 0.3687 0.3371 0.3490 0.3371 0.3490 RX 0.3440 0.3428 0.3366 0.3369 0.3463 0.3687 RY 0.3551 0.3760 0.3533 0.3620 RZ 0.3533 0.3620 0.3515 0.3487 0.3440 0.3428 2 Helvar Data is subject to change without notice. More information at: www.helvar.com T27 0051A 01.05.2014 2/5

Tpical Characteristics Condition : Ta : 25 C Relative luminous flu versus forward current Forward Current vs. Forward Voltage Forward current vs. Chromaticit Coordination Temperature vs. Chromaticit Coordination Temperature vs. Voltage Temperature vs. Relative Luminous Flu Helvar Data is subject to change without notice. More information at: www.helvar.com T27 0051A 01.05.2014 3/5 3

Relative Spectral Emission 2700K 3000K 4000K 5000K Derating Curve 4 Helvar Data is subject to change without notice. More information at: www.helvar.com T27 0051A 01.05.2014 4/6

Reliabilit Test Items and Conditions Test Items Test Items Test Conditions Test Hours/Ccles Room Temperature life test 25 C, I F = Ma 1,000 h High Temperature humidit life test 85 C, 85% RH, DC Derating I F = Ma 1,000 h High Temperature life test 105 C, DC Derating I F = Ma 1,000 h Low Temperature life test -40 C, DC 1620 ma 1,000 h High Temperature Storage 120 C 1,000 h Low Temperature Storage -40 C 1,000 h Thermal Shock -45 C/15min 125 C/15min Temperature changes in 5min. 200 ccles Temperature Ccle On/Off test -40 / 85 C, each 20min, 100min transfer Power On/off each 5min, DC 1620 ma 100 ccles Temperature humidit Ccle Storage -10 C 25 C, 95%RH 85 C, 95%RH [24h/1Ccle] 100 ccles ESD(HBM) R1 : 10 MΩ, R2 : 1.5 kω, C : 100 pf 5 times (± 5 kv) ESD(MM) R1 : 10 MΩ, R2 : 0 kω, C : 200 pf 5 times (± 0.5 kv) Vibration 20~80 Hz (Displacement:0.06 inch, Ma 20 G) 80~2kHz (Ma 20 G) 4 times Min. Frequenc Ma. Frequenc 4min transfer Shock 1500G, 0.5ms, Ever 6faces (3ais X 2faces) 5 times Salt Spra 35 C, salt water 5% 8h spra 16h leaving alone 2 ccles Criteria for Failure Test Condition Limit Item Smbol [Ta = 25 C] Min. Ma. Forward Voltage VF 1620 ma L.S.L. 0.9 U.S.L. 1.1 Luminous flu lm 1620 ma L.S.L. 0.7 U.S.L. 1.3 * U.S.L. : Upper Standard Level L.S.L. : Lower Standard Level Helvar Data is subject to change without notice. More information at: www.helvar.com T27 0051A 01.05.2014 5/6 5

Precautions In Handling 1) Shelf life in sealed bag : 12 months at < 40 C and < 90% relative humidit(rh) 2) Peak package bod temperature : 240 C. 3) After this bag is opened, devices that will be subjected to reflow solder or other high temperature processes must be : a. Mounted within 672 hours at factor conditions of equal to or less than 30 C / 60% RH, or b. Stored at < 10% RH 4) Devices require bake, before mounting, if : a. Humidit Indicator Card is > 65% when read at 23 ± 5 C, or b. 3a is not met. 5) If baking is required, devices must be baked for 1 hours at 60 ± 5 C Note : If device containers cannot be subjected to high temperature or shorter bake times are desired, reference IPC / JEDEC J-STD-033 for bake procedure. 6) The LEDs are sensitive to the static electricit and surge current. It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. If voltage eceeding the absolute maimum rating is applied to LEDs, it ma cause damage or even destruction to LED devices. Damaged LEDs ma show some unusual characteristics such as increase in leakage current, lowered turn-on voltage, or abnormal lighting of LEDs at low current. 7) Please do not following behavior in resin area.(handling, Pressing, Touching, Rubbing, Contacting tweezers, Cleaning) But it s ok in handling area. Handling area Resin area 8) VOCs (volatile organic compounds) ma be occurred b adhesives, flu, hardener or organic additives which is used in luminaires (fiture) and LED silicone bags are permeable to it. It ma lead a discoloration when LED epose to heat or light. This phenomenon can give a significant loss of light emitted(output) from the luminaires (fitures). In order to prevent these problems, we recommend ou to know the phsical properties for the materials used in luminaires, It requires to select carefull. 6 Helvar Data is subject to change without notice. More information at: www.helvar.com T27 0051A 01.05.2014 6/6