The 74LVC00A provides four 2-input NAND gates.

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74LVC00 Quad 2-input NND gate Rev. 7 25 pril 202 Product data sheet. General description The 74LVC00 provides four 2-input NND gates. Schmitt trigger action at all inputs makes the circuit tolerant of slower input rise and fall times. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V applications. 2. Features and benefits 3. Ordering information 5 V tolerant inputs for interfacing with 5 V logic Wide supply voltage range from.2 V to 3.6 V CMOS low-power consumption Direct interface with TTL levels Complies with JEDEC standard: JESD8-7 (.65 V to.95 V) JESD8-5 (2.3 V to 2.7 V) JESD8-C/JESD36 (2.7 V to 3.6 V) ESD protection: HBM JESD22-4F exceeds 2000 V MM JESD22-5-B exceeds 200 V CDM JESD22-C0E exceeds 000 V Specified from 40 C to +85 C and 40 C to +25 C Table. Ordering information Type number Package Temperature range Name Description Version 74LVC00D 40 C to+25 C SO4 plastic small outline package; 4 leads; SOT08- body width 3.9 mm 74LVC00DB 40 C to+25 C SSOP4 plastic shrink small outline package; 4 leads; SOT337- body width 5.3 mm 74LVC00PW 40 C to+25 C TSSOP4 plastic thin shrink small outline package; 4 leads; body width 4.4 mm SOT402-74LVC00BQ 40 C to+25 C DHVQFN4 plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 4 terminals; body 2.5 3 0.85 mm SOT762-

74LVC00 Quad 2-input NND gate 4. Functional diagram 2 4 5 B 2 2B Y 2Y 3 6 2 4 5 & & 3 6 9 0 2 3 3 3B 4 4B 3Y 8 4Y mna22 9 0 2 3 & & mna246 8 B Y mna2 Fig. Logic symbol Fig 2. IEC logic symbol Fig 3. Logic diagram for one gate 5. Pinning information 5. Pinning terminal index area VCC B Y 2 2B 2Y 2 3 4 5 6 00 4 3 2 0 9 V CC 4B 4 4Y 3B 3 B Y 2 2B 2Y 4 2 3 3 2 4 00 5 GND () 0 6 9 7 8 4B 4 4Y 3B 3 GND 7 8 3Y GND 3Y 00aac939 00aac938 Transparent top view () This is not a supply pin. The substrate is attached to this pad using conductive die attach material. There is no electrical or mechanical requirement to solder this pad. However, if it is soldered, the solder land should remain floating or be connected to GND. Fig 4. Pin configuration SO4 and (T)SSOP4 Fig 5. Pin configuration DHVQFN4 5.2 Pin description Table 2. Pin description Symbol Pin Description to 4, 4, 9, 2 data input B to 4B 2, 5, 0, 3 data input Y to 4Y 3, 6, 8, data output GND 7 ground (0 V) V CC 4 supply voltage 74LVC00 ll information provided in this document is subject to legal disclaimers. NXP B.V. 202. ll rights reserved. Product data sheet Rev. 7 25 pril 202 2 of 4

74LVC00 Quad 2-input NND gate 6. Functional description Table 3. Function selection [] Input Output n nb ny L X H X L H H H L [] H = HIGH voltage level; L = LOW voltage level; X = don t care 7. Limiting values Table 4. Limiting values In accordance with the bsolute Maximum Rating System (IEC 6034). Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Max Unit V CC supply voltage 0.5 +6.5 V I IK input clamping current V I < 0 V 50 - m V I input voltage [] 0.5 +6.5 V I OK output clamping current V O > V CC or V O < 0 V - ±50 m V O output voltage output in HIGH or LOW-state [2] 0.5 V CC + 0.5 V I O output current V O = 0 V to V CC - ±50 m I CC supply current - 00 m I GND ground current 00 - m P tot total power dissipation T amb = 40 C to +25 C [3] - 500 mw T stg storage temperature 65 +50 C [] The minimum input voltage ratings may be exceeded if the input current ratings are observed. [2] The output voltage ratings may be exceeded if the output current ratings are observed. [3] For SO4 packages: above 70 C derate linearly with 8 mw/k. For (T)SSOP4 packages: above 60 C derate linearly with 5.5 mw/k. For DHVQFN4 packages: above 60 C derate linearly with 4.5 mw/k. 8. Recommended operating conditions Table 5. Recommended operating conditions Symbol Parameter Conditions Min Typ Max Unit V CC supply voltage.65-3.6 V functional.2 - - V V I input voltage 0-5.5 V V O output voltage output HIGH or LOW state 0 - V CC V T amb ambient temperature 40 - +25 C Δt/ΔV input transition rise and V CC =.65 V to 2.7 V 0-20 ns/v fall rate V CC = 2.7 V to 3.6 V 0-0 ns/v 74LVC00 ll information provided in this document is subject to legal disclaimers. NXP B.V. 202. ll rights reserved. Product data sheet Rev. 7 25 pril 202 3 of 4

74LVC00 Quad 2-input NND gate 9. Static characteristics Table 6. Static characteristics t recommended operating conditions. Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions 40 C to +85 C 40 C to +25 C Unit Min Typ [] Max Min Max V IH HIGH-level V CC =.2 V.08 - -.08 - V input voltage V CC =.65 V to.95 V 0.65 V CC - - 0.65 V CC - V V CC = 2.3 V to 2.7 V.7 - -.7 - V V CC = 2.7 V to 3.6 V 2.0 - - 2.0 - V V IL LOW-level V CC =.2 V - - 0.2-0.2 V input voltage V CC =.65 V to.95 V - - 0.35 V CC - 0.35 V CC V V CC = 2.3 V to 2.7 V - - 0.7-0.7 V V CC = 2.7 V to 3.6 V - - 0.8-0.8 V V OH HIGH-level V I =V IH or V IL output I O = 00 μ; voltage V CC =.65Vto3.6V V CC 0.2 - - V CC 0.3 - V I O = 4 m; V CC =.65 V.2 - -.05 - V I O = 8 m; V CC = 2.3 V.8 - -.65 - V I O = 2 m; V CC = 2.7 V 2.2 - - 2.05 - V I O = 8 m; V CC = 3.0 V 2.4 - - 2.25 - V I O = 24 m; V CC = 3.0 V 2.2 - - 2.0 - V V OL I I I CC ΔI CC C I LOW-level output voltage input leakage current supply current additional supply current input capacitance V I =V IH or V IL I O = 00 μ; - - 0.2-0.3 V V CC =.65 V to 3.6 V I O =4m; V CC =.65 V - - 0.45-0.65 V I O =8m; V CC = 2.3 V - - 0.6-0.8 V I O =2m; V CC = 2.7 V - - 0.4-0.6 V I O =24m; V CC = 3.0 V - - 0.55-0.8 V V CC = 3.6 V; V I =5.5VorGND - ±0. ±5 - ±20 μ V CC = 3.6 V; V I =V CC or GND; I O =0-0. 0-40 μ per input pin; - 5 500-5000 μ V CC = 2.7 V to 3.6 V; V I =V CC 0.6 V; I O =0 V CC = 0 V to 3.6 V; - 4.0 - - - pf V I =GNDtoV CC [] ll typical values are measured at V CC = 3.3 V (unless stated otherwise) and T amb =25 C. 74LVC00 ll information provided in this document is subject to legal disclaimers. NXP B.V. 202. ll rights reserved. Product data sheet Rev. 7 25 pril 202 4 of 4

74LVC00 Quad 2-input NND gate 0. Dynamic characteristics Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V). For test circuit see Figure 7. Symbol Parameter Conditions 40 C to +85 C 40 C to +25 C Unit Min Typ [] Max Min Max t pd propagation delay n, nb to ny; see Figure 6 [2] V CC =.2V - 2 - - - ns V CC =.65 V to.95 V 0.3 3.8 8.4 0.3 9.7 ns V CC = 2.3 V to 2.7 V.0 2.2 4.8.0 5.7 ns V CC = 2.7 V.0 2.3 5..0 5.9 ns V CC = 3.0 V to 3.6 V 0.5 2.0 4.3 0.5 5. ns t sk(o) output skew time V CC = 3.0 V to 3.6 V [3] - -.0 -.5 ns C PD power dissipation per gate; V I =GNDtoV CC [4] capacitance V CC =.65 V to.95 V - 5.6 - - - pf V CC = 2.3 V to 2.7 V - 8.9 - - - pf V CC = 3.0 V to 3.6 V -.8 - - - pf [] Typical values are measured at T amb =25 C and V CC =.2 V,.8 V, 2.5 V, 2.7 V, and 3.3 V respectively. [2] t pd is the same as t PLH and t PHL. [3] Skew between any two outputs of the same package switching in the same direction. This parameter is guaranteed by design. [4] C PD is used to determine the dynamic power dissipation (P D in μw). P D =C PD V CC 2 f i N+Σ(C L V CC 2 f o ) where: f i = input frequency in MHz; f o = output frequency in MHz C L = output load capacitance in pf V CC = supply voltage in Volts N = number of inputs switching Σ(C L V 2 CC f o ) = sum of the outputs. Waveforms V I n, nb input V M GND t PHL t PLH V OH ny output V M V OL mna23 Fig 6. V M =.5 V at V CC 2.7 V. V M =0.5 V CC at V CC <2.7V. V OL and V OH are typical output voltage levels that occur with the output load. The input (n, nb) to output (ny) propagation delays 74LVC00 ll information provided in this document is subject to legal disclaimers. NXP B.V. 202. ll rights reserved. Product data sheet Rev. 7 25 pril 202 5 of 4

74LVC00 Quad 2-input NND gate V I negative pulse 0 V 90 % V M 0 % t W V M t f t r t r t f V I positive pulse 0 V 0 % 90 % V M t W V M V CC PULSE GENERTOR V I DUT V O RT CL RL 00aaf65 Fig 7. Test data is given in Table 8. Definitions for test circuit: R L = Load resistance C L = Load capacitance including jig and probe capacitance R T = Termination resistance should be equal to output impedance Z o of the pulse generator Load circuitry for measuring switching times Table 8. Test data Supply voltage Input Load V I t r, t f C L R L.2 V V CC 2 ns 30 pf kω.65 V to.95 V V CC 2 ns 30 pf kω 2.3 V to 2.7 V V CC 2 ns 30 pf 500 Ω 2.7V 2.7V 2.5 ns 50 pf 500 Ω 3.0Vto3.6V 2.7V 2.5 ns 50 pf 500 Ω 74LVC00 ll information provided in this document is subject to legal disclaimers. NXP B.V. 202. ll rights reserved. Product data sheet Rev. 7 25 pril 202 6 of 4

74LVC00 Quad 2-input NND gate 2. Package outline SO4: plastic small outline package; 4 leads; body width 3.9 mm SOT08- D E X c y H E v M Z 4 8 Q pin index 2 ( ) 3 θ L p 7 L e b p w M detail X 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches max. 0.25.75 0.0 0.069 0.00 0.004 2 3 b p c D () E () e H () E L L p Q v w y Z.45.25 0.057 0.049 0.25 0.0 0.49 0.36 0.09 0.04 0.25 0.9 0.000 0.0075 8.75 8.55 0.35 0.34 4.0 3.8 0.6 0.5.27 6.2 5.8 0.244 0.228 Note. Plastic or metal protrusions of 0.5 mm (0.006 inch) maximum per side are not included. 0.05.05 0.04.0 0.4 0.039 0.06 0.7 0.6 0.028 0.024 0.25 0.25 0. 0.0 0.0 0.004 θ 0.7 0.3 o 8 o 0.028 0 0.02 OUTLINE VERSION REFERENCES IEC JEDEC JEIT EUROPEN PROJECTION ISSUE DTE SOT08-076E06 MS-02 99-2-27 03-02-9 Fig 8. Package outline SOT08- (SO4) 74LVC00 ll information provided in this document is subject to legal disclaimers. NXP B.V. 202. ll rights reserved. Product data sheet Rev. 7 25 pril 202 7 of 4

74LVC00 Quad 2-input NND gate SSOP4: plastic shrink small outline package; 4 leads; body width 5.3 mm SOT337- D E X c y H E v M Z 4 8 Q 2 ( ) 3 pin index 7 detail X L p L θ e b p w M 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT 2 3 b p c D () E () e H E L L p Q v w y Z() max. 0.2.80 0.38 0.20 6.4 5.4 7.9.03 0.9.4 mm 2 0.25 0.65.25 0.2 0.3 0. 0.05.65 0.25 0.09 6.0 5.2 7.6 0.63 0.7 0.9 θ o 8 o 0 Note. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEIT EUROPEN PROJECTION ISSUE DTE SOT337- MO-50 99-2-27 03-02-9 Fig 9. Package outline SOT337- (SSOP4) 74LVC00 ll information provided in this document is subject to legal disclaimers. NXP B.V. 202. ll rights reserved. Product data sheet Rev. 7 25 pril 202 8 of 4

74LVC00 Quad 2-input NND gate TSSOP4: plastic thin shrink small outline package; 4 leads; body width 4.4 mm SOT402- D E X c y H E v M Z 4 8 pin index 2 Q ( ) 3 θ 7 e b p w M detail X L p L 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT 2 3 b p c D () E (2) e H () E L L p Q v w y Z max. mm. 0.5 0.05 0.95 0.80 0.25 0.30 0.9 0.2 0. 5. 4.9 4.5 4.3 0.65 6.6 6.2 0.75 0.50 0.4 0.3 0.2 0.3 0. 0.72 0.38 θ o 8 o 0 Notes. Plastic or metal protrusions of 0.5 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEIT SOT402- MO-53 EUROPEN PROJECTION ISSUE DTE 99-2-27 03-02-8 Fig 0. Package outline SOT402- (TSSOP4) 74LVC00 ll information provided in this document is subject to legal disclaimers. NXP B.V. 202. ll rights reserved. Product data sheet Rev. 7 25 pril 202 9 of 4

74LVC00 Quad 2-input NND gate DHVQFN4: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 4 terminals; body 2.5 x 3 x 0.85 mm SOT762- D B E c terminal index area detail X terminal index area e e b 2 6 v M w M C C B y C C y L 7 E h e 4 8 3 9 D h X 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT () max. b c D () D h E () Eh e e L v w y y mm 0.05 0.00 0.30 0.8 0.2 3. 2.9.65.35 2.6 2.4.5 0.85 0.5 2 0.5 0.3 0. 0.05 0.05 0. Note. Plastic or metal protrusions of 0.075 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEIT SOT762- - - - MO-24 - - - EUROPEN PROJECTION ISSUE DTE 02-0-7 03-0-27 Fig. Package outline SOT762- (DHVQFN4) 74LVC00 ll information provided in this document is subject to legal disclaimers. NXP B.V. 202. ll rights reserved. Product data sheet Rev. 7 25 pril 202 0 of 4

74LVC00 Quad 2-input NND gate 3. bbreviations Table 9. cronym CDM DUT ESD HBM MM TTL bbreviations Description Charged Device Model Device Under Test ElectroStatic Discharge Human Body Model Machine Model Transistor-Transistor Logic 4. Revision history Table 0. Revision history Document ID Release date Data sheet status Change notice Supersedes 74LVC00 v.7 2020425 Product data sheet - 74LVC00 v.6 Modifications: Table 2: Errata in pin description corrected. 74LVC00 v.6 202006 Product data sheet - 74LVC00 v.5 Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Table 4, Table 5, Table 6, Table 7 and Table 8: values added for lower voltage ranges. 74LVC00 v.5 20030904 Product specification - 74LVC00 v.4 74LVC00 v.4 20030507 Product specification - 74LVC00 v.3 74LVC00 v.3 20020305 Product specification - 74LVC00 v.2 74LVC00 v.2 9980428 Product specification - 74LVC00 v. 74LVC00 v. 99708 Product specification - - 74LVC00 ll information provided in this document is subject to legal disclaimers. NXP B.V. 202. ll rights reserved. Product data sheet Rev. 7 25 pril 202 of 4

74LVC00 Quad 2-input NND gate 5. Legal information 5. Data sheet status Document status [][2] Product status [3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [] Please consult the most recently issued document before initiating or completing a design. [2] The term short data sheet is explained in section Definitions. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 5.2 Definitions Draft The document is a draft version only. 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In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer s own risk. pplications pplications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer s applications and products planned, as well as for the planned application and use of customer s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer s applications or products, or the application or use by customer s third party customer(s). Customer is responsible for doing all necessary testing for the customer s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer s third party customer(s). NXP does not accept any liability in this respect. Limiting values Stress above one or more limiting values (as defined in the bsolute Maximum Ratings System of IEC 6034) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 74LVC00 ll information provided in this document is subject to legal disclaimers. NXP B.V. 202. ll rights reserved. Product data sheet Rev. 7 25 pril 202 2 of 4

74LVC00 Quad 2-input NND gate Export control This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors specifications such use shall be solely at customer s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors standard warranty and NXP Semiconductors product specifications. Translations non-english (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 5.4 Trademarks Notice: ll referenced brands, product names, service names and trademarks are the property of their respective owners. 6. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com 74LVC00 ll information provided in this document is subject to legal disclaimers. NXP B.V. 202. ll rights reserved. Product data sheet Rev. 7 25 pril 202 3 of 4

74LVC00 Quad 2-input NND gate 7. Contents General description...................... 2 Features and benefits.................... 3 Ordering information..................... 4 Functional diagram...................... 2 5 Pinning information...................... 2 5. Pinning............................... 2 5.2 Pin description......................... 2 6 Functional description................... 3 7 Limiting values.......................... 3 8 Recommended operating conditions........ 3 9 Static characteristics..................... 4 0 Dynamic characteristics.................. 5 Waveforms............................. 5 2 Package outline......................... 7 3 bbreviations.......................... 4 Revision history........................ 5 Legal information....................... 2 5. Data sheet status...................... 2 5.2 Definitions............................ 2 5.3 Disclaimers........................... 2 5.4 Trademarks........................... 3 6 Contact information..................... 3 7 Contents.............................. 4 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section Legal information. NXP B.V. 202. ll rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 25 pril 202 Document identifier: 74LVC00