Ambient Light Sensor DESCRIPTION Data Sheet The is an ambient light sensor with a photo diode and current amplifier. This product has spectral characteristics close to human eye sensitivity and outputs light current proportional to the ambient brightness. The can be used to improve the performance and reduce the power consumption of digital equipment such as FPD-TV sets and mobile phones, by enabling automatic brightness control and automatic switching on and off of lighting systems. FEATURES Small and thin SON package 2.55 x.56 x 0.55 mm Spectral characteristics close to human eye sensitivity Peak sensitivity wavelength 530 nm TYP. The impact of infrared light can be reduced by incorporating infrared light correction circuits. Output characteristics proportional to illuminance Output light current 55 μa TYP.@00 lx (Fluorescent light) Reduced variation of output current among light sources Low voltage operation V CC =.8 to 5.5 V Pb-free APPLICATIONS FPD TV sets, displays Mobile phones, smartphones Notebook PCs, tablet PCs DSCs, DVCs FA equipment Lighting systems, etc. R08DS0067EJ000 Rev..00 R08DS0067EJ000 Rev..00 Page of
PACKAGE DIMENSIONS (UNIT: mm) Pin No..56±0.5 Terminal 0.5 0.55 2 (5) TOP VIEW 2.55± 2.25 6 2 5 3 Remark Pin is distinguishable by the shape of the lead frame. SIDE VIEW BOTTOM VIEW Remark ( ) indicates nominal dimensions. OUT 2 GND 3 V CC 4 NC 5 NC 6 NC Remark. Connect all the NC terminals to GND or V CC. 2. The bypass capacitor between V CC and GND is to be mounted within 20 mm of the package body. 4 R08DS0067EJ000 Rev..00 Page 2 of
BLOCK DIAGRAM VCC MARKING EXAMPLE ORDERING INFORMATION Light Source Product code GND (Bottom View) 04 Part Number Order Number Solder Plating Specification -E4 -E4-Y-A Pb-Free Assembly code pin OUT Packing Style Embossed Tape 5 000 pcs/reel R08DS0067EJ000 Rev..00 Page 3 of
ABSOLUTE MAXIMUM RATINGS (T A = 25 C, unless otherwise specified) Parameter Symbol Ratings Unit Supply Voltage V CC 6 V Light Current I O 5 ma Power Dissipation * P D 35 mw Operating Temperature T opt 30 to +85 C Storage Temperature T stg 40 to +00 C Note: *. Mounted on glass epoxy board (8 mm 3 mm t 0.8 mm) RECOMMENDED OPERATING CONDITIONS Parameter Symbol MIN. TYP. MAX. Unit Supply Voltage V CC.8 3.0 5.5 V ELECTRO-OPTICAL CHARACTERISTICS (T A = 25 C, V CC = 3.0 V, unless otherwise specified) Parameter Symbol Conditions MIN. TYP. MAX. Unit Supply Current * I CC E V = 00 lx *2 63 μa Peak Sensitivity Wavelength λ p 530 nm Light Current * I O0 E V = 0 lx μa Sensitivity Ratio of Fluorescent/Incandescent I O E V = 00 lx *2 44 55 66 μa E V = 00 lx Multiple Saturation Output Voltage *3 V O E V = 00 lx, R L = 50 kω *2 2.6 2.9 V Switching Rise Time t r R L = 5 kω *5 80 μs Time *4 Fall Time t f 40 μs Note: Delay Time t d 250 μs Storage Time t s 5 μs * Measured under load resistance conditions of an output current unsaturated *2 Fluorescent light *3 Saturation output voltage measurement method: Light Source VCC PH5504A GND OUT RL VCC VCC VO Illuminance (lx) R08DS0067EJ000 Rev..00 Page 4 of
*4 Switching Time Pulse input VCC VCC Input Output *5 White LED td PH5504A GND ts tr tf OUT RL 90% 0% R08DS0067EJ000 Rev..00 Page 5 of
TYPICAL CHARACTERISTICS (T A = 25 C, V CC = 3.0 V, unless otherwise specified) Ratio Ratio. 0.9 0.8 Incandescent light 0.7 0.6 0.5 Halogen light 0.4 0.3 Krypton light 0. White LED 0 300 400 500 600 700 800 900 000 00 200 0 0.5.5 2.2 0.8 0.6 0.4 SPECTRAL SENSITIVITY CHARACTERISTICS Wavelength (nm) 0 90 60 30 0 30 60 90 Angle (deg.) Fluorescent light DIRECTIONAL CHARACTERISTICS DIRECTIONAL CHARACTERISTICS 2 pin Remark The graphs indicate nominal characteristics. + Ratio.2 0.8 0.6 0.4 LIGHT SOURCE SENSITIVITY VARIATION Ratio pin 0 90 60 30 0 30 60 90 Angle (deg.) + R08DS0067EJ000 Rev..00 Page 6 of
0 000 LIGHT CURRENT vs. ILLUMINANCE TEMPERATURE DEPENDENCY OF LIGHT CURRENT AT 0 lx IO (μa) Ratio 000 00 0. 0 0. 0.0 0.0 0. 0 00 000 0 000.4.2 0.8 0.6 0.4 0 40 Illuminance (lx) TEMPERATURE DEPENDENCY OF LIGHT CURRENT AT 00 lx (NORMALIZED AT 25 C) 20 0 20 40 60 80 00 Temperature ( C) Remark The graphs indicate nominal characteristics. IO0 (μa) Ratio 0.0 0.00 40 20 0 20 40 60 80 00 VCC DEPENDENCY OF LIGHT CURRENT AT 00 lx (NORMALIZED AT VCC = 3 V).4.2 0.8 0.6 0.4 Temperature ( C) 0.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) 6 R08DS0067EJ000 Rev..00 Page 7 of
RECOMMENDED OPTICAL LAYOUT (UNIT: mm).275.275 Offset 0.4 pin 0.78 0.78 It is recommended to position the sensor so that light hits a circular area (shown by the dotted line) with a radius of 2.5 mm (diameter of 5 mm) from the center of the package. Light detecting area (0.54 x 0.8 mm) Recommended area for light to hit (2.5 mm radius) R08DS0067EJ000 Rev..00 Page 8 of
TAPING SPECIFICATIONS (UNIT: mm) Outline and Dimensions (Tape) Tape Direction Outline and Dimensions (Reel) φ.5 +0. 0 Product Pin θ Symbol A B W 2.0±0. Direction of feed 4.0±0. ±0.05 4.0±0. φ.05±0.05 C Dimensions (mm) φ 80 +0 φ 60 + 0 9.0 +.95 Perforation 0 D.5 E 0.78±0.05 θ 2 Product Cover tape Symbol C D E θ 3.5±0.05.75±0. 8.0± 2.9 B 0.78±0.05 Carrier tape A W Dimensions (mm) φ 3± 2.0±0.5 2.0±0.8 90 θ 2 20 R08DS0067EJ000 Rev..00 Page 9 of
RECOMMENDED MOUNT PAD DIMENSIONS (Unit: mm) 4 2 2 0.5 0.5 4.85 0.55 Remark All dimensions in this figure must be evaluated before use. 2 2 0.5 0.5 R08DS0067EJ000 Rev..00 Page 0 of
NOTES ON HANDLING. Recommended reflow soldering conditions (including infrared reflow, convection reflow, and infrared + convection reflow) () This product is dry-packed with desiccant in order to avoid moisture absorption. (2) After breaking the seal, reflow soldering must be done within 68 hours under the recommended temperature profile shown below. (3) If more than 68 hours have passed after breaking the seal, the baking process must be done by using a tape and reel. Baking conditions: Once, with tape and reel, 60±5 C, 0 to 24 hours After the baking process, this product must be stored under conditions of 30 C or below, 70% RH or below, and reflow soldering must be done within 68 hours. < Storage conditions after breaking seal > Storage conditions : 30 C or below, 70% RH or below Maximum storage period after breaking seal : 68 hours (Second reflow soldering must be completed within 68 hours.) < Reflow soldering conditions > Peak reflow temperature : 260 C or below (Package surface temperature) Maximum number of reflows : 2 No repair by hand soldering Maximum chlorine content of rosin flux (percentage mass) : % or less Package Surface Temperature Ramp-up rate 3 C/s MAX. 50 C Recommended Temperature Profile of Reflow 60 to 20 s 200 C Time 8 min. MAX. 220 C 255 C Peak Temperature 260 C MAX. 30 s or less 60 s or less Ramp-down rate 6 C/s MAX. R08DS0067EJ000 Rev..00 Page of
Revision History Data Sheet Description Rev. Date Page Summary.00 First edition issued All trademarks and registered trademarks are the property of their respective owners. C -