AND8149/D. Understanding and Using the NCV1124 VR Sensor Interface APPLICATION NOTE

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Understanding and Using the VR Sensor Interface APPLICATION NOTE The offers a dual channel low component count interface solution for ground referenced variable reluctance sensors. The product is easy to use when the basic circuit operation is understood and when certain application guidelines are followed. This note, along with the data sheet (/D) will provide the user with the information necessary for successful application. Circuit Basics Each channel of the has independent input bias and clamp circuitry, and independent comparators with Hysteresis voltage generators. Both channels share a common reference generator for normal and diagnostic modes. A block diagram detailing one channel is shown in Figure 1 along with some of the external application components. We ll explore the circuit using one channel and, where convenient, use a subscripted x to indicate either channel. The voltage developed by the VR sensor is applied through resistor to the pin. When the VR sensor produces no voltage (V RS = 0) the pin is biased to the voltage developed by I1 x ( R RS ). When the diagnostic pin is at (normal mode) the voltage is compared by COMP1 to the voltage at the pin developed by I2 x plus or minus V HYS. When the diagnostic pin is at V CC (diagnostic mode) the voltage is compared to the voltage developed by (I2 I3) x plus V HYS. From the comparator s viewpoint, these voltages are respectively V P and V N, as shown by the labels in the block diagram at the comparator s inputs, P and N. When V N > V P, the comparator output will be low, transistor N1 will be off and will be V CC. When V N < V P, the comparator output will be high, transistor N1 will be on and will be. V CC 20 k I1 (11 A) I2 (11 A) I3 (6.05 A) IO 1 VR SENSOR V RS R RS D1 INP1 ACTIVE CLAMP P N V HYS ( 160 mv) - COMP1 TO COMP2 N1 Figure 1. Block Diagram Semiconductor Components Industries, LLC, 2012 May, 2012 Rev. 1 1 Publication Order Number: AND8149/D

The polarity of V HYS is controlled by the input states of COMP1. When V < V, V HYS has the polarity shown in Figure 2A. When V > V, V HYS has the polarity shown in Figure 2B. A P N V HYS - V V B P N V HYS - V V Figure 2. Hysteresis Voltage States In the normal mode, V HYS is alternately added to and subtracted from the bias voltage developed by I2 x. In the diagnostic mode, V HYS is added to the bias voltage developed by (I2 I3) x. The resultant voltages are described in the data sheet variously as V HYS or as the trip point ( TRP) thresholds, nominally specified as 160 mv around the bias voltage developed by and. Figure 3 shows the threshold and bias voltage relationships between V and V HYS for normal and diagnostic modes, and the bias voltage for V INX (V ). TRP V TRP V INX V HYS VHYS NORMAL MODE I2 x I1 x ( R RS ) V HYS (I2 I3) x 800 mv MAX NOSTIC MODE Figure 3. Comparator Bias Points and Thresholds The resistance of R RS should be substantially equal to as prescribed by the data sheet. In the normal mode INP X = and equal resistances at the IN X and pins will establish equal voltage bias points. The voltage produced by the VR sensor alternates around the V INX bias voltage. The V INX V RS voltage (V P ) is compared to the TRP voltage (V N ) produced by the alternating polarity of V HYS around the V bias voltage. The s normal mode input vs. output responses are shown in Figure 4. For clarity, the VR sensor voltage is shown as a triangular wave. TRP V INX TRP V CC V OUTX VN V Figure 4. Input vs. Threshold and Output Responses (Normal Mode) Let s review the circuit basics, using Figure 1. We ll use the component values of R RS = 1.0 k, = 22 k and = 24 k, and we ll use the typical data sheet values: V HYS = 160 mv, INP1 = 11 A, and = K I x INP1, where K I = 1.00 in the normal mode and K I = 1.55 in the diagnostic mode. We ll ignore for the moment. Assume that is zero, that = (normal mode), and that we ve connected a voltage source (V RS ) to. Assume also that and R RS are zero. will then go low when V RS is increased to slightly greater than 160 mv above, and then go high when V RS is decreased to slightly less than 160 mv below. With the pin connected to ( = 0), TRP = V HYS and the trip points are V HYS around. The lowest IN X signal we can detect is V HYS. Next we ll set = 24 k, set R RS = 1.0 k and = 22 k. Using the equivalent R RS resistance of 23 k (R EQ ) and the 11 A INP1 (I1) current, V (with V RS = 0) will be 253 mv (11 A x 23 k ). Since in the normal mode K I = 1.00, the current is 11 A (I2) and V is now 264 mv (11 A x 24 k ). With biased to V, TRP = V V HYS and the trip points are V HYS around V. will change states when V is slightly greater than 424 mv and when V is slightly less than 104 mv (264 mv 160 mv) above. With R EQ nearly the same as and since 253 mv < 264 mv (V < V ), V HYS will be 160 mv (Figure 2) and will be in a high state since 253 mv < 424 mv (V < V V HYS or V P < V N ). With V = 253 mv, will go low when V RS is slightly greater than 171 mv above V, and V HYS will change polarity to 160 mv. When V RS is slightly less than 149 mv below V, will go high and V HYS will change back to 160 mv. In the normal mode, = INP1 and with R EQ, the lowest IN X signal we can detect is (V V INX ) V HYS. VP 2

Now we ll set the V RS voltage to zero volts. When V is compared to V V HYS (the 424 mv trip point), will be in a high state since 253 mv < 424 mv (V P < V N ). If we increase R EQ to slightly above 38.545 k (424 mv/11 A) will go to a low state (V P > V N ). Now we ll set = V CC. Since in the diagnostic mode K I = 1.55, the current at the pin will increase by 55% to 17.05 A (I2 I3) so that the bias voltage is now 409.2 mv (17.05 A x 24 k ) and the trip point is now 569.2 mv (V V HYS ). With V at 424 mv (38.545 k x 11 A) will be in a high state since 424 mv < 569.2 mv (V P < V N ). If we further increase R EQ to slightly above 51.745 k (569.2 mv/11 A) will go to a low state (V P > V N ). These results show that we can expect to diagnose minimum (R DMIN ) and maximum (R DMAX ) resistances respectively at 38.545 k, equivalent to [(1.00 x ) (V HYS /INP X )] and at 51.745 k, equivalent to [(1.55 x ) (V HYS /INP X )] and a resistance change of 51.745 k 38.545 k =13.2 k, equivalent to 0.55 x. Input Clamps There are two clamp points associated with the inputs and. Figure 5 shows the simplified clamp circuitry. The data sheet specifies these points as positive (7.0 V typical) and negative ( 0.30 V typical.) Since VR sensors can easily produce voltages in excess of 120 V peak, the 7.0 V clamp prevents damage to the by keeping these voltages below the breakdown voltage of the manufacturing process for the product. Since the substrate of an integrated circuit must always be at the lowest voltage potential, the 0.30 V clamp prevents turn on of parasitic elements within the IC. IN X D1 7 V V CC N1 300 mv Figure 5. Simplified Input Clamp Circuit Circuit Dynamics Getting predictable behavior from the requires correct power up and pre conditioning of the comparators inputs. Since there is no internal power up control circuitry, this must be managed in the application via the components at the V CC pin and the IN X and pins. Assuming that diagnostics are done at power up, and since V V HYS is the reference to which V INX is compared, we need to establish V before V INX to guarantee predictable behavior. The RC delays imposed by pre conditioning also need to be considered in order to obtain correct diagnostic results. The following sections will show the circuit behavior with and without the presence of a VR sensor and with several circuit modifications. The sensor used with the test circuits is a 680 mh 1.0 k automotive type sensing unit. In all cases the input is held low. Be sure to note the voltage and time scales in the graphs presented. Powering Up The slew rate of the V CC power supply must be slow enough to allow the internal bias currents and voltages to be correctly established. Using the test circuit in Figure 6 we can observe the power up behavior when a step is applied to the V CC pin. R2 24 K C2 0 5 V STEP Figure 6. Test Circuit 1 S1 The graphs of Figures 7 and 8 show the results when a 5.0 V V CC step is applied to Test Circuit 1, with and without a VR sensor. In Figure 7 the V quickly reaches the 1.6 V clamp point despite the capacitor at the pin. Because of the quick rise time of the V CC step, the INP1 current is not yet well controlled (>>11 A.) Figure 8 shows that when a VR sensor is present, V still quickly approaches the 1.6 V clamp, then decays to the level defined by INP1 x ( R RS ). The decay rate ( ) is established by x ( R RS ). Note that in both graphs V is established before V (our reference node) and remains low. 3

Figure 7. Sensor Absent Experiment has shown that proper operation results with a V CC slew rate of about 1.0 V/ s, so limiting the slew rate to 0.5 V/ s adds sufficient margin. If the bulk filter capacitance in the application s 5.0 V regulator circuit isn t large enough to keep the slew rate to 0.5 V/ s, a simple RC network added to the V CC pin can do the trick. A V CC bypass capacitor is recommended in any event. Figure 9 shows the R SLEW C SLEW arrangement. R2 24 K C2 0 5 V STEP R SLEW 39 C SLEW 220 nf S1 Figure 8. Sensor Present The data sheet specifies 5.0 ma maximum operating current, so choosing R SLEW = 39 would produce about a 200 mv drop at the V CC pin. Recalling that an exponential response is linear over the range of t = 0 to t = 0.6, set t/ = 0.6 and solve for V t : V t = [5.0 V 0.2 V] x [1 e 0.6 ] = 2.16 V. Given the 0.5 V/ s requirement, the time needed to reach 2.16 V is: 2.16 V/(0.5 V/ s) = 4.32 s. Since this time represents t/ = 0.6, we solve that = t/0.6: 4.32 s/0.6 = 7.2 s. Lastly we find C SLEW = /R SLEW = 185 nf and choose the next highest standard value, 220 nf. Note that the choice for R SLEW only accounted for the voltage drop produced during power up and did not consider additional dynamic currents during output switching or activation of the negative IN X clamps, each of which will produce additional drops (ripple voltages) at the V CC pin. R SLEW can be decreased and C SLEW increased to reduce ripple voltages. Figure 10 shows that our V CC slew rate is now 0.425 V/ s when a 5.0 V step is applied to Test Circuit 2 (and also reveals the intrinsic start up delay of the s internal circuitry, 130 s for the sample tested.) Figure 9. Test Circuit 2 0.425 V/ s Figure 10. V CC Slew 0.5 V/ s 4

Figures 11 and 12 show the results when a 5.0 V V CC step is applied to Test Circuit 2. Figure 11 shows that the V ramps linearly to the 1.6 V clamp point in about 3.0 ms due to and the now correctly established INP1 current. Since V is already established as V ramps up, initially goes high and then low when V crosses the TRP threshold. Figure 12 shows that when a VR sensor is present, the V rises exponentially to the level defined by INP1 x ( R RS ). Again, the rise rate ( ) is established by x ( R RS ). In both cases V has the expected response when the correctly established INP1 current step is applied to a capacitor (sensor absent) or an RC combination. Figure 11. Sensor Absent Figure 12. Sensor Present Pre Conditioning As described in the data sheet, and provide a low pass filter and, when power up is properly managed, also serve to pre condition the comparator to the correct state by delaying the signal. We could also force V to be quickly established regardless of the external components at the IN X inputs. Adding a capacitor (C3 in Figure 13) between the power supply and pin does the job for both channels. With ( R RS ), choosing C3 = gives nearly equal INX and time constants and settling times under nominal circuit conditions. The benefit of C3 comes with both a risk and a penalty. Power supply noise could be coupled through C3 to and thereby risk modulation of the comparators trip points. The risk could be reduced by using separate a clean supply or by using a voltage reference 1.6 V (the clamp voltage.) Of course, we d have to be certain that these alternate voltages are established before the s V CC voltage. The penalty is the delay that results from the x C 3 time constant,. We need to wait several time constants at power up and when changing from the normal mode to the diagnostic mode before sampling OUT X. R2 24 K C2 0 5 V STEP C3 R SLEW 39 Figure 13. Test Circuit 3 C SLEW 220 nf S1 Figures 14 and 15 show the results when a 5.0 V V CC step is applied to Test Circuit 3. Both figures show the effect of C3 on V. Since C3 initially appears as a short circuit, V is quickly brought to the power supply voltage, then decays to the bias point defined by x. The decay rate ( ) is established x C3. Again, in both cases V has the expected responses. 5

Figure 14. Sensor Absent Diagnostic Operation Now that we ve examined the circuit basics and the power up and pre conditioning requirements, we can examine how to interpret the s outputs at power up and when changing modes. We can also see the impact of the component choices and how the resulting delays ( INX and ) imposed affect diagnostics. Each input circuit consists of a VR sensor, series resistor, and filter capacitor. While equation 13 in the data sheet shows how to determine the quality of the VR sensor resistance R RS, the quality of the entire input circuit can be assessed by including the series resistor with R RS : R RS R X = [(INP X x K I x ) V HYS ]/INP X. A shorted sensor or shorted filter capacitor can be diagnosed if no change in the output occurs during normal operation ( = ) when it is expected that the VR sensor should produce an output voltage greater than (V V INX ) V HYS. An open sensor or series resistor (Figures 11 and 14) can be diagnosed at power up ( = ) after the delay that results from and, since CV/I = t, after the delay (t INX ) that results from C X, V CLAMPX, and INP X. V eventually reaches the 1.6 V clamp voltage and V will eventually settle to x I NADJ. While Figures 12 and 15 show that does not change state after both V and V have settled, it is necessary to wait until after the delays before changing the state of the input to guarantee valid results. Setting = V CC then will not Figure 15. Sensor Present change the output state since V INX >> (V V HYS ) before changing the state of the diagnostic input. A normal input circuit (Figures 12 and 15) can be diagnosed at power up ( = ) after the INX delay and after the delay. Figures 12 and 15 also show that does not change state after both V and V have settled, it is again necessary to wait before changing the state of the input. Setting = V CC then will not change the output state since V is already below V before changing the state of the diagnostic input. So how does setting = V CC give us any additional information? When the input circuit resistances change enough to cause V INX to be greater than V V HYS, OUT X will go low. When =, this will occur when (R X R RS ) is just slightly greater than R DMIN =[(1.00 x ) (V HYS /INP X )]. When = V CC, this will occur when (R X R RS ) is just slightly greater than R DMAX = [(1.55 x ) (V HYS /INP X )]. We ve seen, after correct power up and pre conditioning, that OUT X will go high and remain high if the input circuit is good and that OUT X will go low and remain low if the input circuit is bad. If OUT X is low after power up, then is switched to V CC, OUT X will go high if R DMIN = ( R RS ) R DMAX. So two samples of OUT X are needed to know the quality of the input circuit: one after power up and one after changing from low to high. Table 1 summarizes diagnostic behavior. Table 1. Diagnostic Behavior OUT X After Power Up OUT X After Circuit Quality H L H H GOOD L L H L H R DMIN ( R RS ) R DMAX L L H L BAD 6

The worst case delays for sampling OUT X occur where R RS is just at R DMIN when V IN = V V HYS. For the Test Circuit 2 case in Figure 9, we need to wait several R DMIN x time constants after power up for V INX to settle before sampling OUT X. If we wait the typical 5, V INX will be near 99.4% of V V HYS. We now only need to wait for the mode change delay time specified in the data sheet (20 s max.) after changing from low to high before again sampling OUT X. For the Test Circuit 3 case in Figure 13, we need to wait the longer of several R DMIN x or time constants after power up for V INX or V to settle before sampling OUT X. If we wait the typical 5, V INX will be near 99.4% of V V HYS (or vice versa.) Since the I NADJ current will have a step change of 55% typical when changing from normal mode to diagnostic mode, we need to wait an additional 5 after changing from low to high before again sampling OUT X. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303 675 2175 or 800 344 3860 Toll Free USA/Canada Fax: 303 675 2176 or 800 344 3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800 282 9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81 3 5817 1050 7 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative AND8149/D